型号
- 型号
- 关键词
| 型号 | 7MP4104S35Z | 7MP4104S25M | 7MP4104S35M | 7MP4104S20M | 7MP4104S25Z | 7MP4104S20Z |
|---|---|---|---|---|---|---|
| 描述 | SRAM Module, 1MX32, 35ns, CMOS, PZIP80 | SRAM Module, 1MX32, 25ns, CMOS, PSMA80 | SRAM Module, 1MX32, 35ns, CMOS, PSMA80 | SRAM Module, 1MX32, 20ns, CMOS, PSMA80 | SRAM Module, 1MX32, 25ns, CMOS, PZIP80 | SRAM Module, 1MX32, 20ns, CMOS, PZIP80 |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
| 包装说明 | ZIP, ZIP80(UNSPEC) | SIMM, SSIM80 | SIMM, SSIM80 | SIMM, SSIM80 | ZIP, ZIP80(UNSPEC) | ZIP, ZIP80(UNSPEC) |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant |
| 最长访问时间 | 35 ns | 25 ns | 35 ns | 20 ns | 25 ns | 20 ns |
| I/O 类型 | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
| JESD-30 代码 | R-PZIP-T80 | R-PSMA-N80 | R-PSMA-N80 | R-PSMA-N80 | R-PZIP-T80 | R-PZIP-T80 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 |
| 内存密度 | 33554432 bit | 33554432 bit | 33554432 bit | 33554432 bit | 33554432 bit | 33554432 bit |
| 内存集成电路类型 | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE |
| 内存宽度 | 32 | 32 | 32 | 32 | 32 | 32 |
| 端子数量 | 80 | 80 | 80 | 80 | 80 | 80 |
| 字数 | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words |
| 字数代码 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 1MX32 | 1MX32 | 1MX32 | 1MX32 | 1MX32 | 1MX32 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | ZIP | SIMM | SIMM | SIMM | ZIP | ZIP |
| 封装等效代码 | ZIP80(UNSPEC) | SSIM80 | SSIM80 | SSIM80 | ZIP80(UNSPEC) | ZIP80(UNSPEC) |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | IN-LINE | IN-LINE |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 峰值回流温度（摄氏度） | 225 | 225 | 225 | 225 | 225 | 225 |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大待机电流 | 0.08 A | 0.08 A | 0.08 A | 0.08 A | 0.08 A | 0.08 A |
| 最小待机电流 | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 最大压摆率 | 1.2 mA | 1.2 mA | 1.2 mA | 1.2 mA | 1.2 mA | 1.2 mA |
| 表面贴装 | NO | NO | NO | NO | NO | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | NO LEAD | NO LEAD | NO LEAD | THROUGH-HOLE | THROUGH-HOLE |
| 端子位置 | ZIG-ZAG | SINGLE | SINGLE | SINGLE | ZIG-ZAG | ZIG-ZAG |
| 处于峰值回流温度下的最长时间 | 30 | 30 | 30 | 30 | 30 | 30 |