型号
- 型号
- 关键词
EEPROM, 32KX1, Serial, CMOS, PDSO8
厂商名称：Microchip(微芯科技)
厂商官网：https://www.microchip.com
器件标准：
| 型号 | ATAES132-TH-FB | ATAES132-MA3H-FB-T | ATAES132-TH-EQ-T | ATAES132-TH-EQ |
|---|---|---|---|---|
| 描述 | EEPROM, 32KX1, Serial, CMOS, PDSO8 | EEPROM, 32KX1, Serial, CMOS, PDSO8 | EEPROM, 32KX1, Serial, CMOS, PDSO8 | EEPROM, 32KX1, Serial, CMOS, PDSO8 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) |
| 包装说明 | 4.40 MM BODY, GREEN, PLASTIC, MO-153AA, TSSOP-8 | 2 X 3 MM, 0.60 MM HEIGHT, 0.50 MM PITCH, PLASTIC, MO-236, MO-252, UDFN-8 | 4.40 MM BODY, GREEN, PLASTIC, MO-153AA, TSSOP-8 | 4.40 MM BODY, GREEN, PLASTIC, MO-153AA, TSSOP-8 |
| Reach Compliance Code | compliant | compliant | compliant | compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 |
| 最大时钟频率 (fCLK) | 10 MHz | 10 MHz | 10 MHz | 10 MHz |
| JESD-30 代码 | R-PDSO-G8 | R-PDSO-N8 | R-PDSO-G8 | R-PDSO-G8 |
| JESD-609代码 | e4 | e4 | e4 | e4 |
| 长度 | 4.4 mm | 3 mm | 4.4 mm | 4.4 mm |
| 内存密度 | 32768 bit | 32768 bit | 32768 bit | 32768 bit |
| 内存集成电路类型 | EEPROM | EEPROM | EEPROM | EEPROM |
| 内存宽度 | 1 | 1 | 1 | 1 |
| 混合内存类型 | N/A | N/A | N/A | N/A |
| 功能数量 | 1 | 1 | 1 | 1 |
| 端子数量 | 8 | 8 | 8 | 8 |
| 字数 | 32768 words | 32768 words | 32768 words | 32768 words |
| 字数代码 | 32000 | 32000 | 32000 | 32000 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C |
| 组织 | 32KX1 | 32KX1 | 32KX1 | 32KX1 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TSSOP | HVSON | TSSOP | TSSOP |
| 封装等效代码 | TSSOP8,.25 | SOLCC8,.12,20 | TSSOP8,.25 | TSSOP8,.25 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 并行/串行 | SERIAL | SERIAL | SERIAL | SERIAL |
| 电源 | 3/5 V | 3/5 V | 3/5 V | 3/5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.2 mm | 0.6 mm | 1.2 mm | 1.2 mm |
| 串行总线类型 | I2C | I2C | I2C | I2C |
| 最大待机电流 | 0.00004 A | 0.00004 A | 0.00004 A | 0.00004 A |
| 最大压摆率 | 0.01 mA | 0.01 mA | 0.01 mA | 0.01 mA |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD |
| 端子形式 | GULL WING | NO LEAD | GULL WING | GULL WING |
| 端子节距 | 0.65 mm | 0.5 mm | 0.65 mm | 0.65 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 3 mm | 2 mm | 3 mm | 3 mm |
| 最长写入周期时间 (tWC) | 6 ms | 6 ms | 6 ms | 6 ms |
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