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MLX90393 Triaxis® Magnetic Node

Datasheet

1. Features and Benefits



Absolute Position Sensor IC featuring

Triaxis® Hall Technology

Simple & Robust Magnetic Design

Miniature size for tiny assemblies

Selectable SPI and I

C bus protocols

Wide dynamic range (5-50mT) with on-the-

fly programmable gain

2.2V-3.6V supply for battery powered

applications, down to 1.8V IO voltage

On board filter settings

On the fly programmable operating modes

and sleep times for micro-power use

External and internal acquisition triggering

modes

External interrupt pin when the field

changes

On board temperature sensor

3. Description

The MLX90393 brings the highest flexibility in the

Triaxis portfolio's smallest packaged assembly.

Additionally, the MLX90393 is designed for

micropower applications, with programmable

duty cycles in the range of 0.1% to 100% allowing

for configurable power consumption based on

system requirements.

The MLX90393 magnetic field sensor can be

reprogrammed to different modes and with

different settings at run-time to fine-tune the

performance and power consumed. The sensor

offers a 16-bit output proportional to the

magnetic flux density sensed along the X, Y, and Z

axes using the Melexis proprietary Triaxis

technology and offers a 16-bit temperature

output signal. These digital values are available via

C and SPI, where the MLX90393 is a slave on the

bus. Multiple sensors can be connected to the

same bus, by A

and A

hardwired connection (4x)

but also through ordering codes with different SW

address (4x).

By selecting which axes are to be measured, the

raw data can be used as input for further post-

processing, such as for joystick applications,

rotary knobs, and more complex 3D position

sensing applications. Unparalleled performance is

achieved with this sensor, which is primarily

targeting industrial and consumer applications.

2. Application Examples



Non-contacting HMI applications with

push-pull functionality



Rotary knobs & dials

(Long stroke) Linear motion in one or

two axes for levers & sliding switches

Joystick (gimbal or ball & socket)

Temp Sensor

Bias

DD_IO

State Machine

RAM

EEPROM

SDA/ MOSI

SCL/ SCLK

MISO

MS/ CS

Interrupt

Trigger

MUX

Tria xis

ADC

Control

SPI/ I2C

Interface

Temp Compensation

Oscillator

Low Power

Oscillator

Wake-Up

Home Security 3D closure detection

Accurate liquid level sensing

Factory automation position sensing

Magnetic fingerprint detection

Figure 1: General Block Diagram

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Datasheet

Contents

1. Features and Benefits ............................................................................................................................... 1

2. Application Examples................................................................................................................................ 1

3. Description ............................................................................................................................................... 1

4. Ordering Information ............................................................................................................................... 5

5. Functional Diagram .................................................................................................................................. 6

5.1. QFN-16 Block Diagram ..................................................................................................................... 6

5.2. UTDFN-8 Block Diagram................................................................................................................... 6

6. Glossary of Terms ..................................................................................................................................... 7

7. QFN-16 Pinout .......................................................................................................................................... 8

8. UTDFN-8 Pinout ........................................................................................................................................ 9

9. Absolute Maximum Ratings .................................................................................................................... 10

10. General Electrical Specifications........................................................................................................... 11

11. Thermal Specification ........................................................................................................................... 12

12. Timing Specification ............................................................................................................................. 13

13. Magnetic Specification ......................................................................................................................... 14

13.1. Noise vs Conversion Time ............................................................................................................ 16

14. Mode Selection..................................................................................................................................... 17

14.1. Burst mode ................................................................................................................................... 18

14.2. Single Measurement mode ......................................................................................................... 18

14.3. Wake-Up on Change mode.......................................................................................................... 19

15. Digital Specification .............................................................................................................................. 19

15.1. Command List .............................................................................................................................. 20

15.2. Status Byte ................................................................................................................................... 21

15.3. SPI Communication ...................................................................................................................... 22

15.3.1. Command implementation.................................................................................................... 22

15.3.2. SPI Timing Specification ......................................................................................................... 24

15.4. I

C Communication ...................................................................................................................... 24

15.4.1. Command Implementation.................................................................................................... 25

15.4.2. I

C Timing Specification ......................................................................................................... 27

16. Memory Map ........................................................................................................................................ 28

16.1. General Description ..................................................................................................................... 28

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16.2. Parameter Description ................................................................................................................. 30

16.2.1. ANA_RESERVED_LOW............................................................................................................ 31

16.2.2. BIST ......................................................................................................................................... 31

16.2.3. Z_Series .................................................................................................................................. 31

16.2.4. GAIN_SEL[2:0] ........................................................................................................................ 32

16.2.5. HALLCONF[3:0]....................................................................................................................... 33

16.2.6. TRIG_INT_SEL ......................................................................................................................... 33

16.2.7. COMM_MODE[1:0] ................................................................................................................ 33

16.2.8. WOC_DIFF .............................................................................................................................. 33

16.2.9. EXT_TRIG ................................................................................................................................ 34

16.2.10. TCMP_EN ............................................................................................................................. 34

16.2.11. BURST_SEL[3:0] .................................................................................................................... 34

16.2.12. OSR2[1:0] ............................................................................................................................. 34

16.2.13. RES_XYZ[5:0] ........................................................................................................................ 34

16.2.14. DIG_FILT[1:0] ....................................................................................................................... 34

16.2.15. OSR[1:0] ............................................................................................................................... 34

16.2.16. SENS_TC_HT[7:0] ................................................................................................................. 34

16.2.17. SENS_TC_LT[7:0] .................................................................................................................. 35

16.2.18. OFFSET_i[15:0] ..................................................................................................................... 35

16.2.19. WOi_THRESHOLD[15:0] ....................................................................................................... 35

17. Recommended Application Diagram .................................................................................................... 36

1.1 I

C .................................................................................................................................................... 36

1.2 SPI .................................................................................................................................................... 36

18. Packaging Specification ........................................................................................................................ 37

18.1. QFN-16 ......................................................................................................................................... 37

18.1.1. Package dimensions and sensitive spot location .................................................................. 37

18.1.2. QFN-16 - Pinout and Marking ................................................................................................ 38

18.2. UDTFN-8 package......................................................................................................................... 39

18.2.1. Package dimensions and sensitive spot location .................................................................. 39

18.2.2. UTDFN-8 - Pinout and Marking.............................................................................................. 40

19. Standard Information ........................................................................................................................... 40

20. ESD Precautions.................................................................................................................................... 40

21. Revision History .................................................................................................................................... 41

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22. Contact ................................................................................................................................................. 42

23. Disclaimer ............................................................................................................................................. 43

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4. Ordering Information

Product

MLX90393

Temperature

S (-20°C to 85°C)

E (-40°C to 85°C)

S (-20°C to 85°C)

Package Option Code

ABA-011

ABA-012

ABA-013

ABA-014

ABA-011

ABA-012

ABA-013

ABA-014

ABA-011

Packing Form Definition

C address = 00011xx

C address = 00100xx

C address = 00101xx

C address = 00110xx

C address = 00011xx

C address = 00100xx

C address = 00101xx

C address = 00110xx

C address = 0010000

Table 1: Product Ordering Codes

Legend:

Temperature Code:

S: from -20°C to 85°C

E: from -40°C to 85°C

Package Code:

“LW” for QFN-16 3x3x1mm package with wettable flanks

“LQ” for UTDFN-8 2.5x2mm package

Option Code:

ABA-011:

ABA-012:

ABA-013:

ABA-014:

Different I

C addresses – 5 most significant bits. The 2 least significant bits of the

address are defined by the external address pins A

and A

Packing Form:

Ordering Example:

“RE for Reel”

“MLX90393-ELW-ABA-011-RE”

MLX90393 Micropower magnetometer with I

C address 00011xx where the last

two bits are defined by external address pins A

and A

. In QFN package,

temperature range -40°C to 85°C.

Table 2: Product Ordering Code Example

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