描述 |
IC BUFFER NON-INVERT 5.5V 20SO |
IC BUFFER NON-INVERT 5.5V 20SO |
IC BUF NON-INVERT 5.5V 20TSSOP |
IC BUF NON-INVERT 5.5V 20TSSOP |
IC BUFF NON-INVERT 5.5V 20DHVQFN |
IC BUFF NON-INVERT 5.5V 20DHVQFN |
Brand Name |
Nexperia |
Nexperia |
Nexperia |
Nexperia |
Nexperia |
Nexperia |
厂商名称 |
Nexperia |
Nexperia |
Nexperia |
Nexperia |
Nexperia |
Nexperia |
零件包装代码 |
SOP |
SOP |
TSSOP2 |
TSSOP2 |
QFN |
QFN |
包装说明 |
SOP, |
SOP, |
TSSOP, |
TSSOP, |
HVQCCN, |
HVQCCN, |
针数 |
20 |
20 |
20 |
20 |
20 |
20 |
制造商包装代码 |
SOT163-1 |
SOT163-1 |
SOT360-1 |
SOT360-1 |
SOT764-1 |
SOT764-1 |
Reach Compliance Code |
compliant |
compliant |
compliant |
compliant |
compliant |
compliant |
Samacsys Description |
74VHC(T)541-Q100 - Octal buffer/line driver; 3-state@en-us |
74VHC(T)541-Q100 - Octal buffer/line driver; 3-state@en-us |
74VHC(T)541-Q100 - Octal buffer/line driver; 3-state@en-us |
74VHC(T)541-Q100 - Octal buffer/line driver; 3-state@en-us |
74VHC(T)541-Q100 - Octal buffer/line driver; 3-state@en-us |
74VHC(T)541-Q100 - Octal buffer/line driver; 3-state@en-us |
系列 |
AHCT/VHCT/VT |
AHC/VHC/H/U/V |
AHC/VHC/H/U/V |
AHCT/VHCT/VT |
AHC/VHC/H/U/V |
AHCT/VHCT/VT |
JESD-30 代码 |
R-PDSO-G20 |
R-PDSO-G20 |
R-PDSO-G20 |
R-PDSO-G20 |
R-PQCC-N20 |
R-PQCC-N20 |
长度 |
12.8 mm |
12.8 mm |
6.5 mm |
6.5 mm |
4.5 mm |
4.5 mm |
逻辑集成电路类型 |
BUS DRIVER |
BUS DRIVER |
BUS DRIVER |
BUS DRIVER |
BUS DRIVER |
BUS DRIVER |
湿度敏感等级 |
1 |
1 |
1 |
1 |
1 |
1 |
位数 |
8 |
8 |
8 |
8 |
8 |
8 |
功能数量 |
1 |
1 |
1 |
1 |
1 |
1 |
端口数量 |
2 |
2 |
2 |
2 |
2 |
2 |
端子数量 |
20 |
20 |
20 |
20 |
20 |
20 |
最高工作温度 |
125 °C |
125 °C |
125 °C |
125 °C |
125 °C |
125 °C |
最低工作温度 |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
输出特性 |
3-STATE |
3-STATE |
3-STATE |
3-STATE |
3-STATE |
3-STATE |
输出极性 |
TRUE |
TRUE |
TRUE |
TRUE |
TRUE |
TRUE |
封装主体材料 |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
封装代码 |
SOP |
SOP |
TSSOP |
TSSOP |
HVQCCN |
HVQCCN |
封装形状 |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
封装形式 |
SMALL OUTLINE |
SMALL OUTLINE |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
峰值回流温度(摄氏度) |
260 |
260 |
260 |
260 |
260 |
260 |
传播延迟(tpd) |
11 ns |
13.5 ns |
13.5 ns |
11 ns |
13.5 ns |
11 ns |
筛选级别 |
AEC-Q100 |
AEC-Q100 |
AEC-Q100 |
AEC-Q100 |
AEC-Q100 |
AEC-Q100 |
座面最大高度 |
2.65 mm |
2.65 mm |
1.1 mm |
1.1 mm |
1 mm |
1 mm |
最大供电电压 (Vsup) |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
最小供电电压 (Vsup) |
4.5 V |
2 V |
2 V |
4.5 V |
2 V |
4.5 V |
标称供电电压 (Vsup) |
5 V |
5 V |
5 V |
5 V |
5 V |
5 V |
表面贴装 |
YES |
YES |
YES |
YES |
YES |
YES |
技术 |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
温度等级 |
AUTOMOTIVE |
AUTOMOTIVE |
AUTOMOTIVE |
AUTOMOTIVE |
AUTOMOTIVE |
AUTOMOTIVE |
端子形式 |
GULL WING |
GULL WING |
GULL WING |
GULL WING |
NO LEAD |
NO LEAD |
端子节距 |
1.27 mm |
1.27 mm |
0.65 mm |
0.65 mm |
0.5 mm |
0.5 mm |
端子位置 |
DUAL |
DUAL |
DUAL |
DUAL |
QUAD |
QUAD |
处于峰值回流温度下的最长时间 |
30 |
30 |
30 |
30 |
30 |
30 |
宽度 |
7.5 mm |
7.5 mm |
4.4 mm |
4.4 mm |
2.5 mm |
2.5 mm |
Base Number Matches |
1 |
1 |
1 |
1 |
1 |
1 |