BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
657 SERIES
Standard
P/N
High-Performance Heat Sinks for Vertical Board Mounting
Maximum
Footprint
in. (mm)
Thermal Performance at Typical Load
Natural
Forced
Convection
Convection
41°C @ 6W
38°C @ 6W
32°C @ 6W
25°C @ 6W
3.7°C/W @ 200 LFM
3.3°C/W @ 200 LFM
2.9°C/W @ 200 LFM
2.7°C/W @ 200 LFM
TO-220, TO-247, TO-218
Height Above
PC Board “A”
in. (mm)
Weight
lbs (grams)
0.0515 (23.36)
0.0760 (34.60)
0.1030 (47.00)
0.1250 (57.00)
657-10ABEP
1.000 (25.4)
1.650 (41.9) x 1.000 (25.4)
657-15ABEP
1.500 (38.1)
1.650 (41.9) x 1.000 (25.4)
657-20ABEP
2.000 (50.8)
1.650 (41.9) x 1.000 (25.4)
657-25ABEP
2.500 (63.5)
1.650 (41.9) x 1.000 (25.4)
Wave-solderable pins.
Material: Aluminum, Black Anodized
MECHANICAL DIMENSIONS
657 SERIES
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
657 SERIES
(EXTRUSION PROFILE 6533)
Dimensions: in. (mm)
2
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