EDI68128C90LB,EDI68128C90LB pdf中文资料,EDI68128C90LB引脚图,EDI68128C90LB电路-Datasheet-电子工程世界

参数对比

与EDI68128C90LB相近的元器件有：EDI68128C45LI、EDI68128C70LI、EDI68128C120LI、EDI68128C120LB、EDI68128C55LB、EDI68128C70LB、EDI68128C150LI、EDI68128C90LI、EDI68128C55LI。描述及对比如下：

型号	EDI68128C90LB	EDI68128C45LI	EDI68128C70LI	EDI68128C120LI	EDI68128C120LB	EDI68128C55LB	EDI68128C70LB	EDI68128C150LI	EDI68128C90LI	EDI68128C55LI
描述	UVPROM, 128KX8, 90ns, CMOS, CQCC32,	UVPROM, 128KX8, 45ns, CMOS, CQCC32,	UVPROM, 128KX8, 70ns, CMOS, CQCC32,	UVPROM, 128KX8, 120ns, CMOS, CQCC32,	UVPROM, 128KX8, 120ns, CMOS, CQCC32,	UVPROM, 128KX8, 55ns, CMOS, CQCC32,	UVPROM, 128KX8, 70ns, CMOS, CQCC32,	UVPROM, 128KX8, 150ns, CMOS, CQCC32,	UVPROM, 128KX8, 90ns, CMOS, CQCC32,	UVPROM, 128KX8, 55ns, CMOS, CQCC32,
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
最长访问时间	90 ns	45 ns	70 ns	120 ns	120 ns	55 ns	70 ns	150 ns	90 ns	55 ns
其他特性	TTL COMPATIBLE I/O	TTL COMPATIBLE I/O	TTL COMPATIBLE I/O	TTL COMPATIBLE I/O	TTL COMPATIBLE I/O	TTL COMPATIBLE I/O	TTL COMPATIBLE I/O	TTL COMPATIBLE I/O	TTL COMPATIBLE I/O	TTL COMPATIBLE I/O
JESD-30 代码	R-CQCC-N32	R-CQCC-N32	R-CQCC-N32	R-CQCC-N32	R-CQCC-N32	R-CQCC-N32	R-CQCC-N32	R-CQCC-N32	R-CQCC-N32	R-CQCC-N32
内存密度	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit
内存集成电路类型	UVPROM	UVPROM	UVPROM	UVPROM	UVPROM	UVPROM	UVPROM	UVPROM	UVPROM	UVPROM
内存宽度	8	8	8	8	8	8	8	8	8	8
功能数量	1	1	1	1	1	1	1	1	1	1
端子数量	32	32	32	32	32	32	32	32	32	32
字数	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words
字数代码	128000	128000	128000	128000	128000	128000	128000	128000	128000	128000
工作模式	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
最高工作温度	125 °C	85 °C	85 °C	85 °C	125 °C	125 °C	125 °C	85 °C	85 °C	85 °C
最低工作温度	-55 °C	-40 °C	-40 °C	-40 °C	-55 °C	-55 °C	-55 °C	-40 °C	-40 °C	-40 °C
组织	128KX8	128KX8	128KX8	128KX8	128KX8	128KX8	128KX8	128KX8	128KX8	128KX8
封装主体材料	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER
并行/串行	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
最大供电电压 (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
最小供电电压 (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
标称供电电压 (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
表面贴装	YES	YES	YES	YES	YES	YES	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	MILITARY	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	MILITARY	MILITARY	MILITARY	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
端子形式	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD
端子位置	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD
厂商名称	EDI [Electronic devices inc.]	-	-	EDI [Electronic devices inc.]	EDI [Electronic devices inc.]	EDI [Electronic devices inc.]	EDI [Electronic devices inc.]	EDI [Electronic devices inc.]	EDI [Electronic devices inc.]	EDI [Electronic devices inc.]

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