SPECIFICATIONS
FUTURE BUS CONNECTOR
1F Series
Rec. Hold Dow n Feature
2.0mm Pitch
4 Row s
Mechanical
Contact Retention Force:
0.5Kg min.
Electrical
Voltage Rating:
750V
Current Rating:
2.75A
Contact Resistance:
45m
Ω
max.
Dielectrical Withstanding Voltage:
1000V
Insulation Resistance:
1000MΩ min.
Physical
Housing:
LCP, UL 94-0 rated, Ivory White
Contact:
Phosphor Bronze
Plating:
See “ORDERING INFORMATION”
DRAWING
ORDERING I NF OR MATI ON
PRODUCT NO.: 1 F 1 4 0 0 8 * - S 1 4 H 0 * - * *
POS. NO.:
008=008 pos.
Lead Free Code:
N=None
F=Lead Free
Mating Area Plating:
1=GOLD FLASH
3=0.76um(30u")MIN. GOLD PLATING
5=1.27um(50u")MIN. GOLD PLATING
6=0.25um(10u")MIN. GOLD PLATING
A=0.76um(30u")MIN. FPT PLATING,
0.25um(10u")MIN. GOLD INCLUDED
D=1.27um(50u")MIN. FPT PLATING,
0.25um(10u")MIN. GOLD INCLUDED
Package Type:
7=Carrier Tape
Extension Code:
N,T,L,M
BODY STYLE
H0=Special For Ericsson
Tail Style:
S=Solder type
All specification & dimensions are subject to change, please call your nearest Foxconn sales representative for update information.
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FPGA/CPLD
