型号
- 型号
- 关键词
16 I/O, PIA-GENERAL PURPOSE, PDSO24
16 输入/输出, 通用PIA, PDSO24
器件类别：嵌入式处理器和控制器 微控制器和处理器
厂商名称：NXP(恩智浦)
厂商官网：https://www.nxp.com
器件标准：
| 型号 | PCA9555PW | PCA9555BS | PCA9555 | PCA9555HF | PCA9555N |
|---|---|---|---|---|---|
| 描述 | 16 I/O, PIA-GENERAL PURPOSE, PDSO24 | 16 I/O, PIA-GENERAL PURPOSE, PQCC24 | 16-bit I2C and SMBus I/O port with interrupt | 16 I/O, PIA-GENERAL PURPOSE, PQCC24 | 16 I/O, PIA-GENERAL PURPOSE, PQCC24 |
| 是否无铅 | 不含铅 | 不含铅 | - | - | 不含铅 |
| 是否Rohs认证 | 符合 | 符合 | - | 符合 | 符合 |
| 厂商名称 | NXP(恩智浦) | NXP(恩智浦) | - | NXP(恩智浦) | NXP(恩智浦) |
| 零件包装代码 | TSSOP | QFN | - | QFN | DIP |
| 包装说明 | TSSOP, TSSOP24,.25 | HVQFN-24 | - | HWQFN-24 | DIP, DIP24,.6 |
| 针数 | 24 | 24 | - | 24 | 24 |
| Reach Compliance Code | compli | compliant | - | compliant | unknow |
| ECCN代码 | EAR99 | EAR99 | - | EAR99 | EAR99 |
| JESD-30 代码 | R-PDSO-G24 | S-PQCC-N24 | - | S-PQCC-N24 | R-PDIP-T24 |
| JESD-609代码 | e4 | e4 | - | e4 | e3 |
| 长度 | 7.8 mm | 4 mm | - | 4 mm | 31.7 mm |
| 湿度敏感等级 | 1 | 1 | - | 1 | - |
| 位数 | 16 | 16 | - | 16 | 16 |
| I/O 线路数量 | 16 | 16 | - | 16 | 16 |
| 端口数量 | 2 | 2 | - | 2 | 2 |
| 端子数量 | 24 | 24 | - | 24 | 24 |
| 最高工作温度 | 85 °C | 85 °C | - | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | - | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TSSOP | HVQCCN | - | HVQCCN | DIP |
| 封装等效代码 | TSSOP24,.25 | LCC24,.16SQ,20 | - | LCC24,.16SQ,20 | DIP24,.6 |
| 封装形状 | RECTANGULAR | SQUARE | - | SQUARE | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | - | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | IN-LINE |
| 峰值回流温度（摄氏度） | 260 | 260 | - | 260 | 245 |
| 电源 | 2.5/5 V | 2.5/5 V | - | 2.5/5 V | 2.5/5 V |
| 认证状态 | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified |
| 座面最大高度 | 1.1 mm | 1 mm | - | 0.8 mm | 5.1 mm |
| 最大供电电压 | 5.5 V | 5.5 V | - | 5.5 V | 5.5 V |
| 最小供电电压 | 2.3 V | 2.3 V | - | 2.3 V | 2.3 V |
| 标称供电电压 | 3 V | 3 V | - | 3 V | 3 V |
| 表面贴装 | YES | YES | - | YES | NO |
| 技术 | CMOS | CMOS | - | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | NICKEL PALLADIUM GOLD | - | NICKEL PALLADIUM GOLD | Matte Tin (Sn) |
| 端子形式 | GULL WING | NO LEAD | - | NO LEAD | THROUGH-HOLE |
| 端子节距 | 0.65 mm | 0.5 mm | - | 0.5 mm | 2.54 mm |
| 端子位置 | DUAL | QUAD | - | QUAD | DUAL |
| 处于峰值回流温度下的最长时间 | 30 | 30 | - | 30 | 40 |
| 宽度 | 4.4 mm | 4 mm | - | 4 mm | 15.24 mm |
| uPs/uCs/外围集成电路类型 | PARALLEL IO PORT, GENERAL PURPOSE | PARALLEL IO PORT, GENERAL PURPOSE | - | PARALLEL IO PORT, GENERAL PURPOSE | PARALLEL IO PORT, GENERAL PURPOSE |
