型号
- 型号
- 关键词
Single Channel, 200 to 500ksps, 12-Bit A/D Converter
厂商名称：National Semiconductor（TI ）
厂商官网：http://www.ti.com
下载文档| 型号 | ADC121S051CIMF | ADC121S051CIMFX | ADC121S051CISD | ADC121S051CISDX | ADC121S051EVAL | ADC121S051_06 |
|---|---|---|---|---|---|---|
| 描述 | Single Channel, 200 to 500ksps, 12-Bit A/D Converter | Single Channel, 200 to 500ksps, 12-Bit A/D Converter | Single Channel, 200 to 500ksps, 12-Bit A/D Converter | Single Channel, 200 to 500ksps, 12-Bit A/D Converter | Single Channel, 200 to 500ksps, 12-Bit A/D Converter | Single Channel, 200 to 500ksps, 12-Bit A/D Converter |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | - | - |
| 厂商名称 | National Semiconductor（TI ） | National Semiconductor（TI ） | National Semiconductor（TI ） | National Semiconductor（TI ） | - | - |
| 包装说明 | SOT-23, 6 PIN | SOT-23, 6 PIN | LLP-6 | LLP-6 | - | - |
| Reach Compliance Code | _compli | _compli | _compli | _compli | - | - |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | - | - |
| 最大模拟输入电压 | 5.25 V | 5.25 V | 5.25 V | 5.25 V | - | - |
| 最长转换时间 | 4 µs | 4 µs | 4 µs | 4 µs | - | - |
| 转换器类型 | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | - | - |
| JESD-30 代码 | R-PDSO-G6 | R-PDSO-G6 | R-XDSO-N6 | R-XDSO-N6 | - | - |
| JESD-609代码 | e0 | e0 | e0 | e0 | - | - |
| 长度 | 2.92 mm | 2.92 mm | 2.5 mm | 2.5 mm | - | - |
| 最大线性误差 (EL) | 0.0244% | 0.0244% | 0.0244% | 0.0244% | - | - |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | - | - |
| 模拟输入通道数量 | 1 | 1 | 1 | 1 | - | - |
| 位数 | 12 | 12 | 12 | 12 | - | - |
| 功能数量 | 1 | 1 | 1 | 1 | - | - |
| 端子数量 | 6 | 6 | 6 | 6 | - | - |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | - | - |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | - | - |
| 输出位码 | BINARY | BINARY | BINARY | BINARY | - | - |
| 输出格式 | SERIAL | SERIAL | SERIAL | SERIAL | - | - |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | UNSPECIFIED | UNSPECIFIED | - | - |
| 封装代码 | LSSOP | LSSOP | HVSON | HVSON | - | - |
| 封装等效代码 | TSOP6,.11,37 | TSOP6,.11,37 | SOLCC6,.1,25 | SOLCC6,.1,25 | - | - |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | - |
| 封装形式 | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | - | - |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 | - | - |
| 电源 | 3/5 V | 3/5 V | 3/5 V | 3/5 V | - | - |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | - |
| 采样速率 | 0.5 MHz | 0.5 MHz | 0.5 MHz | 0.5 MHz | - | - |
| 采样并保持/跟踪并保持 | TRACK | TRACK | TRACK | TRACK | - | - |
| 座面最大高度 | 1.22 mm | 1.22 mm | 0.8 mm | 0.8 mm | - | - |
| 标称供电电压 | 3 V | 3 V | 3 V | 3 V | - | - |
| 表面贴装 | YES | YES | YES | YES | - | - |
| 技术 | CMOS | CMOS | CMOS | CMOS | - | - |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | - | - |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn/Pb) | - | - |
| 端子形式 | GULL WING | GULL WING | NO LEAD | NO LEAD | - | - |
| 端子节距 | 0.95 mm | 0.95 mm | 0.65 mm | 0.65 mm | - | - |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | - | - |
| 处于峰值回流温度下的最长时间 | 40 | 40 | 40 | 40 | - | - |
| 宽度 | 1.6 mm | 1.6 mm | 2.2 mm | 2.2 mm | - | - |
