Synchronous DRAM, 8MX16, 5.4ns, CMOS, PBGA54, 8 X 9 MM, 1.20 MM HEIGHT, FBGA-54
厂商名称:Winbond(华邦电子)
厂商官网:http://www.winbond.com.tw
下载文档型号 | W987Z6CBG75 | W987Z6CBG80 | W987Z6CBN80 | W987Z6CBN75 |
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描述 | Synchronous DRAM, 8MX16, 5.4ns, CMOS, PBGA54, 8 X 9 MM, 1.20 MM HEIGHT, FBGA-54 | Synchronous DRAM, 8MX16, 6ns, CMOS, PBGA54, 8 X 9 MM, 1.20 MM HEIGHT, FBGA-54 | Synchronous DRAM, 8MX16, 6ns, CMOS, PBGA54, 8 X 9 MM, 1.20 MM HEIGHT, FBGA-54 | Synchronous DRAM, 8MX16, 5.4ns, CMOS, PBGA54, 8 X 9 MM, 1.20 MM HEIGHT, FBGA-54 |
厂商名称 | Winbond(华邦电子) | Winbond(华邦电子) | Winbond(华邦电子) | Winbond(华邦电子) |
零件包装代码 | BGA | BGA | BGA | BGA |
包装说明 | TFBGA, | TFBGA, | TFBGA, | TFBGA, |
针数 | 54 | 54 | 54 | 54 |
Reach Compliance Code | compliant | compliant | compliant | compliant |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 |
访问模式 | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST |
最长访问时间 | 5.4 ns | 6 ns | 6 ns | 5.4 ns |
其他特性 | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH |
JESD-30 代码 | R-PBGA-B54 | R-PBGA-B54 | R-PBGA-B54 | R-PBGA-B54 |
JESD-609代码 | e1 | e1 | e1 | e1 |
长度 | 9 mm | 9 mm | 9 mm | 9 mm |
内存密度 | 134217728 bit | 134217728 bit | 134217728 bit | 134217728 bit |
内存集成电路类型 | SYNCHRONOUS DRAM | SYNCHRONOUS DRAM | SYNCHRONOUS DRAM | SYNCHRONOUS DRAM |
内存宽度 | 16 | 16 | 16 | 16 |
功能数量 | 1 | 1 | 1 | 1 |
端口数量 | 1 | 1 | 1 | 1 |
端子数量 | 54 | 54 | 54 | 54 |
字数 | 8388608 words | 8388608 words | 8388608 words | 8388608 words |
字数代码 | 8000000 | 8000000 | 8000000 | 8000000 |
工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C |
组织 | 8MX16 | 8MX16 | 8MX16 | 8MX16 |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | TFBGA | TFBGA | TFBGA | TFBGA |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | GRID ARRAY, THIN PROFILE, FINE PITCH | GRID ARRAY, THIN PROFILE, FINE PITCH | GRID ARRAY, THIN PROFILE, FINE PITCH | GRID ARRAY, THIN PROFILE, FINE PITCH |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm |
自我刷新 | YES | YES | YES | YES |
最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
最小供电电压 (Vsup) | 2.7 V | 2.7 V | 2.7 V | 2.7 V |
标称供电电压 (Vsup) | 3 V | 3 V | 3 V | 3 V |
表面贴装 | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子面层 | TIN SILVER COPPER | TIN SILVER COPPER | TIN SILVER COPPER | TIN SILVER COPPER |
端子形式 | BALL | BALL | BALL | BALL |
端子节距 | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm |
端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
宽度 | 8 mm | 8 mm | 8 mm | 8 mm |