描述 |
IC BUFF NON-INVERT 5.5V 14DHVQFN |
IC BUFFER NON-INVERT 5.5V 14SO |
IC BUF NON-INVERT 5.5V 14TSSOP |
IC BUFF NON-INVERT 5.5V 14DHVQFN |
IC BUFFER NON-INVERT 5.5V 14SO |
IC BUF NON-INVERT 5.5V 14TSSOP |
Brand Name |
Nexperia |
Nexperia |
Nexperia |
Nexperia |
Nexperia |
Nexperia |
是否Rohs认证 |
符合 |
符合 |
符合 |
符合 |
符合 |
符合 |
厂商名称 |
Nexperia |
Nexperia |
Nexperia |
Nexperia |
Nexperia |
Nexperia |
零件包装代码 |
QFN |
SOIC |
TSSOP |
QFN |
SOIC |
TSSOP |
包装说明 |
HVQCCN, |
SOP, |
TSSOP, |
HVQCCN, |
SOP, |
TSSOP, |
针数 |
14 |
14 |
14 |
14 |
14 |
14 |
制造商包装代码 |
SOT762-1 |
SOT108-1 |
SOT402-1 |
SOT762-1 |
SOT108-1 |
SOT402-1 |
Reach Compliance Code |
compliant |
compliant |
compliant |
compliant |
compliant |
compliant |
Samacsys Description |
74AHC(T)126-Q100 - Quad buffer/line driver; 3-state@en-us |
74AHC(T)126-Q100 - Quad buffer/line driver; 3-state@en-us |
74AHC(T)126-Q100 - Quad buffer/line driver; 3-state@en-us |
74AHC(T)126-Q100 - Quad buffer/line driver; 3-state@en-us |
74AHC(T)126-Q100 - Quad buffer/line driver; 3-state@en-us |
74AHC(T)126-Q100 - Quad buffer/line driver; 3-state@en-us |
系列 |
AHC/VHC/H/U/V |
AHC/VHC/H/U/V |
AHCT/VHCT/VT |
AHCT/VHCT/VT |
AHCT/VHCT/VT |
AHC/VHC/H/U/V |
JESD-30 代码 |
R-PQCC-N14 |
R-PDSO-G14 |
R-PDSO-G14 |
R-PQCC-N14 |
R-PDSO-G14 |
R-PDSO-G14 |
JESD-609代码 |
e4 |
e4 |
e4 |
e4 |
e4 |
e4 |
长度 |
3 mm |
8.65 mm |
5 mm |
3 mm |
8.65 mm |
5 mm |
逻辑集成电路类型 |
BUS DRIVER |
BUS DRIVER |
BUS DRIVER |
BUS DRIVER |
BUS DRIVER |
BUS DRIVER |
湿度敏感等级 |
1 |
1 |
1 |
1 |
1 |
1 |
位数 |
1 |
1 |
1 |
1 |
1 |
1 |
功能数量 |
4 |
4 |
4 |
4 |
4 |
4 |
端口数量 |
2 |
2 |
2 |
2 |
2 |
2 |
端子数量 |
14 |
14 |
14 |
14 |
14 |
14 |
最高工作温度 |
125 °C |
125 °C |
125 °C |
125 °C |
125 °C |
125 °C |
最低工作温度 |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
输出特性 |
3-STATE |
3-STATE |
3-STATE |
3-STATE |
3-STATE |
3-STATE |
输出极性 |
TRUE |
TRUE |
TRUE |
TRUE |
TRUE |
TRUE |
封装主体材料 |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
封装代码 |
HVQCCN |
SOP |
TSSOP |
HVQCCN |
SOP |
TSSOP |
封装形状 |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
封装形式 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
SMALL OUTLINE |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
SMALL OUTLINE |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
传播延迟(tpd) |
14.5 ns |
14.5 ns |
9.5 ns |
9.5 ns |
9.5 ns |
14.5 ns |
筛选级别 |
AEC-Q100 |
AEC-Q100 |
AEC-Q100 |
AEC-Q100 |
AEC-Q100 |
AEC-Q100 |
座面最大高度 |
1 mm |
1.75 mm |
1.1 mm |
1 mm |
1.75 mm |
1.1 mm |
最大供电电压 (Vsup) |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
最小供电电压 (Vsup) |
2 V |
2 V |
4.5 V |
4.5 V |
4.5 V |
2 V |
标称供电电压 (Vsup) |
5 V |
5 V |
5 V |
5 V |
5 V |
5 V |
表面贴装 |
YES |
YES |
YES |
YES |
YES |
YES |
技术 |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
温度等级 |
AUTOMOTIVE |
AUTOMOTIVE |
AUTOMOTIVE |
AUTOMOTIVE |
AUTOMOTIVE |
AUTOMOTIVE |
端子面层 |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
端子形式 |
NO LEAD |
GULL WING |
GULL WING |
NO LEAD |
GULL WING |
GULL WING |
端子节距 |
0.5 mm |
1.27 mm |
0.65 mm |
0.5 mm |
1.27 mm |
0.65 mm |
端子位置 |
QUAD |
DUAL |
DUAL |
QUAD |
DUAL |
DUAL |
宽度 |
2.5 mm |
3.9 mm |
4.4 mm |
2.5 mm |
3.9 mm |
4.4 mm |
Base Number Matches |
1 |
1 |
1 |
1 |
1 |
1 |