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2N7002K

漏源电压(Vdss):60V 连续漏极电流(Id)(25°C 时):300mA 栅源极阈值电压:2.5V @ 250uA 漏源导通电阻:3Ω @ 500mA,10V 最大功率耗散(Ta=25°C):350mW 类型:N沟道

器件类别:分立半导体    MOS(场效应管)   

厂商名称:台湾美丽微(FMS)

厂商官网:http://www.formosagr.com/

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器件参数
参数名称
属性值
漏源电压(Vdss)
60V
连续漏极电流(Id)(25°C 时)
300mA
栅源极阈值电压
2.5V @ 250uA
漏源导通电阻
3Ω @ 500mA,10V
最大功率耗散(Ta=25°C)
350mW
类型
N沟道
文档预览
N-Channel SMD MOSFET ESD Protection
2N7002K
List
Formosa MS
List................................................................................................. 1
Package outline............................................................................... 2
Features.......................................................................................... 2
Mechanical data............................................................................... 2
Maximum ratings ............................................................................. 2~3
Rating and characteristic curves........................................................ 4~5
Pinning information........................................................................... 6
Marking........................................................................................... 6
Suggested solder pad layout............................................................. 6
Packing information.......................................................................... 7
Reel packing.................................................................................... 8
Suggested thermal profiles for soldering processes............................. 8
High reliability test capabilities........................................................... 9
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Document ID
Issued Date
2008/02/10
Revised Date
2012/10/24
Revision
G
Page.
9
Page 1
DS-251105
N-Channel SMD MOSFET ESD Protection
2N7002K
60V N-Channel Enhancement
Mode MOSFET- ESD Protection
Features
R
DS(ON)
, V
GS
@10V, I
D
@500mA=3.0
Ω
R
DS(ON)
, V
GS
@4.5V, I
D
@200mA=4.0
Ω
ESD protection 2ΚV (Human body mode)
Advanced trench process technology.
High density cell design for ultra low on-resistance.
Very low leakage current in off condition
Specially designed for battery operated system,
solid-state relays drivers, relays, displays, lamps,
solenoids, memories, etc.
In compliance with EU RoHS 2002/95/EC directives.
Suffix "-H" indicates
Halogen-free part, ex. 2N7002K-H.
Formosa MS
Package outline
SOT-23
0.045 (1.15)
0.034 (0.85)
0.020 (0.50)
(C)
0.120 (3.04)
0.110 (2.80)
.084(2.10)
.068(1.70)
(B)
(A)
0.063 (1.60)
0.047 (1.20)
0.027 (0.67)
0.013 (0.32)
0.108 (2.75)
0.083 (2.10)
0.007 (0.18)
0.003 (0.09)
Mechanical data
Epoxy:UL94-V0 rated flame retardant
Case : Molded plastic, SOT-23
Terminals : Solder plated, solderable per
MIL-STD-750, Method 2026
0.051 (1.30)
0.035 (0.89)
Mounting Position : Any
Weight : Approximated 0.008 gram
Dimensions in inches and (millimeters)
M
aximum ratings
(AT T
PARAMETER
Drain-Source voltage
Gate-source voltage
Continuous drain current
Pulsed drain current
1)
A
=25 C unless otherwise noted)
Symbol
V
DS
V
GS
I
D
I
DM
Ratings
60
±20
300
2000
UNIT
V
V
mA
mA
o
PARAMETER
P
D
@T
A
= 25°C
P
D
@ T
A
=75°C
Operation junction and storage temperature range
Thermal resistance(PCB mounted)
2)
Symbol
MIN.
TYP.
0.012 (0.30)
MAX.
0.35
0.21
UNIT
Total power dissipation
P
D
W
T
J
, T
STG
Junction to ambient
R
θ
JA
-55
357
+150
o
o
C
C/W
Note : 1. Maximum DC current limited by package
2. Surface mounted on FR4 board, t < 5 sec
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Document ID
Issued Date
2008/02/10
Revised Date
2012/10/24
Revision
G
Page.
9
Page 2
DS-251105
N-Channel SMD MOSFET ESD Protection
2N7002K
Electrical characteristics
(AT T =25 C unless otherwise noted)
o
A
Formosa MS
Symbol
BV
DSS
V
GS(th)
MIN.
60
1.0
2.5
TYP.
MAX.
UNIT
V
V
STATIC
PARAMETER
Drain-source Breakdown Voltage
Gate Threshold Voltage
CONDITIONS
V
GS
= 0V, I
D
= 10µA
V
DS
= V
GS
, I
D
= 250µA
V
GS
= 10V, I
D
= 500mA
Drain-Source On-State Resistance
V
GS
= 4.5V, I
D
= 200mA
3.0
R
DS(on)
4.0
Ω
Zero Gate Voltage Drai n Current
V
DS
= 60V, V
GS
= 0V
I
DSS
1
µA
Gate-Body leakage Current
Forward TransConductance
V
GS
=
±20V,
V
DS
= 0V
V
DS
= 15V, I
D
= 250mA
I
GSS
g
fS
100
±10
µA
ms
DYNAMIC
V
DS
= 15V, I
D
= 200mA
V
GS
= 4.5V
V
DD
= 30V, R
L
= 150Ω, I
D
= 200mA,
V
gen
= 10V, R
G
= 10Ω
Total Gate Charge
Q
g
0.8
nC
Turn-On Delay Time
Turn-Off Delay Time
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
t
on
t
off
C
iss
20
ns
40
35
10
5
pF
V
DS
= 25V, V
GS
= 0V
f = 1.0 MHz
C
oss
C
rss
Source-Drain Diode
Diode Forward Voltage
I
S
=200mA, V
GS
=0V
V
SD
0.82
1.3
V
Switching
Test Circuit
V
DD
Gate Charge
Test Circuit
V
DD
R
L
V
IN
D
V
OUT
1mA
DUT
R
L
V
GS
D
V
GS
R
G
G
V
GS
G
R
G
DUT
S
S
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Document ID
Issued Date
2008/02/10
Revised Date
2012/10/24
Revision
G
Page.
9
Page 3
DS-251105
Rating and characteristic curves (2N7002K)
Fig.1 Output Characteristic
I
D
- Drain-to-Source Current (A)
I
D
- Drain Source Current (A)
Fig.2 Transfer Characteristic
V
GS
= 6.0~10V
5.0V
V
DS
= 10V
4.0V
3.0V
V
DS
- Drain-to-Source Voltage (V)
V
GS
- Gate-to-Source Voltage (V)
Fig.3 On Resistance vs Drain Current
5
Fig.4 On Resistance vs Gate to Source Voltage
R
DS(ON)
- On-Resistance(Ω)
5
R
DS(ON)
- On-Resistance(Ω)
4
4
3
V
GS
= 4.5V
3
I
D
= 500mA
2
2
I
D
= 200mA
1
V
GS
= 10V
1
0
0
0.2
0.4
0.6
0.8
1.0
1.2
0
2
3
4
5
6
7
8
9
10
I
D
- Drain Current (A)
V
GS
- Gate-to-Source Voltage (V)
Fig.5 On Resistance vs Junction Temperature
R
DS(ON)
- On-Resistance(Normalized)
V
GS
= 10V
I
D
= 500mA
T
J
- Junction Temperature (°C)
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Document ID
Issued Date
2008/02/10
Revised Date
2012/10/24
Revision
G
Page.
9
Page 4
DS-251105
Rating and characteristic curves (2N7002K)
Fig. 6 Gate Charge Waveform
V
GS
- Gate-to-Source Voltage (V)
10
V
DS
= 10V
Fig.7 Gate Charge
Vgs
Qg
8
I
D
= 250mA
6
4
2
Vgs(th)
Qg(th)
Qgs
Qsw
0
0
0.2
0.4
0.6
0.8
1.0
Qgd
Qg
Qg - Gate Charge (nC)
Fig.8 Threshold Voltage vs Temperature
V
th
- G-S Threshold Voltage (NORMALIZED)
Fig.9 Breakdown Voltage vs Junction Temperature
90
BV
DSS
-Breakdown Voltage (V)
I
D
= 250uA
88
86
84
82
80
78
76
74
72
-50
I
D
= 250uA
-25
0
25
50
75
100
125
150
T
J
- Junction Temperature (°C)
T
J
- Junction Temperature (°C)
Fig.10 Source-Drain Diode Forward Voltage
10
V
GS
= 0V
I
S
- Source Current (A)
1
25 C
o
125 C
o
0.1
-55 C
o
0.01
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
V
SD
- Source-to-Drain Voltage (V)
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Document ID
Issued Date
2008/02/10
Revised Date
2012/10/24
Revision
G
Page.
9
Page 5
DS-251105
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