型号
- 型号
- 关键词
Flash, 2MX8, 45ns, PDSO40, 0.400 INCH, 0.80 MM PITCH, PLASTIC, TSOP2-44/40
厂商名称：SAMSUNG(三星)
厂商官网：http://www.samsung.com/Products/Semiconductor/
下载文档| 型号 | K9F1608W0A-TCB00 | K9F1608W0A-TIB00 |
|---|---|---|
| 描述 | Flash, 2MX8, 45ns, PDSO40, 0.400 INCH, 0.80 MM PITCH, PLASTIC, TSOP2-44/40 | Flash, 2MX8, 45ns, PDSO40, 0.400 INCH, 0.80 MM PITCH, PLASTIC, TSOP2-44/40 |
| 厂商名称 | SAMSUNG(三星) | SAMSUNG(三星) |
| 零件包装代码 | TSOP2 | TSOP2 |
| 包装说明 | 0.400 INCH, 0.80 MM PITCH, PLASTIC, TSOP2-44/40 | 0.400 INCH, 0.80 MM PITCH, PLASTIC, TSOP2-44/40 |
| 针数 | 44 | 44 |
| Reach Compliance Code | unknown | unknown |
| ECCN代码 | EAR99 | EAR99 |
| 最长访问时间 | 45 ns | 45 ns |
| JESD-30 代码 | R-PDSO-G40 | R-PDSO-G40 |
| 长度 | 18.41 mm | 18.41 mm |
| 内存密度 | 16777216 bit | 16777216 bit |
| 内存集成电路类型 | FLASH | FLASH |
| 内存宽度 | 8 | 8 |
| 功能数量 | 1 | 1 |
| 端子数量 | 40 | 40 |
| 字数 | 2097152 words | 2097152 words |
| 字数代码 | 2000000 | 2000000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 70 °C | 85 °C |
| 组织 | 2MX8 | 2MX8 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TSOP2 | TSOP2 |
| 封装形状 | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE |
| 并行/串行 | PARALLEL | PARALLEL |
| 编程电压 | 2.7 V | 2.7 V |
| 认证状态 | Not Qualified | Not Qualified |
| 座面最大高度 | 1.2 mm | 1.2 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 2.7 V | 2.7 V |
| 标称供电电压 (Vsup) | 5 V | 5 V |
| 表面贴装 | YES | YES |
| 技术 | CMOS | CMOS |
| 温度等级 | COMMERCIAL | INDUSTRIAL |
| 端子形式 | GULL WING | GULL WING |
| 端子节距 | 0.8 mm | 0.8 mm |
| 端子位置 | DUAL | DUAL |
| 类型 | SLC NAND TYPE | SLC NAND TYPE |
| 宽度 | 10.16 mm | 10.16 mm |
| Base Number Matches | 1 | 1 |