Electronics Assembly Materials
2008 RECOMMENDED
®
Solve Your Lead-Free Puzzle with Kester
Kester’s set of compatible lead-free materials makes lead-free
assembly a snap. Whether it’s for SMT, Wave Soldering, Hand
Soldering or Rework applications, Kester has reliable Lead-Free
Solutions™ specifically tailored for your assembly needs.
EnviroMark™907 No-Clean Solder Paste
• Excellent wetting and shininess
• Extremely print friendly
• #1 globally specified lead-free paste
K100LD Bar Solder
• Lowest copper dissolution
• Silver-free and low-dross to lower costs
• Shiny joints with excellent process yields
959T Alcohol-Based and 979 VOC-Free Fluxes
• Excellent hole-fill
• Low voids
• High reliability no-clean with low residues
275 No-Clean Cored Wire
• Fast wetting for efficient soldering
• Minimal smoke and low odor
• Available in K100
LD
and SAC305 alloys
®
An Illinois Tool Works Company
Global Headquarters
800 W. Thorndale Avenue
Itasca, IL 60143
Phone: 800 2.KESTER
(+1) 847.297.1600
Fax: (+1) 847.390.9338
Branches:
Canada
Mexico Germany Brazil Japan
Singapore Taiwan Malaysia China
website: www.kester.com
Call Kester today for your complete
Global Lead-Free Solutions™ package.
Kester Lead-Free
Kester Lead-Free Solutions™
W
ith over 100 years of soldering technology experience,
Kester understands the challenges associated with the transition
from leaded to lead-free soldering. Kester's Lead-Free
Solutions™ offers the following help:
• Complete line of lead-free materials
• Kester's know-how to implement lead-free
• Consulting and training courses in lead-free SMT,
wave soldering, and rework
• Unique lead-free product packaging
• Test services
Kester RoHS Ready Logo
Kester commitment to a smooth lead-free transition is demon-
strated by its "green packaging", the development of uniquely
shape lead-free triangular bar solders for easy identification,
and the lead-free knowledge avail-
able in Kester University training
courses, lead-free seminars, and
its quarterly Lead-Free Connection™
newsletter. Now Kester has gone
one step further by developing a
RoHS Ready Logo.
• Logo identifies Kester products to be in
compliance with RoHS Directive 2002/95/EC
Article 4 for banned substances
• Can be seen on technical literature such as
data sheets.
Page 3
Lead-Free Solder Pastes
Formula
Application
Alloys
Product
Characteristics
Residue Characteristics
Typical Metal Percentage
Compliant Specifications
Suggested Packaging Style
Liquid Soldering Fluxes for
Lead-Free Wave Soldering
Lead-free wave and selective soldering require exposing the flux to
slightly higher soldering temperatures. Lead-free alloys traditionally
wet metal surfaces more slowly than tin-lead. Kester liquid fluxes for
lead-free assembly have new activator packages to enable rapid wetting
and hole-filling, ensuring reliable product output.
Kester Part #
63-0004-0985
64-0004-0985
65-0004-0985
63-0020-0959
64-0020-0959
65-0020-0959
63-0056-2220
64-0056-2220
65-0056-2220
63-0000-2235
64-0000-2235
65-0000-2235
Description
985M No-Clean
985M No-Clean
985M No-Clean
959T No-Clean
959T No-Clean
959T No-Clean
2220-VF VOC-Free Water-Soluble
2220-VF VOC-Free Water-Soluble
2220-VF VOC-Free Water-Soluble
2235 Water-Soluble
2235 Water-Soluble
2235 Water-Soluble
Packaging
1 gallon
5 gallon
53 gallon drum
1 gallon
5 gallon
53 gallon drum
1 gallon
5 gallon
53 gallon drum
Page 4
Light colored
Kester Lead-Free
EnviroMark™ 907
No-Clean Stencil Printing
Sn96.5Ag3.0Cu0.5
Designed to exceed customers' expectations for high yield
lead-free manufacturing. EM907 is engineered for the
high thermal demands of assembling with lead-free alloys
such as the family of SnAgCu (SAC). Joints are cosmetically
bright as SnPb joints. Prints down to 0201 pad sites.
Designed to be reflowable in air as well as nitrogen.
EnviroMark™ 828
R520A
Water-Soluble Stencil Printing
Sn96.5Ag3.0Cu0.5
Kester EM828 provides excellent printability, activity,
cleanability and low-voiding behavior. EM828 is very
robust and can tolerate a wide variety of printing and
reflow conditions. EM828 is first to market with a
water-soluable lead-free paste that combines superior
activity, cleanability and low-voiding.
Cleanable in warm water
89.5%, -325/+500 (Type 3)
IPC/J-STD-004 Flux Designator ORH1
500g jar, 600g, 1400g cartridges
R520A is designed to solder effectively difficult metal
surfaces in an air or nitrogen reflow atmosphere. The
activator package is able to withstand the higher temper-
atures without slump. The flux system is non-hygroscopic,
reducing paste waste at the printer. It is available in all
common lead-free alloys.
Cleanable in warm water
89.5%, -325/+500 (Type 3)
IPC/J-STD-004 Flux Designator ORH0
500g jar, 600g, 1400g cartridges
88.5%, -325/+500 (Type 3)
Telcordia Issue 1 GR-78-CORE
IPC/J-STD-004 Flux Designator ROL0
500g jar, 600g, 1400g cartridges
Kester Part #
57-3043-9909
57-3043-9913
57-3043-9916
55-3843-2209
55-3843-2213
57-3843-8109
57-3843-8113
57-3843-8116
Description
EM907 No-Clean, Type 3, 88.5% metal
EM907 No-Clean, Type 3, 88.5% metal
EM907 No-Clean, Type 3, 88.5% metal
EM828 Water-Soluble, Type 3, 89.5% metal
EM828 Water-Soluble, Type 3, 89.5% metal
R520A Water-Soluble, Type 3, 89.5% metal
R520A Water-Soluble, Type 3, 89.5% metal
R520A Water-Soluble, Type 3, 89.5% metal
Alloy
Sn96.5Ag3.0Cu0.5
Sn96.5Ag3.0Cu0.5
Sn96.5Ag3.0Cu0.5
Sn96.5Ag3.0Cu0.5
Sn96.5Ag3.0Cu0.5
Sn96.5Ag3.0Cu0.5
Sn96.5Ag3.0Cu0.5
Sn96.5Ag3.0Cu0.5
Packaging
500g jar
600g cartridge
1400g cartridge
500g jar
600g cartridge
500g jar
600g cartridge
1400g cartridge
*Formula
985M
No-Clean
959T
No-Clean
Spray or Foam Fluxer
Halide - free
0.794
2.9
IPC/J-STD-004
Flux Designator ORL0
2220-VF VOC-Free
Water-Soluble
Spray, Wave or Foam Fluxer
1.6
1.055
7
IPC/J-STD-004
Flux Designator ORH1
2235
Water-Soluble
Spray or Foam Fluxer
1.6
0.856
11
IPC/J-STD-004
Flux Designator ORH1
Application
Halide Content %
Specific Gravity
Solids %
Compliant Specifications
Spray or Wave Fluxer
Halide - free
0.805
3.6
IPC/J-STD-004
Flux Designator ROL0
*
These products are designed specifically for high performance lead-free applications.
1 gallon
5 gallon
53 gallon drum
.
Ultrapure
®
K100LD Lead-Free Solder Bar
K100LD is a new patent-pending low-cost lead-free solder alloy for use in wave soldering,
selective soldering, and tip tinning operations. K100LD has the Lowest Copper Dissolution
amongst all common solder alloys, including SN63, SAC305, and other lead-free options.
Kester K100LD provides the lowest cost for wave soldering operations. It also provides
solder joints with no shrinkage effects, excellent through-hole penetration and topside
fillet, and provides a low dross rate.
Kester Part #
04-9574-0050
04-9571-0050
04-7068-0000
Alloy
K100LD
K100
Sn96.5Ag3.0Cu0.5
Each Bar
1 2/3 lbs.
1 2/3 lbs.
1 2/3 lbs.
Sold As
25 lbs.
25 lbs.
25 lbs.
Common Lead-Free Alloys
*Alloys
K100LD
K100
Sn96.5Ag3.0Cu0.5
Sn96.5Ag3.5
Melt Temperature
~227°C/441°F
~227°C/441°F
217°C/423°F
221°C/430°F
Application
Wave/Hand Soldering
Wave/Hand Soldering
SMT/Hand/Wave
SMT/Hand Soldering
Ultrapure
®
K100 Lead-Free Solder Bar
Kester Ultrapure
®
K100 is a low-cost lead-free bar and wire solder. It is a near-eutectic
Tin/Copper alloy with metallic dopants to control the grain structure of the solder joint.
This improves joint reliability and virtually eliminates icicling and bridging.The improved
grain structure also results in shinier solder joints than other traditional lead-free alloys.
* These are the most common lead-free alloys used in the industry. Kester can also produce a multitude of
lead-free alloys as specified by individual requirements.
