GOFORD
Description
The 45P40 uses advanced trench technology and
design to provide excellent R
DS(ON)
with low gate charge .This
device is well suited for high current load applications.
45P40
General Features
●
V
DSS
-40V
@ -10V(typ)
R
DS(ON)
9
m
Ω
I
D
-50A
Schematic diagram
●
High density cell design for ultra low Rdson
●
Fully characterized avalanche voltage and current
●
Good stability and uniformity with high E
AS
●
Excellent package for good heat dissipation
●
Special process technology for high ESD capability
Application
●
Power switch
●
Load switch in high current applications
●
DC/DC converters
Marking and pin assignment
TO-252
Absolute Maximum Ratings (T
C
=25℃unless otherwise noted)
Parameter
Drain-Source Voltage
Gate-Source Voltage
Drain Current-Continuous
Drain Current-Continuous(T
C
=100℃)
Pulsed Drain Current
Maximum Power Dissipation
Derating factor
Single pulse avalanche energy
(Note 5)
Operating Junction and Storage Temperature Range
E
AS
Symbol
V
DS
V
GS
I
D
I
D
(100℃)
Limit
-40
±20
-50
-35
-115
65
0.52
840
-55 To 150
Unit
V
V
A
A
A
W
W/℃
mJ
℃
I
DM
P
D
T
J
,T
STG
HTTP://www.gofordsemi.com
TEL：0755-29961262
FAX：0755-29961466
Page 1
GOFORD
Thermal Characteristic
Thermal Resistance, Junction-to-Case(Note 2)
R
θJC
1.92
45P40
℃
/W
Electrical Characteristics (T
C
=25℃unless otherwise noted)
Parameter
Off Characteristics
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate-Body Leakage Current
On Characteristics (Note 3)
Gate Threshold Voltage
Drain-Source On-State Resistance
Forward Transconductance
Dynamic Characteristics (Note4)
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Switching Characteristics (Note 4)
Turn-on Delay Time
Turn-on Rise Time
Turn-Off Delay Time
Turn-Off Fall Time
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Drain-Source Diode Characteristics
Diode Forward Voltage (Note 3)
Diode Forward Current (Note 2)
Reverse Recovery Time
Reverse Recovery Charge
Forward Turn-On Time
Symbol
BV
DSS
I
DSS
I
GSS
V
GS(th)
R
DS(ON)
g
FS
C
lss
C
oss
C
rss
t
d(on)
t
r
t
d(off)
t
f
Q
g
Q
gs
Q
gd
V
SD
I
S
t
rr
Qrr
t
on
Condition
V
GS
=0V I
D
=-250μA
V
DS
=-40V,V
GS
=0V
V
GS
=±20V,V
DS
=0V
V
DS
=V
GS
,I
D
=-250μA
V
GS
=-10V, I
D
=-14A
V
DS
=-10V,I
D
=-20A
Min
-40
-
-
-1.2
-
-
-
-
-
-
Typ
-
-
-
-1.9
9
50
5020
551
374
9.4
20
55
30
77
19
21
Max
-
-1
±100
-2.5
13
-
-
-
-
-
-
-
-
Unit
V
μA
nA
V
mΩ
S
PF
PF
PF
nS
nS
nS
nS
nC
nC
nC
V
DS
=-20V,V
GS
=0V,
F=1.0MHz
V
DD
=-20V, R
L
=1Ω，
V
GS
=-10V,R
G
=3Ω
-
-
-
-
-
-
-
-
V
DS
=-20,I
D
=-14A,
V
GS
=-10V
V
GS
=0V,I
S
=-10A
TJ = 25°C, IF =- 10A
di/dt = -100A/μs(Note3)
-1.2
-
49
47
-50
V
A
nS
nC
-
-
Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD)
Notes:
1.
Repetitive Rating: Pulse width limited by maximum junction temperature.
2.
Surface Mounted on FR4 Board, t
≤
10 sec.
3.
Pulse Test: Pulse Width
≤
300μs, Duty Cycle
≤
2%.
4.
Guaranteed by design, not subject to production
5.
E
AS
condition: Tj=25℃,V
DD
=-20V,V
G
=-10V,L=1mH,Rg=25Ω,I
AS
=41A
HTTP://www.gofordsemi.com
TEL：0755-29961262
FAX：0755-29961466
Page 2
GOFORD
Test Circuit
1) E
AS
Test Circuit
45P40
2) Gate Charge Test Circuit
3) Switch Time Test Circuit
HTTP://www.gofordsemi.com
TEL：0755-29961262
FAX：0755-29961466
Page 3
GOFORD
Typical Electrical and Thermal Characteristics (Curves)
45P40
Normalized On-Resistance
I
D
- Drain Current (A)
Vds Drain-Source Voltage (V)
T
J
-Junction Temperature(℃)
Figure 1 Output Characteristics
Figure 4 Rdson-Junction Temperature
Vgs Gate-Source Voltage (V)
Vgs Gate-Source Voltage (V)
I
D
- Drain Current (A)
Qg Gate Charge (nC)
Figure 2 Transfer Characteristics
Rdson On-Resistance(mΩ)
I
s
- Reverse Drain Current (A)
Figure 5 Gate Charge
I
D
- Drain Current (A)
Vsd Source-Drain Voltage (V)
Figure 3 Rdson-
Drain Current
Figure 6 Source- Drain Diode Forward
HTTP://www.gofordsemi.com
TEL：0755-29961262
FAX：0755-29961466
Page 4
GOFORD
45P40
C Capacitance (pF)
Vds Drain-Source Voltage (V)
T
J
-Junction Temperature(℃)
Figure 7 Capacitance vs Vds
Figure 9 BV
DSS
vs Junction Temperature
I
D
- Drain Current (A)
I
D
- Drain Current (A)
Vds Drain-Source Voltage (V)
T
J
-Junction Temperature(℃)
Figure 8 Safe Operation Area
Figure 10 ID Current Derating vs Junction
Temperature
r(t),Normalized Effective
Transient Thermal Impedance
Square Wave Pluse Duration(sec)
Figure 11 Normalized Maximum Transient Thermal Impedance
HTTP://www.gofordsemi.com
TEL：0755-29961262
FAX：0755-29961466
Page 5
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