5962H9656901QXA,5962H9656901QXA pdf中文资料,5962H9656901QXA引脚图,5962H9656901QXA电路-Datasheet-电子工程世界

器件参数

参数名称

属性值

包装说明

DFP, FL20,.3

Reach Compliance Code

unknown

ECCN代码

3A001.A.1.A

控制类型

ENABLE LOW

系列

ACT

JESD-30 代码

R-XDFP-F20

JESD-609代码

负载电容（CL）

50 pF

逻辑集成电路类型

BUS DRIVER

最大I（ol）

0.012 A

位数

功能数量

端口数量

端子数量

最高工作温度

125 °C

最低工作温度

-55 °C

输出特性

3-STATE

输出极性

INVERTED

封装主体材料

CERAMIC, METAL-SEALED COFIRED

封装代码

DFP

封装等效代码

FL20,.3

封装形状

RECTANGULAR

封装形式

FLATPACK

电源

5 V

Prop。Delay @ Nom-Sup

13 ns

传播延迟（tpd）

13 ns

认证状态

Qualified

筛选级别

38535Q/M;38534H;883B

座面最大高度

2.921 mm

最大供电电压 (Vsup)

5.5 V

最小供电电压 (Vsup)

4.5 V

标称供电电压 (Vsup)

5 V

表面贴装

YES

技术

CMOS

温度等级

MILITARY

端子面层

TIN LEAD

端子形式

FLAT

端子节距

1.27 mm

端子位置

DUAL

总剂量

1M Rad(Si) V

宽度

6.9215 mm

Base Number Matches

参数对比

与5962H9656901QXA相近的元器件有：5962H9656901QRC、5962H9656901VRC、5962H9656901QXC、5962H9656901VXA、5962H9656901QRA、5962H9656901VXC、5962H9656901VRA、5962H9656901Q9A。描述及对比如下：

型号	5962H9656901QXA	5962H9656901QRC	5962H9656901VRC	5962H9656901QXC	5962H9656901VXA	5962H9656901QRA	5962H9656901VXC	5962H9656901VRA	5962H9656901Q9A
描述	Bus Driver, ACT Series, 2-Func, 4-Bit, Inverted Output, CMOS, CDFP20, BOTTOM BRAZED, CERAMIC, FP-20	Bus Driver, ACT Series, 2-Func, 4-Bit, Inverted Output, CMOS, CDIP20, SIDE BRAZED, CERAMIC, DIP-20	Bus Driver, ACT Series, 2-Func, 4-Bit, Inverted Output, CMOS, CDIP20, SIDE BRAZED, CERAMIC, DIP-20	Bus Driver, ACT Series, 2-Func, 4-Bit, Inverted Output, CMOS, CDFP20, BOTTOM BRAZED, CERAMIC, FP-20	Bus Driver, ACT Series, 2-Func, 4-Bit, Inverted Output, CMOS, CDFP20, BOTTOM BRAZED, CERAMIC, FP-20	Bus Driver, ACT Series, 2-Func, 4-Bit, Inverted Output, CMOS, CDIP20, SIDE BRAZED, CERAMIC, DIP-20	Bus Driver, ACT Series, 2-Func, 4-Bit, Inverted Output, CMOS, CDFP20, BOTTOM BRAZED, CERAMIC, FP-20	Bus Driver, ACT Series, 2-Func, 4-Bit, Inverted Output, CMOS, CDIP20, SIDE BRAZED, CERAMIC, DIP-20	Bus Driver, ACT Series, 2-Func, 8-Bit, Inverted Output, CMOS, DIE-20
包装说明	DFP, FL20,.3	DIP, DIP20,.3	DIP, DIP20,.3	DFP, FL20,.3	DFP, FL20,.3	SIDE BRAZED, CERAMIC, DIP-20	BOTTOM BRAZED, CERAMIC, FP-20	SIDE BRAZED, CERAMIC, DIP-20	DIE, DIE OR CHIP
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
ECCN代码	3A001.A.1.A	3A001.A.1.A	3A001.A.1.A	3A001.A.1.A	3A001.A.1.A	3A001.A.1.A	3A001.A.1.A	3A001.A.1.A	3A001.A.1.A
控制类型	ENABLE LOW	ENABLE LOW	ENABLE LOW	ENABLE LOW	ENABLE LOW	ENABLE LOW	ENABLE LOW	ENABLE LOW	ENABLE LOW
系列	ACT	ACT	ACT	ACT	ACT	ACT	ACT	ACT	ACT
JESD-30 代码	R-XDFP-F20	R-XDIP-T20	R-XDIP-T20	R-XDFP-F20	R-XDFP-F20	R-XDIP-T20	R-XDFP-F20	R-XDIP-T20	R-XUUC-N20
负载电容（CL）	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF
逻辑集成电路类型	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER
最大I（ol）	0.012 A	0.012 A	0.012 A	0.012 A	0.012 A	0.012 A	0.012 A	0.012 A	0.012 A
位数	4	4	4	4	4	4	4	4	8
功能数量	2	2	2	2	2	2	2	2	2
端口数量	2	2	2	2	2	2	2	2	2
端子数量	20	20	20	20	20	20	20	20	20
最高工作温度	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C
最低工作温度	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C
输出特性	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
输出极性	INVERTED	INVERTED	INVERTED	INVERTED	INVERTED	INVERTED	INVERTED	INVERTED	INVERTED
封装主体材料	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	UNSPECIFIED
封装代码	DFP	DIP	DIP	DFP	DFP	DIP	DFP	DIP	DIE
封装等效代码	FL20,.3	DIP20,.3	DIP20,.3	FL20,.3	FL20,.3	DIP20,.3	FL20,.3	DIP20,.3	DIE OR CHIP
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	FLATPACK	IN-LINE	IN-LINE	FLATPACK	FLATPACK	IN-LINE	FLATPACK	IN-LINE	UNCASED CHIP
电源	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
Prop。Delay @ Nom-Sup	13 ns	13 ns	13 ns	13 ns	13 ns	13 ns	13 ns	13 ns	13 ns
传播延迟（tpd）	13 ns	13 ns	13 ns	13 ns	13 ns	13 ns	13 ns	13 ns	13 ns
认证状态	Qualified	Qualified	Qualified	Qualified	Qualified	Qualified	Qualified	Qualified	Qualified
筛选级别	38535Q/M;38534H;883B	38535Q/M;38534H;883B	38535V;38534K;883S	38535Q/M;38534H;883B	38535V;38534K;883S	38535Q/M;38534H;883B	38535V;38534K;883S	38535V;38534K;883S	MIL-PRF-38535 Class Q
最大供电电压 (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
最小供电电压 (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
标称供电电压 (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
表面贴装	YES	NO	NO	YES	YES	NO	YES	NO	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY
端子形式	FLAT	THROUGH-HOLE	THROUGH-HOLE	FLAT	FLAT	THROUGH-HOLE	FLAT	THROUGH-HOLE	NO LEAD
端子位置	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	UPPER
总剂量	1M Rad(Si) V	1M Rad(Si) V	1M Rad(Si) V	1M Rad(Si) V	1M Rad(Si) V	1M Rad(Si) V	1M Rad(Si) V	1M Rad(Si) V	1M Rad(Si) V
JESD-609代码	e0	e4	e4	e4	e0	e0	e4	e0	-
座面最大高度	2.921 mm	5.08 mm	5.08 mm	2.921 mm	2.921 mm	5.08 mm	2.921 mm	5.08 mm	-
端子面层	TIN LEAD	GOLD	GOLD	GOLD	TIN LEAD	TIN LEAD	GOLD	TIN LEAD	-
端子节距	1.27 mm	2.54 mm	2.54 mm	1.27 mm	1.27 mm	2.54 mm	1.27 mm	2.54 mm	-
宽度	6.9215 mm	7.62 mm	7.62 mm	6.9215 mm	6.9215 mm	7.62 mm	6.9215 mm	7.62 mm	-
Base Number Matches	1	1	1	1	1	1	1	1	-