M8 NO CLEAN SOLDER PASTE
FEATURES
Low Voiding: <5% on BGA and <10% on BTC Components
Excellent Print Transfer Efficiencies on 01005 Components
Eliminates HiP Defects
REACH and RoHS* Compliant
Formulated for use with T4 and Finer Powders
Powerful Wetting on Lead-Free Surface Finishes
Approved for use with MPM Enclosed Flow
Print Speeds up to 200mm/sec
Passes Bono Testing
DESCRIPTION
An evolution of the highly successful NC258 platform, M8 brings
no clean solder paste performance to the next level. Developed in
combination with T4 and finer mesh leaded and lead-free alloy
powders, M8 provides stable transfer efficiencies required for
today’s UFP and umBGA devices, reducing DPMO on the most
challenging applications. A novel activator system provides
powerful, durable wetting action accommodating a wide range of
profiling processes and techniques. M8 activators will reduce
wetting related defects such as HiP (head-in-pillow) and provide
smooth shiny joints. M8 has reduced BGA and BTC voiding to as
low as <5% on BGA and <10% on BTC ground pads.
CHARACTERISTICS
Low Halogen
Content
Pause to Print
Capabilities
Print Volume
HANDLING & STORAGE
Parameter
Sealed Refrigerated
Shelf Life
Sealed Unrefrigerated
Shelf Life
Time
1 year
*3 months
Temperature
0°C-12°C (32°F-55°F)
< 25°C (< 77°F)
Do not add used paste to unused paste. Store used paste
separately; keep unused paste tightly sealed with internal plug
or end cap in place. After opening, solder paste shelf life is
environment and application dependent. See AIM’s paste
handling guidelines for further information. *Sealed
unrefrigerated shelf life of REL22
TM
and REL61
TM
alloys is 1
month at < 25°C (< 77°F).
CLEANING
Pre-Reflow: AIM DJAW-10 effectively removes M8 solder
paste from stencils while in process. DJAW-10 can be hand
applied or used in under stencil wipe equipment. DJAW-10
will not dry M8 and will enhance transfer properties. Do not
over-apply DJAW-10. Do not apply DJAW-10 to stencil
topside. Isopropanol (IPA) is not recommended in process,
but may be used as a final stencil rinse.
Post-Reflow Flux Residue: M8 residues can remain on the
assembly after reflow and do not require cleaning. Where
cleaning is mandated, AIM has worked closely with industry
partners to ensure that M8 residues can be effectively removed
with common defluxing agents. Contact AIM for cleaning
compatibility information.
Document Rev # NF18
Page 1 of 3
Reliability
Low Voiding
on BGAs
Residue
Appearance
Pin Probability
Low Voiding
on BTCs
Mitigates HiP
NC258
*Lead-free
alloys
NC520
M8
REFLOW PROFILE
Detailed profile information may be found at
http://www.aimsolder.com/reflow-profile-supplements.
Contact AIM for additional
information.
PRINTING
Parameter
Squeegee Pressure
Squeegee Speed
Snap-off Distance
PCB Separation Distance
PCB Separation Speed
TEST DATA SUMMARY
Name
IPC Flux
Classification
IPC Flux
Classification
Name
Test Method
J-STD-004
J-STD-004B 3.3.1
Test Method
Typical
Results
Results
ROL0
ROL1
Image
Recommended Initial Printer Settings - Dependent on PCB and Pad Design
Recommended Initial Settings
0.4 - 0.7kg/25mm
13 – 152 mm/second
On Contact 0.00 mm
0.75 - 2.0 mm
3 - 20 mm/second
Copper Mirror
J-STD-004B 3.4.1.1
IPC-TM-650 2.3.32
LOW
Before
Corrosion
J-STD-004B 3.4.1.2
IPC-TM-650 2.6.15
PASS
After
Quantitative Halides
J-STD-004B 3.4.1.3
IPC-TM-650
2.3.28.1
J-STD-004B 3.5.1.1
IPC-TM-650 2.3.33
J-STD-004B 3.5.1.2
IPC-TM-650
2.3.35.1
Br: 0.24%
Cl: 0.0%
Typical
Qualitative Halides,
Silver Chromate
PASS
Qualitative Halides,
Fluoride Spot
No fluoride
Document Rev # NF18
Page 2 of 3
Name
Test Method
Typical
Results
13
12
Image
Surface Insulation
Resistance
J-STD-004B 3.4.1.4
IPC-TM-650 2.6.3.7
All
measurements
on test
patterns
exceed
100 MΩ
11
10
9
8
7
6
5
4
3
0
1
2
3
Time, day
258M8 SAC305 1A
258M8 SAC305 2A
258M8 SAC305 3A
control 1A
control 2A
258M8 SAC305 1B
258M8 SAC305 2B
258M8 SAC305 3B
control 1B
control 2B
258M8 SAC305 1C
258M8 SAC305 2C
258M8 SAC305 3C
control 1C
control 2C
258M8 SAC305 1D
258M8 SAC305 2D
258M8 SAC305 3D
control 1D
control 2D
4
5
6
7
Bono Testing
Oxygen Bomb
Halogen Testing
Electrochemical
Migration
Flux Solids,
Nonvolatile
Determination
Acid Value
Determination
Viscosity
Visual
Slump
EN14582:2007
SW 9056 SW 5050
J-STD-004B 3.4.1.5
IPC-TM-650
2.6.14.1
J-STD-004B 3.4.2.1
IPC-TM-650 2.3.34
J-STD-004B 3.4.2.2
IPC-TM-650 2.3.13
J-STD-004B 3.4.2.4
IPC-TM-650 2.4.34
J-STD-004B 3.4.2.5
J-STD-005A 3.6
IPC-TM-650 2.4.35
PASS
Fc<8.0 Typical
Br 265 mg/Kg
Cl <122 mg/Kg
PASS
94.8%
Typical
136
mgKOH/g flux
Typical
400-1000 Kcps
PASS
PASS
Solder Ball
J-STD-005A 3.7
IPC-TM-650 2.4.43
PASS
Log SIR (Ohm)
15 min
4 hrs
Tack M8 SAC305 88.5 T4
Tack
J-STD-005A 3.8
IPC-TM-650 2.4.44
36.1 gf
Time 0
Typical
100.00
50.00
0.00
0
2
4
6
8
10
Document Rev # NF18
Page 3 of 3
Mouser Electronics
Authorized Distributor
Click to View Pricing, Inventory, Delivery & Lifecycle Information:
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:
84351 84352
