Audio Amplifier, 1.4W, 1 Channel(s), 1 Func, BICMOS, PBGA9, 1.5 X 1.5 MM, ROHS COMPLIANT, UCSP-9
厂商名称:Maxim(美信半导体)
厂商官网:https://www.maximintegrated.com/en.html
器件标准:
下载文档型号 | MAX9717DEBL+ | MAX9717AETA+ | MAX9716EBL+T | MAX9717DEBL | MAX9717CEBL | MAX9717BEBL+ | MAX9717AEBL+ |
---|---|---|---|---|---|---|---|
描述 | Audio Amplifier, 1.4W, 1 Channel(s), 1 Func, BICMOS, PBGA9, 1.5 X 1.5 MM, ROHS COMPLIANT, UCSP-9 | Audio Amplifier, 1.4W, 1 Channel(s), 1 Func, BICMOS, 3 X 3 MM, 0.80 MM HEIGHT, ROHS COMPLIANT, MO-229WEEC, TDFN-8 | Audio Amplifier, 1.4W, 1 Channel(s), 1 Func, BICMOS, PBGA9, 1.5 X 1.5 MM, UCSP-9 | Audio Amplifier, 1.4W, 1 Channel(s), 1 Func, BICMOS, PBGA9, 1.5 X 1.5 MM, UCSP-9 | Audio Amplifier, 1.4W, 1 Channel(s), 1 Func, BICMOS, PBGA9, 1.5 X 1.5 MM, UCSP-9 | Audio Amplifier, 1.4W, 1 Channel(s), 1 Func, BICMOS, PBGA9, 1.5 X 1.5 MM, ROHS COMPLIANT, UCSP-9 | Audio Amplifier, 1.4W, 1 Channel(s), 1 Func, BICMOS, PBGA9, 1.5 X 1.5 MM, ROHS COMPLIANT, UCSP-9 |
是否无铅 | 不含铅 | 不含铅 | 不含铅 | 含铅 | 含铅 | 不含铅 | 不含铅 |
是否Rohs认证 | 符合 | 符合 | 符合 | 不符合 | 不符合 | 符合 | 符合 |
零件包装代码 | BGA | SON | BGA | BGA | BGA | BGA | BGA |
包装说明 | VFBGA, | HVSON, SOLCC8,.12,25 | VFBGA, BGA9,3X3,20 | 1.5 X 1.5 MM, UCSP-9 | 1.5 X 1.5 MM, UCSP-9 | VFBGA, | VFBGA, |
针数 | 9 | 8 | 9 | 9 | 9 | 9 | 9 |
Reach Compliance Code | compliant | compliant | compliant | not_compliant | not_compliant | compliant | compliant |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
标称带宽 | 22 kHz | 22 kHz | 22 kHz | 22 kHz | 22 kHz | 22 kHz | 22 kHz |
商用集成电路类型 | AUDIO AMPLIFIER | AUDIO AMPLIFIER | AUDIO AMPLIFIER | AUDIO AMPLIFIER | AUDIO AMPLIFIER | AUDIO AMPLIFIER | AUDIO AMPLIFIER |
JESD-30 代码 | S-PBGA-B9 | S-XDSO-N8 | S-PBGA-B9 | S-PBGA-B9 | S-PBGA-B9 | S-PBGA-B9 | S-PBGA-B9 |
长度 | 1.52 mm | 3 mm | 1.52 mm | 1.52 mm | 1.52 mm | 1.52 mm | 1.52 mm |
湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
信道数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 9 | 8 | 9 | 9 | 9 | 9 | 9 |
最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
标称输出功率 | 1.4 W | 1.4 W | 1.4 W | 1.4 W | 1.4 W | 1.4 W | 1.4 W |
封装主体材料 | PLASTIC/EPOXY | UNSPECIFIED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | VFBGA | HVSON | VFBGA | VFBGA | VFBGA | VFBGA | VFBGA |
封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
峰值回流温度(摄氏度) | 260 | 260 | 260 | 245 | 245 | 260 | 260 |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 0.67 mm | 0.8 mm | 0.67 mm | 0.67 mm | 0.67 mm | 0.67 mm | 0.67 mm |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V |
表面贴装 | YES | YES | YES | YES | YES | YES | YES |
技术 | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子形式 | BALL | NO LEAD | BALL | BALL | BALL | BALL | BALL |
端子节距 | 0.5 mm | 0.65 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
端子位置 | BOTTOM | DUAL | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
宽度 | 1.52 mm | 3 mm | 1.52 mm | 1.52 mm | 1.52 mm | 1.52 mm | 1.52 mm |
厂商名称 | Maxim(美信半导体) | - | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) |
增益 | 12 dB | - | - | 12 dB | 9 dB | 6 dB | - |
JESD-609代码 | e1 | e3 | e1 | e0 | - | e1 | e1 |
端子面层 | Tin/Silver/Copper (Sn/Ag/Cu) | Matte Tin (Sn) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Lead (Sn/Pb) | - | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) |