描述 |
TQFP-100, Reel |
TQFP-100, Reel |
TQFP-100, Tray |
TQFP-100, Tray |
Brand Name |
Integrated Device Technology |
Integrated Device Technology |
Integrated Device Technology |
Integrated Device Technology |
是否无铅 |
不含铅 |
不含铅 |
不含铅 |
不含铅 |
是否Rohs认证 |
符合 |
符合 |
符合 |
符合 |
厂商名称 |
IDT (Integrated Device Technology) |
IDT (Integrated Device Technology) |
IDT (Integrated Device Technology) |
IDT (Integrated Device Technology) |
零件包装代码 |
TQFP |
TQFP |
TQFP |
TQFP |
包装说明 |
GREEN TQFP-100 |
QFP, QFP100,.63SQ,20 |
TQFP-100 |
TQFP-100 |
针数 |
100 |
100 |
100 |
100 |
制造商包装代码 |
PNG100 |
EQG100 |
EQG100 |
PNG100 |
Reach Compliance Code |
compliant |
compliant |
compliant |
compliant |
JESD-30 代码 |
S-PQFP-G100 |
S-PQFP-G100 |
S-PQFP-G100 |
S-PQFP-G100 |
JESD-609代码 |
e3 |
e3 |
e3 |
e3 |
湿度敏感等级 |
3 |
3 |
3 |
3 |
端子数量 |
100 |
100 |
100 |
100 |
最高工作温度 |
85 °C |
85 °C |
85 °C |
85 °C |
最低工作温度 |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
封装主体材料 |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
封装代码 |
LFQFP |
QFP |
HLFQFP |
LFQFP |
封装形状 |
SQUARE |
SQUARE |
SQUARE |
SQUARE |
封装形式 |
FLATPACK, LOW PROFILE, FINE PITCH |
FLATPACK |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
FLATPACK, LOW PROFILE, FINE PITCH |
标称供电电压 |
3.3 V |
3.3 V |
3.3 V |
3.3 V |
表面贴装 |
YES |
YES |
YES |
YES |
温度等级 |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
端子面层 |
Matte Tin (Sn) - annealed |
Matte Tin (Sn) - annealed |
Matte Tin (Sn) - annealed |
Matte Tin (Sn) - annealed |
端子形式 |
GULL WING |
GULL WING |
GULL WING |
GULL WING |
端子节距 |
0.5 mm |
0.5 mm |
0.5 mm |
0.5 mm |
端子位置 |
QUAD |
QUAD |
QUAD |
QUAD |
ECCN代码 |
EAR99 |
EAR99 |
EAR99 |
- |
长度 |
14 mm |
- |
14 mm |
14 mm |
功能数量 |
1 |
- |
1 |
1 |
峰值回流温度(摄氏度) |
260 |
- |
260 |
260 |
认证状态 |
Not Qualified |
Not Qualified |
- |
Not Qualified |
座面最大高度 |
1.4 mm |
- |
1.6 mm |
1.4 mm |
电信集成电路类型 |
TELECOM CIRCUIT |
- |
TELECOM CIRCUIT |
TELECOM CIRCUIT |
处于峰值回流温度下的最长时间 |
30 |
- |
NOT SPECIFIED |
30 |
宽度 |
14 mm |
- |
14 mm |
14 mm |