型号 | SN74LS181NP1 | SN74S181N1 | SN74S181NP1 | SN74LS181N1 | SNC54S181J |
---|---|---|---|---|---|
描述 | IC,FIXED POINT ALU,LS-TTL,DIP,24PIN,PLASTIC | IC,FIXED POINT ALU,S-TTL,DIP,24PIN,PLASTIC | IC,FIXED POINT ALU,S-TTL,DIP,24PIN,PLASTIC | IC,FIXED POINT ALU,LS-TTL,DIP,24PIN,PLASTIC | IC,FIXED POINT ALU,S-TTL,DIP,24PIN,CERAMIC |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
包装说明 | DIP, DIP24,.6 | DIP, DIP24,.6 | DIP, DIP24,.6 | DIP, DIP24,.6 | DIP, DIP24,.6 |
Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | _compli |
JESD-30 代码 | R-PDIP-T24 | R-PDIP-T24 | R-PDIP-T24 | R-PDIP-T24 | R-XDIP-T24 |
逻辑集成电路类型 | ARITHMETIC LOGIC UNIT | ARITHMETIC LOGIC UNIT | ARITHMETIC LOGIC UNIT | ARITHMETIC LOGIC UNIT | ARITHMETIC LOGIC UNIT |
端子数量 | 24 | 24 | 24 | 24 | 24 |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 125 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC |
封装代码 | DIP | DIP | DIP | DIP | DIP |
封装等效代码 | DIP24,.6 | DIP24,.6 | DIP24,.6 | DIP24,.6 | DIP24,.6 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
表面贴装 | NO | NO | NO | NO | NO |
技术 | TTL | TTL | TTL | TTL | TTL |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | MILITARY |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL |
Base Number Matches | 1 | 1 | 1 | 1 | - |
厂商名称 | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | - | Texas Instruments(德州仪器) |