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GD25LQ16CSIGR

FLASH - NOR 存储器 IC 16Mb(2M x 8) SPI - 四 I/O 104 MHz 8-SOP

产品类别:半导体    存储器   

制造商:兆易创新(GigaDevice)

官网地址:http://www.gigadevice.com

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GD25LQ16CSIGR概述
GD25LQ16CSIGR(16M-bit)串行闪存支持标准串行外围接口(Serial Peripheral Interface, SPI),支持双/四路SPI:串行时钟,芯片选择,串行数据I/O0 (SI), I/O1 (SO), I/O2 (WP#), I/O3 (HOLD#)。双I/O数据传输速度为208Mbits/s,四I/O和四输出数据传输速度为416Mbits/s。

特点
16M位串行闪存
2048K字节
每个可编程页面256字节
标准二重的四路SPI-标准:SCLK,CS#,SO.WP#,HOLD#-标准:SLK,CS#,SO.WF#,HOLD#-双路:SCLK、CS#,,WP#,HOLDI#-四路:SCLK。CS#。102
高速时钟频率104MHz,用于30PF负载的快速读取-双/输出数据传输高达208Mbit/s-四/输出数据传送高达416Mbit/s
允许(就地执行)操作-带8/16/32/64字节换行的连续读取
软件/硬件Wnte保护-通过软件写入保护/部分内存-使用WP#引脚启用/禁用保护-顶部/底部块保护
最少100000个编程/擦除周期
GD25LQ16CSIGR规格参数
参数名称
属性值
类别
半导体;存储器
厂商名称
兆易创新(GigaDevice)
包装
卷带(TR)剪切带(CT)
存储器类型
非易失
存储器格式
闪存
技术
FLASH - NOR
存储容量
16Mb
存储器组织
2M x 8
存储器接口
SPI - 四 I/O
时钟频率
104 MHz
写周期时间 - 字,页
50µs,2.4ms
电压 - 供电
1.65V ~ 2.1V
工作温度
-40°C ~ 85°C(TA)
安装类型
表面贴装型
封装/外壳
8-SOIC(0.209",5.30mm 宽)
供应商器件封装
8-SOP
基本产品编号
GD25LQ16
GD25LQ16CSIGR文档预览
1.8V Uniform Sector
Dual and Quad Serial Flash
GD25LQ16C
GD25LQ16C
DATASHEET
1
1.8V Uniform Sector
Dual and Quad Serial Flash
GD25LQ16C
Contents
1
2
3
4
5
6
7
FEATURES
.........................................................................................................................................................4
GENERAL DESCRIPTION
................................................................................................................................5
MEMORY ORGANIZATION
...............................................................................................................................7
DEVICE OPERATION
........................................................................................................................................8
DATA PROTECTION
..........................................................................................................................................9
STATUS REGISTER.........................................................................................................................................
11
COMMANDS DESCRIPTION
.......................................................................................................................... 13
7.1
7.2
7.3
7.4
7.5
7.6
7.7
7.8
7.9
7.10
7.11
7.12
7.13
7.14
7.15
7.16
7.17
7.18
7.19
7.20
7.21
7.22
7.23
7.24
7.25
7.26
7.27
7.28
7.29
7.30
W
RITE
E
NABLE
(WREN) (06H) ................................................................................................................................ 16
W
RITE
D
ISABLE
(WRDI) (04H) ................................................................................................................................ 16
W
RITE
E
NABLE FOR
V
OLATILE
S
TATUS
R
EGISTER
(50H) ................................................................................................. 17
R
EAD
S
TATUS
R
EGISTER
(RDSR) (05H
OR
35H) .......................................................................................................... 17
W
RITE
S
TATUS
R
EGISTER
(WRSR) (01H) ................................................................................................................... 18
R
EAD
D
ATA
B
YTES
(READ) (03H) ............................................................................................................................ 19
R
EAD
D
ATA
B
YTES AT
H
IGHER
S
PEED
(F
AST
R
EAD
) (0BH) .............................................................................................. 19
D
UAL
O
UTPUT
F
AST
R
EAD
(3BH) .............................................................................................................................. 20
Q
UAD
O
UTPUT
F
AST
R
EAD
(6BH) ............................................................................................................................. 21
D
UAL
I/O F
AST
R
EAD
(BBH) .................................................................................................................................... 21
Q
UAD
I/O F
AST
R
EAD
(EBH) ................................................................................................................................... 23
S
ET
B
URST WITH
W
RAP
(77H) ................................................................................................................................. 24
P
AGE
P
ROGRAM
(PP) (02H) .................................................................................................................................... 25
Q
UAD
P
AGE
P
ROGRAM
(32H) .................................................................................................................................. 26
S
ECTOR
E
RASE
(SE) (20H) ....................................................................................................................................... 27
32KB B
LOCK
E
RASE
(BE) (52H) ............................................................................................................................... 27
64KB B
LOCK
E
RASE
(BE) (D8H)............................................................................................................................... 28
C
HIP
E
RASE
(CE) (60/C7H) ..................................................................................................................................... 28
E
NABLE
/D
ISABLE
SO
TO
O
UTPUT
RY/BY# (ESRY/DSRY) (70H/80H) ........................................................................... 29
D
EEP
P
OWER
-D
OWN
(DP) (B9H) ............................................................................................................................. 30
R
ELEASE FROM
D
EEP
P
OWER
-D
OWN AND
R
EAD
D
EVICE
ID (RDI) (ABH) ......................................................................... 31
R
EAD
M
ANUFACTURE
I
D
/ D
EVICE
I
D
(REMS) (90H) .................................................................................................... 32
R
EAD
M
ANUFACTURE
ID/ D
EVICE
ID D
UAL
I/O (92H) ................................................................................................. 33
R
EAD
M
ANUFACTURE
ID/ D
EVICE
ID Q
UAD
I/O (94H) ................................................................................................ 34
R
EAD
I
DENTIFICATION
(RDID) (9FH) ......................................................................................................................... 35
P
ROGRAM
/E
RASE
S
USPEND
(PES) (75H) ................................................................................................................... 36
P
ROGRAM
/E
RASE
R
ESUME
(PER) (7AH) ................................................................................................................... 36
R
EAD
U
NIQUE
ID (4BH) .......................................................................................................................................... 37
E
RASE
S
ECURITY
R
EGISTERS
(44H) ............................................................................................................................ 37
P
ROGRAM
S
ECURITY
R
EGISTERS
(42H) ....................................................................................................................... 38
2
1.8V Uniform Sector
Dual and Quad Serial Flash
7.31
7.32
7.33
8
GD25LQ16C
R
EAD
S
ECURITY
R
EGISTERS
(48H) ............................................................................................................................. 39
E
NABLE
R
ESET
(66H)
AND
R
ESET
(99H) ..................................................................................................................... 40
R
EAD
S
ERIAL
F
LASH
D
ISCOVERABLE
P
ARAMETER
(5AH)................................................................................................. 40
ELECTRICAL CHARACTERISTICS
.............................................................................................................. 45
8.1
8.2
8.3
8.4
8.5
8.6
POWER-ON TIMING ........................................................................................................................................... 45
I
NITIAL
D
ELIVERY
S
TATE
........................................................................................................................................... 45
A
BSOLUTE
M
AXIMUM
R
ATINGS
................................................................................................................................ 45
C
APACITANCE
M
EASUREMENT
C
ONDITIONS
................................................................................................................ 46
DC CHARACTERISTICS ........................................................................................................................................ 47
AC CHARACTERISTICS ......................................................................................................................................... 50
9
ORDERING INFORMATION
............................................................................................................................ 57
9.1
V
ALID
P
ART
N
UMBERS
............................................................................................................................................ 58
PACKAGE INFORMATION
......................................................................................................................... 60
P
ACKAGE
SOP8 150MIL ........................................................................................................................................ 60
P
ACKAGE
SOP8 208MIL ........................................................................................................................................ 61
P
ACKAGE
VSOP8 150MIL ...................................................................................................................................... 62
P
ACKAGE
VSOP8 208MIL ...................................................................................................................................... 63
P
ACKAGE
USON8 (3*3
MM
) ................................................................................................................................... 64
P
ACKAGE
USON8 (3*4
MM
) ................................................................................................................................... 65
P
ACKAGE
USON8 (4*4
MM
, 0.45
THICKNESS
) ............................................................................................................ 66
P
ACKAGE
WSON8 (6*5
MM
) .................................................................................................................................. 67
P
ACKAGE
LGA8 3*2
MM
......................................................................................................................................... 68
10
10.1
10.2
10.3
10.4
10.5
10.6
10.7
10.8
10.9
10.10 P
ACKAGE
WLCSP .................................................................................................................................................. 69
11
REVISION HISTORY
.................................................................................................................................... 70
3
1.8V Uniform Sector
Dual and Quad Serial Flash
1 FEATURES
GD25LQ16C
16M-bit Serial Flash
-2048K-byte
-256 bytes per programmable page
Fast Program/Erase Speed
-Page Program time: 0.7ms typical
-Sector Erase time: 40ms typical
-Block Erase time: 0.15/0.18s typical
Standard, Dual, Quad SPI
-Standard SPI: SCLK, CS#, SI, SO, WP#, HOLD#
-Dual SPI: SCLK, CS#, IO0, IO1, WP#, HOLD#
-Quad SPI: SCLK, CS#, IO0, IO1, IO2, IO3
-Chip Erase time: 5s typical
Flexible Architecture
-Uniform Sector of 4K-byte
-Uniform Block of 32/64K-byte
High Speed Clock Frequency
-104MHz for fast read with 30PF load
-Dual I/O Data transfer up to 208Mbits/s
-Quad I/O Data transfer up to 416Mbits/s
-Erase/Program Suspend/Resume
Low Power Consumption
-9uA typical stand-by current
-1uA typical power down current
Allows XIP(execute in place) Operation
-Continuous Read With 8/16/32/64-byte Wrap
Advanced security Features
-128-bit Unique ID for each device
Software/Hardware Write Protection
-Write protect all/portion of memory via software
-Enable/Disable protection with WP# Pin
-Top/Bottom Block protection
-3x512-Byte Security Registers With OTP Lock
Single Power Supply Voltage
-Full voltage range: 1.65~2.1V
Minimum 100,000 Program/Erase Cycles
Data retention
-20-year data retention typical
4
1.8V Uniform Sector
Dual and Quad Serial Flash
2 GENERAL DESCRIPTION
GD25LQ16C
The GD25LQ16C (16M-bit) Serial flash supports the standard Serial Peripheral Interface (SPI), and supports the
Dual/Quad SPI: Serial Clock, Chip Select, Serial Data I/O0 (SI), I/O1 (SO), I/O2 (WP#), and I/O3 (HOLD#). The Dual I/O
data is transferred with speed of 208Mbits/s, the Quad I/O & Quad output data is transferred with speed of 416Mbits/s.
CONNECTION DIAGRAM
CS#
SO
(IO1)
WP#
(IO2)
VSS
1
2
Top View
3
4
8
7
6
5
VCC
HOLD#
(IO3)
SCLK
SI
(IO0)
CS#
SO
(IO1)
WP#
(IO2)
VSS
1
2
Top View
3
4
8
7
6
5
8–LEAD WSON/USON/LGA
VCC
HOLD#
(IO3)
SCLK
SI
(IO0)
8–LEAD VSOP/SOP
TOP VIEW
BOTTEOM VIEW
A1
VC C
A2
CS#
A2
CS#
A1
VCC
B1
HOLD#/
IO3
B2
SO/IO1
B2
SO/IO1
B1
HOLD#/
IO3
C1
SCLK
C2
WP#/
IO2
C2
WP#/
IO2
C1
SCLK
D1
SI/IO0
D2
VSS
D2
VSS
D1
SI/IO0
WLCSP
PIN DESCRIPTION
Pin Name
CS#
SO (IO1)
WP# (IO2)
VSS
SI (IO0)
SCLK
HOLD# (IO3)
VCC
Ball Name
A2
B2
C2
D2
D1
C1
B1
A1
I/O
I
I/O
I/O
I
I/O
I/O
Description
Chip Select Input
Data Output (Data Input Output 1)
Write Protect Input (Data Input Output 2)
Ground
Data Input (Data Input Output 0)
Serial Clock Input
Hold Input (Data Input Output 3)
Power Supply
Note: CS# must be driven high if chip is not selected. Please don’t leave CS# floating any time after power is on.
5
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GD25LQ16CSIGR 引脚图/封装图

GD25LQ16CSIGR 相似产品对比
型号 GD25LQ16CSIGR GD25LQ16CTIG GD25LQ16CNIGR
描述 FLASH - NOR 存储器 IC 16Mb(2M x 8) SPI - 四 I/O 104 MHz 8-SOP FLASH - NOR 存储器 IC 16Mb(2M x 8) SPI - 四 I/O 104 MHz 8-SOP FLASH - NOR 存储器 IC 16Mb(2M x 8) SPI - 四 I/O 104 MHz 8-USON(4x3)
类别 半导体;存储器 半导体;存储器 半导体;存储器
厂商名称 兆易创新(GigaDevice) 兆易创新(GigaDevice) 兆易创新(GigaDevice)
包装 卷带(TR)剪切带(CT) 管件 卷带(TR)剪切带(CT)
存储器类型 非易失 非易失 非易失
存储器格式 闪存 闪存 闪存
技术 FLASH - NOR FLASH - NOR FLASH - NOR
存储容量 16Mb 16Mb 16Mb(2M x 8)
存储器接口 SPI - 四 I/O SPI - 四 I/O SPI - 四 I/O
时钟频率 104 MHz 104 MHz 104 MHz
写周期时间 - 字,页 50µs,2.4ms 50µs,2.4ms 50µs,2.4ms
电压 - 供电 1.65V ~ 2.1V 1.65V ~ 2.1V 1.65V ~ 2.1V
工作温度 -40°C ~ 85°C(TA) -40°C ~ 85°C(TA) -40°C ~ 85°C(TA)
安装类型 表面贴装型 表面贴装型 表面贴装型
封装/外壳 8-SOIC(0.209",5.30mm 宽) 8-SOIC(0.154",3.90mm 宽) 8-UDFN 裸露焊盘
供应商器件封装 8-SOP 8-SOP 8-USON(4x3)
基本产品编号 GD25LQ16 GD25LQ16 GD25LQ16
存储器组织 2M x 8 2M x 8 -
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