PRODUCT DATASHEET
A250 Series PTC Devices
A250 Series PTC Devices
Description
The JDTFUSE A250 Series is designed to protect
against short duration high voltage fault currents (power
cross or power induction surge) typically found in
telecom applications (250Vrms). The series can be used
to help telecom networking equipment meet the
protection requirements specified in ITU K.20 and K.21.
Features
●
0.08 - 0.18A hold current range, 60VDC operating
voltage
●
250VAC interrupt rating
●
Fast time-to-trip
●
Binned and sorted narrow resistance ranges available
●
RoHS compliant, Lead-Free and Halogen-Free*
Agency Approvals
Agency
File Number
E472196
pending
Applications
●
Customer Premises Equipment (CPE)
●
Central Office (CO)/telecom centers
●
LAN/WAN equipment
●
Access equipment
Regulation
Standard
2002/95/EC
EN14582
JDT FUSE Industrial Corp.
Page 1/6
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A250 Series PTC Devices
Performance Specification
Model
A250-080
A250-110
A250-120
A250-145
A250-180
A250-200
I
hold
@25°C
(A)
@25°C
(A)
I
trip
Operating Interrupt
(V dc)
(Vrms)
V
max
60
60
60
60
60
60
V
max
250
250
250
250
250
250
I
max
(A)
Typ.
(W)
P
d
Maximum
Time To Trip
Current
(A)
Time
(Sec)
( )
Resistance
R
i min
12.0
6.0
6.0
3.0
1.0
1.5
R
1max
( )
0.080
0.110
0.120
0.145
0.180
0.200
0.160
0.220
0.240
0.290
0.360
0.400
3.0
3.0
3.0
3.0
10.0
10.0
1.00
1.00
1.00
1.00
1.50
1.50
0.35
1.00
1.00
1.00
1.00
1.00
3.00
1.10
1.50
2.50
18.00
15.00
33.0
16.0
14.0
12.0
2.50
4.50
I
hold
= Hold Current. Maximum current device will not trip in 25°C still air.
I
trip
= Trip Current. Minimum current at which the device will always trip in 25°C still air.
V
max
= Maximum operating voltage device can withstand without damage at rated current (Imax).
I
max
= Maximum fault current device can withstand without damage at rated voltage (V max).
P
d
= Power dissipation when device is in the tripped state in 25°C still air environment at rated voltage.
R
i min/max
= Minimum/Maximum device resistance prior to tripping at 25°C.
R
1max
= Maximum device resistance is measured one hour post reflow.
CAUTION : Operation beyond the specified ratings may result in damage and possible arcing and flame.
Environmental Specifications
Test
Passive aging
Humidity aging
Thermal shock
Vibration
Conditions
+85°C, 1000 hrs.
+85°C, 85% R.H. , 168 hours
+85°C to -40°C, 20 times
MIL-STD-202,Method 215
MIL-STD-202,Method 201
Resistance change
±5% typical
±5% typical
±33% typical
No change
No change
Resistance to solvent
Ambient operating conditions : - 40 °C to +85 °C
Maximum surface temperature of the device in the tripped state is 125 °C
JDT FUSE Industrial Corp.
Page 2/6
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A250 Series PTC Devices
Thermal Derating Curve
Derating Curves for A250 Series
180
160
Percentage of Rated Current
140
120
100
80
60
40
20
-40 -30 -20
-10
0
10
20
30
40
50
60
70
80
Temperature (°C )
Average Time-Current Curve
1000
A250-080
100
TIME IN SECOND
10
A250-110
A250-120
1
A250-145
0.1
A250-180
0.01
0
1
2
3
CURRENT IN AMPERES
JDT FUSE Industrial Corp.
Page 3/6
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A250 Series PTC Devices
I
hold
Versus Temperature
Model
A250-080
A250-110
A250-120
A250-145
A250-180
A250-200
Maximum ambient operating temperature (T
mao
) vs. hold current (I
hold
)
- 40°C
- 20°C
0°C
25°C
40°C
50°C
60°C
70°C
85°C
0.124
0.171
0.186
0.225
0.279
0.264
0.110
0.151
0.165
0.199
0.247
0.243
0.095
0.131
0.143
0.172
0.213
0.220
0.080
0.110
0.120
0.145
0.180
0.200
0.066
0.091
0.099
0.119
0.147
0.182
0.059
0.081
0.088
0.106
0.131
0.175
0.051
0.071
0.077
0.093
0.115
0.163
0.044
0.061
0.066
0.080
0.099
0.154
0.033
0.046
0.050
0.060
0.074
0.143
Soldering Parameters
TP
260
Ramp-up
TP 20~40 S
Critical Zone
TL to TP
TL
217
Tsmax
tL
60~150 s
200
Temperature (°C )
Tsmin
Ramp-down
150
ts
Preheat 60~180 s
25
t 25°C to peak
Time
Profile Feature
Average Ramp-Up Rate
(Ts max to T p)
Preheat
-Temperature Min(Ts min)
-Temperature Max(Ts max)
-Time(Ts min to Ts max)
Time maintained above:
-Temperature(TL)
-Time(tL)
Peak Temperature(Tp)
Ramp-Down Rate
Pb-Free Assembly
3℃/second mac.
150℃
200℃
60~180 seconds
217℃
60~150 seconds
260℃
6℃/second max.
Recommended reflow methods: IR, vapor phase oven,
hot air oven, N2 environment for lead-free
Recommended maximum paste thickness is 0.25mm
Devices can be cleaned using standard industry methods
and solvents.
Note 1:All temperature refer to topside of the package,
measured on the package body surface.
Note 2: If reflow temperatures exceed the recommended
profile, devices may not meet the performance
requirements.
Page 4/6
Time 25℃ to Peak Temperature 8 minutes max
Storage Condition
0℃~35℃,≤70%RH
JDT FUSE Industrial Corp.
www.jdtfuse.com
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