65HVD72/75/78
65HVD7x 3.3-V Supply RS-485 With IEC ESD protection
Features
1
Applications
•
•
•
Factory Automation
Telecommunications Infrastructure
Motion Control
•
•
•
•
•
•
•
•
•
Small-size VSSOP Packages Save Board Space,
or SOIC for Drop-in Compatibility
Bus I/O Protection
– >±15 kV HBM Protection
– >±12 kV IEC 61000-4-2 Contact Discharge
– >±4 kV IEC 61000-4-4 Fast Transient Burst
Extended Industrial Temperature Range
–40°C to 125°C
Large Receiver Hysteresis (80 mV) for Noise
Rejection
Low Unit-Loading Allows Over 200 Connected
Nodes
Low Power Consumption
– Low Standby Supply Current: < 2 µA
– I
CC
< 1 mA Quiescent During Operation
5-V Tolerant Logic Inputs Compatible With
3.3-V or 5-V Controllers
Signaling Rate Options Optimized for:
250 kbps, 20 Mbps, 50 Mbps
Glitch Free Power-Up and Power-Down Bus
Inputs and Outputs
Description
These devices have robust 3.3-V drivers and
receivers in a small package for demanding industrial
applications. The bus pins are robust to ESD events
with high levels of protection to Human-Body Model
and IEC Contact Discharge specifications.
Each of these devices combines a differential driver
and a differential receiver which operate from a single
3.3-V power supply. The driver differential outputs
and the receiver differential inputs are connected
internally to form a bus port suitable for half-duplex
(two-wire bus) communication. These devices feature
a wide common-mode voltage range making the
devices suitable for multi-point applications over long
cable runs. These devices are characterized from
–40°C to 125°C.
Typical Application Diagram
R
RE
DE
D
D
R
A
B
R
T
R
T
A
B
D
R
R
RE
DE
D
A
B
A
B
R
D
R
D
R RE DE D
R RE DE D
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65HVD72/75/78
Pin Configuration and Functions
D Package
8-Pin SOIC
Top View
DGK Package
8-Pin VSSOP
Top View
R
RE
DE
1
2
3
8
7
6
V
CC
B
A
R
RE
DE
1
2
3
8
7
6
V
CC
B
A
D
4
5
GND
D
4
5
GND
No t to scale
No t to scale
DRB Package
8-Pin VSON
Top View
R
RE
1
2
8
7
V
CC
B
DE
D
3
4
6
5
A
GND
No t to scale
Pin Functions
PIN
NAME
A
B
D
DE
GND
R
RE
V
CC
NUMBER
6
7
4
3
5
1
2
8
TYPE
Bus I/O
Bus I/O
Digital input
Digital input
Reference potential
Digital output
Digital input
Supply
DESCRIPTION
Driver output or receiver input (complementary to B)
Driver output or receiver input (complementary to A)
Driver data input
Active-high driver enable
Local device ground
Receive data output
Active-low receiver enable
3-V to 3.6-V supply
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65HVD72/75/78
Absolute Maximum Ratings
over recommended operating range (unless otherwise specified)
Supply voltage, V
CC
Voltage at A or B inputs
Voltage at D, DE, or RE
Voltage input, transient pulse, A and B, through 100
Ω
Receiver output current
Junction temperature, T
J
Continuous total power dissipation
Storage temperature, T
stg
(1)
–65
(1)
MIN
–0.5
–13
–0.3
–100
–24
MAX
5
16.5
5.7
100
24
170
UNIT
V
mA
°C
°C
See
Power Dissipation
150
Stresses beyond those listed under
Absolute Maximum Ratings
may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under
Recommended Operating
Conditions
is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
ESD Ratings
VALUE
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins
(1)
UNIT
±8000
±1500
±300
±12000
±12000
±4000
±15000
V
Charged device model (CDM), per JEDEC specification JESD22-C101 or
ANSI/ESDA/JEDEC JS-002, all pins
(2)
V
(ESD)
Electrostatic
discharge
JEDEC Standard 22, Test Method A115 (Machine Model), all pins
IEC 61000-4-2 ESD (Air-Gap Discharge), bus pins and GND
IEC 61000-4-2 ESD (Contact Discharge), bus pins and GND
IEC 61000-4-4 EFT (Fast transient or burst) bus pins and GND
IEC 60749-26 ESD (Human Body Model), bus pins and GND
(1)
(2)
(3)
(3)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
By inference from contact discharge results, see
Application and Implementation.
Recommended Operating Conditions
MIN
V
CC
V
I
V
IH
V
IL
V
ID
I
O
I
O
R
L
C
L
1/t
UI
T
A
T
J
(1)
(2)
(3)
(3)
(1)
NOM
3.3
MAX
3.6
12
V
CC
0.8
12
60
8
UNIT
V
V
V
V
V
mA
mA
Ω
pF
Supply voltage
Input voltage at any bus terminal (separately or common mode)
(2)
High-level input voltage (driver, driver enable, and receiver enable inputs)
Low-level input voltage (driver, driver enable, and receiver enable inputs)
Differential input voltage
Output current, driver
Output current, receiver
Differential load resistance
Differential load capacitance
65HVD72
Signaling rate
65HVD75
65HVD78
Operating free-air temperature (See
Thermal Information)
Junction temperature
3
–7
2
0
–12
–60
–8
54
60
50
250
20
50
kbps
Mbps
Mbps
°C
°C
–40
–40
125
150
Exposure to conditions beyond the recommended operation maximum for extended periods may affect device reliability.
The algebraic convention, in which the least positive (most negative) limit is designated as minimum, is used in this data sheet.
Operation is specified for internal (junction) temperatures up to 150°C. Self-heating due to internal power dissipation should be
considered for each application. Maximum junction temperature is internally limited by the thermal shutdown (TSD) circuit which disables
the driver outputs when the junction temperature reaches 170°C.
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65HVD72/75/78
Thermal Information
65HVD72, 65HVD75, 65HVD78
THERMAL METRIC
(1)
R
θJA
R
θJC(top)
R
θJC(bot)
R
θJB
ψ
JT
ψ
JB
(1)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-case (bottom) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
D (SOIC)
110.7
54.7
—
51.3
9.2
50.7
DGK (VSSOP)
8 PINS
168.7
62.2
—
89.5
7.4
87.9
40
49.6
3.9
15.5
0.6
15.7
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
DRB (VSON)
UNIT
For more information about traditional and new thermal metrics, see the
Semiconductor and IC Package Thermal Metrics
application
report.
Electrical Characteristics
over recommended operating range (unless otherwise specified)
PARAMETER
TEST CONDITIONS
R
L
= 60
Ω,
375
Ω
on each output to
–7 V to 12 V
|V
OD
|
Driver differential output
R
L
= 54
Ω
(RS-485)
voltage magnitude
R
L
= 100
Ω
(RS-422), T
J
≥
0°C
V
CC
≥
3.2 V
Change in magnitude of
driver differential output R
L
= 54
Ω,
C
L
= 50 pF
voltage
Steady-state common-
mode output voltage
Change in differential
driver output common-
mode voltage
Peak-to-peak driver
common-mode output
voltage
Differential output
capacitance
Positive-going receiver
differential input voltage
threshold
Negative-going receiver
differential input voltage
threshold
Receiver differential
input voltage threshold
hysteresis (V
IT+
– V
IT–
)
Receiver high-level
output voltage
Receiver low-level
output voltage
Driver input, driver
enable, and receiver
enable input current
Receiver output high-
impedance current
Driver short-circuit
output current
V
O
= 0 V or V
CC
, RE at V
CC
I
OH
= –8 mA
I
OL
= 8 mA
–2
–1
–160
See
(1)
MIN
See
Figure 10
1.5
1.5
2
–50
See
Figure 11
1
–50
TYP
2
2
2.5
0
V
CC
/2
0
MAX
UNIT
V
Δ|V
OD
|
V
OC(SS)
ΔV
OC
50
3
50
mV
V
mV
Center of two 27-Ω load resistors
Center of two 27-Ω load resistors
V
OC(PP)
C
OD
V
IT+
Center of two 27-Ω load resistors
200
15
–70
–20
mV
pF
mV
V
IT–
–200
–150
See
(1)
mV
V
HYS
V
OH
V
OL
I
I
I
OZ
I
OS
50
2.4
80
V
CC
– 0.3
0.2
0.4
2
1
160
mV
V
V
µA
µA
mA
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65HVD72/75/78
Electrical Characteristics (continued)
over recommended operating range (unless otherwise specified)
PARAMETER
TEST CONDITIONS
V
CC
= 3 to 3.6 V or
V
CC
= 0 V
DE at 0 V
Driver and receiver
enabled
Supply current
(quiescent)
Driver enabled,
receiver disabled
Driver disabled,
receiver enabled
Driver and receiver
disabled
Supply current
(dynamic)
T
TSD
Thermal shutdown
junction temperature
65HVD72
65HVD75
65HVD78
V
I
= 12 V
V
I
= –7 V
V
I
= 12 V
V
I
= –7 V
–267
–100
MIN
TYP
75
–40
240
–180
750
300
600
0.1
950
500
µA
800
2
333
MAX
150
µA
UNIT
I
I
Bus input current
(disabled driver)
DE = V
CC
, RE = GND
No load
DE = V
CC
, RE = V
CC
No load
DE = GND, RE = GND
No load
DE = GND, D = open
RE = V
CC
, No load
I
CC
See
Typical Characteristics
170
°C
Power Dissipation
PARAMETER
Unterminated
Power Dissipation
driver and receiver enabled,
V
CC
= 3.6 V, T
J
= 150°C
50% duty cycle square-wave signal at
RS-422 load
signaling rate:
•
65HVD72 at 250 kbps
•
65HVD75 at 20 Mbps
•
65HVD78 at 50 Mbps
RS-485 load
TEST CONDITIONS
R
L
= 300
Ω
C
L
= 50 pF
(driver)
R
L
= 100
Ω
C
L
= 50 pF
(driver)
R
L
= 54
Ω
C
L
= 50 pF
(driver)
65HVD72
65HVD75
65HVD78
65HVD72
65HVD75
65HVD78
65HVD72
65HVD75
65HVD78
VALUE
120
160
200
155
195
230
190
230
260
mW
mW
mW
UNIT
PD
Switching Characteristics: 250 kbps Device (65HVD72) Bit Time
≥
4 µs
over recommended operating conditions
PARAMETER
DRIVER
t
r
, t
f
t
PHL
, t
PLH
t
SK(P)
t
PHZ
, t
PLZ
t
PZH
, t
PZL
RECEIVER
t
r
, t
f
t
PHL
, t
PLH
t
SK(P)
t
PLZ
, t
PHZ
Receiver output rise or fall time
Receiver propagation delay time
Receiver pulse skew, |t
PHL
– t
PLH
|
Receiver disable time
Driver enabled
Driver disabled
5
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Driver differential output rise or
fall time
Driver propagation delay
Driver pulse skew, |t
PHL
– t
PLH
|
Driver disable time
Driver enable time
0.3
R
L
= 54
Ω
C
L
= 50 pF
See
Figure 12
0.7
0.7
0.1
1.2
1
0.2
0.4
1
9
30
100
15
100
50
8
µs
µs
µs
µs
µs
Receiver enabled
Receiver disabled
See
Figure 13
and
Figure 14
0.5
3
12
ns
ns
ns
ns
ns
µs
C
L
= 15 pF
See
Figure 15
75
3
40
t
PZL(1)
, t
PZH(1)
,
Receiver enable time
t
PZL(2)
, t
PZH(2)
See
Figure 16
See
Figure 17
20
3
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