SPECIFICATIONS
FUTURE BUS CONNECTOR
1F Series
Header Sol der Type
2.0mm Pitch
4 Row s
Mechanical
Contact Retention Force:
1.0Kg min.
Electrical
Voltage Rating:
750V
Current Rating:
1A
Contact Resistance:
45m
Ω
max.
Dielectrical Withstanding Voltage:
1000V
Insulation Resistance:
1000M
Ω
min.
Physical
Housing:
LCP, UL 94-0 rated, Ivory White
Contact:
Phosphor Bronze
Plating:
See “ORDERING INFORMATION”
DRAWING
ORDERING I NF OR MATI O N
PRODUCT NO.: 1 F 1 1 * * * * - S * * 4
POS. NO.:
024=024 pos.
048=048 pos.
072=072 pos.
096=096 pos.
120=120 pos.
192=192 pos.
1F11024*-S**4
24
48
72
96
120
192
11.90
23.90
35.90
47.90
59.90
95.90
10.00
22.00
34.00
46.00
58.00
94.00
DIM. B
Body Style
Mating Length(DIM.M)
1=5.00 mm
2=5.75 mm
3=6.50 mm
4=7.25 mm
5=8.00 mm
1F11048*-S**4
1F11072*-S**4
1F11096*-S**4
1F11120*-S**4
1F11192*-S**4
P/N
Mating Area Plating:
1=GOLD FLASH
3=0.76um(30u")MIN. GOLD PLATING
5=1.27um(50u")MIN. GOLD PLATING
6=0.25um(10u")MIN. GOLD PLATING
A=0.76um(30u")MIN. FPT PLATING,
0.25um(10u")MIN. GOLD INCLUDED
Tail Length(DIM.T)
4=2.65mm
5=3.45mm
POS. DIM. A
Tail Style:
S=Solder Type
All specification & dimensions are subject to change, please call your nearest Foxconn sales representative for update information.
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FPGA/CPLD
