LOW-POWER HEX ECL-to-TTL TRANSLATOR
厂商名称:Microchip(微芯科技)
厂商官网:https://www.microchip.com
下载文档型号 | SY100S325 | SY100S325JC | SY100S325JCTR | SY100S325FC |
---|---|---|---|---|
描述 | LOW-POWER HEX ECL-to-TTL TRANSLATOR | LOW-POWER HEX ECL-to-TTL TRANSLATOR | LOW-POWER HEX ECL-to-TTL TRANSLATOR | LOW-POWER HEX ECL-to-TTL TRANSLATOR |
厂商名称 | - | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) |
包装说明 | - | QCCJ, | QCCJ, | QFF, QFL24,.4SQ |
Reach Compliance Code | - | compli | compli | compli |
ECCN代码 | - | EAR99 | EAR99 | EAR99 |
最大延迟 | - | 3.7 ns | 3.7 ns | 3.7 ns |
接口集成电路类型 | - | ECL TO TTL TRANSLATOR | ECL TO TTL TRANSLATOR | ECL TO TTL TRANSLATOR |
JESD-30 代码 | - | S-PQCC-J28 | S-PQCC-J28 | S-GQFP-F24 |
长度 | - | 11.48 mm | 11.48 mm | 9.78 mm |
位数 | - | 1 | 1 | 1 |
功能数量 | - | 6 | 6 | 6 |
端子数量 | - | 28 | 28 | 24 |
输出锁存器或寄存器 | - | NONE | NONE | NONE |
输出极性 | - | TRUE | TRUE | TRUE |
封装主体材料 | - | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED |
封装代码 | - | QCCJ | QCCJ | QFF |
封装形状 | - | SQUARE | SQUARE | SQUARE |
封装形式 | - | CHIP CARRIER | CHIP CARRIER | FLATPACK |
座面最大高度 | - | 4.57 mm | 4.57 mm | 2.29 mm |
最大供电电压 | - | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 | - | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 | - | 5 V | 5 V | 5 V |
表面贴装 | - | YES | YES | YES |
端子形式 | - | J BEND | J BEND | FLAT |
端子节距 | - | 1.27 mm | 1.27 mm | 1.27 mm |
端子位置 | - | QUAD | QUAD | QUAD |
宽度 | - | 11.48 mm | 11.48 mm | 9.78 mm |