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A600-150

最大电压:600V 跳闸电流:300mA

器件类别:电路保护    PTC自恢复保险丝   

厂商名称:集电通(JDTfuse)

厂商官网:http://www.jdtfuse.com/about/

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器件参数
参数名称
属性值
最大电压
600V
保持电流
150mA
最大电流
3A
跳闸电流
300mA
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PRODUCT DATASHEET
A600 Series PTC Devices
A600 Series PTC Devices
Description
The JDTFUSE A600 Series is designed to protect
against power fault events typically found in telecom
applications. This series is designed to be used in
applications that need to meet the requirements of
GR–1089-CORE and UL60950/EN60950/IEC60950.
These resettable devices also help to meet the
requirements of ITU K.20, K.21 and K.44.
Features
0.15 - 0.16A hold current range, 60VDC operating
voltage
600VAC interrupt rating
Fast time-to-trip
Binned and sorted narrow resistance ranges available
RoHS compliant, Lead-Free and Halogen-Free*
Agency Approvals
Agency
File Number
E472196
pending
Applications
Secondary overcurrent protection for:
Central Office Equipment(CO)
Customer Premises Equipment(CE)
Alarm systems
Set Top Boxes(STB)
Voice over IP(VOIP)
Subscriber Line Interface Circuit (SLIC)
Regulation
Standard
2002/95/EC
EN14582
JDT FUSE Industrial Corp.
Page 1/6
www.jdtfuse.com
A600 Series PTC Devices
Performance Specification
Model
A600-150
A600-160
I
hold
@25°C
(A)
@25°C
(A)
I
trip
Operating Interrupt
(V dc)
(Vrms)
V
max
60
60
V
max
600
600
I
max
(A)
Typ.
(W)
P
d
Maximum
Time To Trip
Current
(A)
Time
(Sec)
( )
Resistance
R
i min
6.00
4.00
R
1max
( )
0.150
0.160
0.300
0.320
3.0
3.0
1.00
1.00
1.00
1.00
5.00
7.00
22.00
18.00
I
hold
= Hold Current. Maximum current device will not trip in 25°C still air.
I
trip
= Trip Current. Minimum current at which the device will always trip in 25°C still air.
V
max
= Maximum operating voltage device can withstand without damage at rated current (Imax).
I
max
= Maximum fault current device can withstand without damage at rated voltage (V max).
P
d
= Power dissipation when device is in the tripped state in 25°C still air environment at rated voltage.
R
i min/max
= Minimum/Maximum device resistance prior to tripping at 25°C.
R
1max
= Maximum device resistance is measured one hour post reflow.
CAUTION : Operation beyond the specified ratings may result in damage and possible arcing and flame.
Environmental Specifications
Test
Passive aging
Humidity aging
Thermal shock
Vibration
 
 
 
 
 
 
 
 
 
Conditions
+85°C, 1000 hrs.
+85°C, 85% R.H. , 168 hours
+85°C to -40°C, 20 times
MIL-STD-202,Method 215
MIL-STD-202,Method 201
Resistance change
±5% typical
±5% typical
±33% typical
No change
No change
Resistance to solvent
 
Ambient operating conditions : - 40 °C to +85 °C
Maximum surface temperature of the device in the tripped state is 125 °C
JDT FUSE Industrial Corp.
Page 2/6
www.jdtfuse.com
A600 Series PTC Devices
Thermal Derating Curve
180
160
Percentage of Rated Current
140
120
100
80
60
40
20
-40 -30 -20
-10
0
10
20
30
40
50
60
70
80
Temperature (°C )
Average Time-Current Curve
100
TIME IN SECOND
10
1
0.1
0
0.5
1
D600-150
1.5
2
D600-160
2.5
3
CURRENT IN AMPERES
I
hold
Versus Temperature
Model
A600-150
A600-160
Maximum ambient operating temperature (T
mao
) vs. hold current (I
hold
)
- 40°C
- 20°C
0°C
25°C
40°C
50°C
60°C
70°C
85°C
0.233
0.249
0.206
0.219
0.178
0.190
0.150
0.160
0.124
0.132
0.110
0.117
0.096
0.103
0.083
0.088
0.062
0.066
JDT FUSE Industrial Corp.
Page 3/6
www.jdtfuse.com
A600 Series PTC Devices
Soldering Parameters
TP
260
Ramp-up
TP 20~40 S
Critical Zone
TL to TP
TL
217
Tsmax
tL
60~150 s
200
Temperature (°C )
Tsmin
Ramp-down
150
ts
Preheat 60~180 s
25
t 25°C to peak
Time
Profile Feature
Average Ramp-Up Rate
(Ts max to T p)
Preheat
-Temperature Min(Ts min)
-Temperature Max(Ts max)
-Time(Ts min to Ts max)
Time maintained above:
-Temperature(TL)
-Time(tL)
Peak Temperature(Tp)
Ramp-Down Rate
Pb-Free Assembly
3℃/second mac.
150℃
200℃
60~180 seconds
217℃
60~150 seconds
260℃
6℃/second max.
Time 25℃ to Peak Temperature 8 minutes max
Storage Condition
0℃~35℃,≤70%RH
Recommended reflow methods: IR, vapor phase oven, hot air oven, N2 environment for lead-free
Recommended maximum paste thickness is 0.25mm
Devices can be cleaned using standard industry methods and solvents.
Note 1:All temperature refer to topside of the package, measured on the package body surface.
Note 2: If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements.
JDT FUSE Industrial Corp.
Page 4/6
www.jdtfuse.com
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