SPECIFICATIONS
FUTURE BUS CONNECTOR
1F Series
Rec. Solder Type
2.0mm Pitch
5 Row s
Mechanical
Contact Retention Force:
0.50Kg min.
Electrical
Voltage Rating:
750V
Current Rating:
1A
Contact Resistance:
55m
Ω
max.
Dielectrical Withstanding Voltage:
1000V
Insulation Resistance:
1000M
Ω
min.
Physical
Housing:
LCP, UL 94-0 rated, Ivory White
Contact:
Phosphor Bronze
Plating:
See “ORDERING INFORMATION”
DRAWING
ORDERING I NF OR MATI ON
PRODUCT NO.: 1 F 2 2 * * * * - S * 0 2 0 * - * *
POS. NO.:
030=030 pos.
060=060 pos.
120=120 pos.
150=150 pos.
Lead Free Code:
N=None
F=Lead Free
Package Type:
A=Tube
Mating Area Plating:
1=GOLD FLASH
3=0.76um(30u")MIN. GOLD PLATING
5=1.27um(50u")MIN. GOLD PLATING
6=0.25um(10u")MIN. GOLD PLATING
A=0.76um(30u")MIN. FPT PLATING,
0.25um(10u")MIN. GOLD INCLUDED
Extension Code:
N=Normal Plating
BODY STYLE
20=Vertical Standard
Tail Length(DIM.T)
2=2.65mm
3=3.45mm
4=4.25mm
Tail Style:
S=Solder Type
All specification & dimensions are subject to change, please call your nearest Foxconn sales representative for update information.