EEPROM, 2KX8, 150ns, Parallel, CMOS, CQCC32, CERAMIC, LCC-32
厂商名称:Atmel (Microchip)
下载文档型号 | AT28C17-15LM/883 | AT28C17F-25WC | AT28C17E-25WC | AT28C17-25WC | AT28C17-25LM/883 | AT28C17-20LM/883 |
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描述 | EEPROM, 2KX8, 150ns, Parallel, CMOS, CQCC32, CERAMIC, LCC-32 | EEPROM, 2KX8, 250ns, Parallel, CMOS, DIE | EEPROM, 2KX8, 250ns, Parallel, CMOS, DIE | EEPROM, 2KX8, 250ns, Parallel, CMOS, DIE | EEPROM, 2KX8, 250ns, Parallel, CMOS, CQCC32, CERAMIC, LCC-32 | EEPROM, 2KX8, 200ns, Parallel, CMOS, CQCC32, CERAMIC, LCC-32 |
零件包装代码 | QFJ | DIE | DIE | DIE | QFJ | QFJ |
包装说明 | QCCN, LCC32,.45X.55 | DIE, | DIE, | DIE, | QCCN, LCC32,.45X.55 | QCCN, LCC32,.45X.55 |
针数 | 32 | 25 | 25 | 25 | 32 | 32 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
ECCN代码 | 3A001.A.2.C | EAR99 | EAR99 | EAR99 | 3A001.A.2.C | 3A001.A.2.C |
最长访问时间 | 150 ns | 250 ns | 250 ns | 250 ns | 250 ns | 200 ns |
其他特性 | AUTOMATIC WRITE | AUTOMATIC WRITE | AUTOMATIC WRITE | AUTOMATIC WRITE | AUTOMATIC WRITE | AUTOMATIC WRITE |
JESD-30 代码 | R-CQCC-N32 | R-XUUC-N25 | R-XUUC-N25 | R-XUUC-N25 | R-CQCC-N32 | R-CQCC-N32 |
内存密度 | 16384 bit | 16384 bit | 16384 bit | 16384 bit | 16384 bit | 16384 bit |
内存集成电路类型 | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 32 | 25 | 25 | 25 | 32 | 32 |
字数 | 2048 words | 2048 words | 2048 words | 2048 words | 2048 words | 2048 words |
字数代码 | 2000 | 2000 | 2000 | 2000 | 2000 | 2000 |
工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
最高工作温度 | 125 °C | 70 °C | 70 °C | 70 °C | 125 °C | 125 °C |
组织 | 2KX8 | 2KX8 | 2KX8 | 2KX8 | 2KX8 | 2KX8 |
输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
封装代码 | QCCN | DIE | DIE | DIE | QCCN | QCCN |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | CHIP CARRIER | UNCASED CHIP | UNCASED CHIP | UNCASED CHIP | CHIP CARRIER | CHIP CARRIER |
并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
编程电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | MILITARY | COMMERCIAL | COMMERCIAL | COMMERCIAL | MILITARY | MILITARY |
端子形式 | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
端子位置 | QUAD | UPPER | UPPER | UPPER | QUAD | QUAD |
厂商名称 | Atmel (Microchip) | - | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) |