SPECIFICATIONS
FUTURE BUS CONNECTOR
1F Series
Header Press Fit Type
2.0mm Pitch
4 Row s
Mechanical
Contact Retention Force:
1.0Kg min.
Electrical
Voltage Rating:
750V
Current Rating:
1A
Contact Resistance:
45m
Ω
max.
Dielectrical Withstanding Voltage:
1000V
Insulation Resistance:
1000M
Ω
min.
Physical
Housing:
LCP, UL 94-0 rated, Ivory White
Contact:
Phosphor Bronze
Plating:
See “ORDERING INFORMATION”
DRAWING
ORDERING I NF OR MATI ON
PRODUCT NO.:
1F11024*-P**F0*-** 24
1F11048*-P**F0*-** 48
1F11096*-P**F0*-** 96
Mating Area Plating:
1=GOLD FLASH
3=0.76um(30u")MIN. GOLD PLATING
5=1.27um(50u")MIN. GOLD PLATING
6=0.25um(10u")MIN. GOLD PLATING
A=0.76um(30u")MIN. FPT PLATING,
0.25um(10u")MIN. GOLD INCLUDED
C=1.27um(50u'')MIN. FPT PLATING.
0.50um(10u'')MIN. GOLD INCLUDED.
D=1.27um(50u'')MIN. FPT PLATING.
0.25um(10u'')MIN. GOLD INCLUDED.
K=0.50um(20u'')MIN. FPT PLATING.
GOLD FLASH INCLUDED.
11.90
23.90
47.90
95.90
10.00
22.00
46.00
94.00
DIM. B
1F11192*-P**F0*-** 192
P/N
POS. DIM. A
All specification & dimensions are subject to change, please call your nearest Foxconn sales representative for update information.
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FPGA/CPLD
