型号
- 型号
- 关键词
64 Megabit (4 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memory and 16 Mbit (1 M x 16-Bit) Pseudo Static RAM
厂商名称：SPANSION
厂商官网：http://www.spansion.com/
下载文档| 型号 | M49000003J | AM49DL640AH70IT | AM49DL640AH56IT | AM49DL640AH56IS | AM49DL640AH | AM49DL640AH85IT | AM49DL640AH85IS | AM49DL640AH70IS | M49000003D | M49000003E |
|---|---|---|---|---|---|---|---|---|---|---|
| 描述 | 64 Megabit (4 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memory and 16 Mbit (1 M x 16-Bit) Pseudo Static RAM | 64 Megabit (4 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memory and 16 Mbit (1 M x 16-Bit) Pseudo Static RAM | 64 Megabit (4 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memory and 16 Mbit (1 M x 16-Bit) Pseudo Static RAM | 64 Megabit (4 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memory and 16 Mbit (1 M x 16-Bit) Pseudo Static RAM | 64 Megabit (4 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memory and 16 Mbit (1 M x 16-Bit) Pseudo Static RAM | 64 Megabit (4 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memory and 16 Mbit (1 M x 16-Bit) Pseudo Static RAM | 64 Megabit (4 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memory and 16 Mbit (1 M x 16-Bit) Pseudo Static RAM | 64 Megabit (4 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memory and 16 Mbit (1 M x 16-Bit) Pseudo Static RAM | 64 Megabit (4 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memory and 16 Mbit (1 M x 16-Bit) Pseudo Static RAM | 64 Megabit (4 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memory and 16 Mbit (1 M x 16-Bit) Pseudo Static RAM |
| 是否Rohs认证 | - | 不符合 | 不符合 | 不符合 | - | 不符合 | 不符合 | 不符合 | - | - |
| 厂商名称 | - | SPANSION | SPANSION | SPANSION | - | SPANSION | SPANSION | SPANSION | - | - |
| 零件包装代码 | - | BGA | BGA | BGA | - | BGA | BGA | BGA | - | - |
| 包装说明 | - | LFBGA, | LFBGA, | LFBGA, | - | LFBGA, | LFBGA, | LFBGA, | - | - |
| 针数 | - | 73 | 73 | 73 | - | 73 | 73 | 73 | - | - |
| Reach Compliance Code | - | compli | compli | compli | - | compli | compli | compli | - | - |
| 其他特性 | - | PSEUDO STATIC RAM IS ORGANIZED AS 1M X 16; FLASH CAN ALSO BE ORGANIZED AS 8M X 8 | PSEUDO STATIC RAM IS ORGANIZED AS 1M X 16; FLASH CAN ALSO BE ORGANIZED AS 8M X 8 | PSEUDO STATIC RAM IS ORGANIZED AS 1M X 16; FLASH CAN ALSO BE ORGANIZED AS 8M X 8 | - | PSEUDO STATIC RAM IS ORGANIZED AS 1M X 16; FLASH CAN ALSO BE ORGANIZED AS 8M X 8 | PSEUDO STATIC RAM IS ORGANIZED AS 1M X 16; FLASH CAN ALSO BE ORGANIZED AS 8M X 8 | PSEUDO STATIC RAM IS ORGANIZED AS 1M X 16; FLASH CAN ALSO BE ORGANIZED AS 8M X 8 | - | - |
| JESD-30 代码 | - | R-PBGA-B73 | R-PBGA-B73 | R-PBGA-B73 | - | R-PBGA-B73 | R-PBGA-B73 | R-PBGA-B73 | - | - |
| JESD-609代码 | - | e0 | e0 | e0 | - | e0 | e0 | e0 | - | - |
| 长度 | - | 11.6 mm | 11.6 mm | 11.6 mm | - | 11.6 mm | 11.6 mm | 11.6 mm | - | - |
| 内存密度 | - | 67108864 bi | 67108864 bi | 67108864 bi | - | 67108864 bi | 67108864 bi | 67108864 bi | - | - |
| 内存集成电路类型 | - | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT | - | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT | - | - |
| 内存宽度 | - | 16 | 16 | 16 | - | 16 | 16 | 16 | - | - |
| 湿度敏感等级 | - | 3 | 3 | 3 | - | 3 | 3 | 3 | - | - |
| 功能数量 | - | 1 | 1 | 1 | - | 1 | 1 | 1 | - | - |
| 端子数量 | - | 73 | 73 | 73 | - | 73 | 73 | 73 | - | - |
| 字数 | - | 4194304 words | 4194304 words | 4194304 words | - | 4194304 words | 4194304 words | 4194304 words | - | - |
| 字数代码 | - | 4000000 | 4000000 | 4000000 | - | 4000000 | 4000000 | 4000000 | - | - |
| 工作模式 | - | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | - | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | - | - |
| 最高工作温度 | - | 85 °C | 85 °C | 85 °C | - | 85 °C | 85 °C | 85 °C | - | - |
| 最低工作温度 | - | -40 °C | -40 °C | -40 °C | - | -40 °C | -40 °C | -40 °C | - | - |
| 组织 | - | 4MX16 | 4MX16 | 4MX16 | - | 4MX16 | 4MX16 | 4MX16 | - | - |
| 封装主体材料 | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | - |
| 封装代码 | - | LFBGA | LFBGA | LFBGA | - | LFBGA | LFBGA | LFBGA | - | - |
| 封装形状 | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | - |
| 封装形式 | - | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | - | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | - | - |
| 峰值回流温度（摄氏度） | - | 240 | 240 | 240 | - | 240 | 240 | 240 | - | - |
| 认证状态 | - | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | - | - |
| 座面最大高度 | - | 1.4 mm | 1.4 mm | 1.4 mm | - | 1.4 mm | 1.4 mm | 1.4 mm | - | - |
| 最大供电电压 (Vsup) | - | 3.3 V | 3.3 V | 3.3 V | - | 3.3 V | 3.3 V | 3.3 V | - | - |
| 最小供电电压 (Vsup) | - | 2.7 V | 2.7 V | 2.7 V | - | 2.7 V | 2.7 V | 2.7 V | - | - |
| 标称供电电压 (Vsup) | - | 3 V | 3 V | 3 V | - | 3 V | 3 V | 3 V | - | - |
| 表面贴装 | - | YES | YES | YES | - | YES | YES | YES | - | - |
| 技术 | - | CMOS | CMOS | CMOS | - | CMOS | CMOS | CMOS | - | - |
| 温度等级 | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | - | - |
| 端子面层 | - | TIN LEAD | TIN LEAD | TIN LEAD | - | TIN LEAD | TIN LEAD | TIN LEAD | - | - |
| 端子形式 | - | BALL | BALL | BALL | - | BALL | BALL | BALL | - | - |
| 端子节距 | - | 0.8 mm | 0.8 mm | 0.8 mm | - | 0.8 mm | 0.8 mm | 0.8 mm | - | - |
| 端子位置 | - | BOTTOM | BOTTOM | BOTTOM | - | BOTTOM | BOTTOM | BOTTOM | - | - |
| 处于峰值回流温度下的最长时间 | - | 30 | 30 | 30 | - | 30 | 30 | 30 | - | - |
| 宽度 | - | 8 mm | 8 mm | 8 mm | - | 8 mm | 8 mm | 8 mm | - | - |
| Base Number Matches | - | 1 | 1 | 1 | - | 1 | 1 | 1 | - | - |