ABS205 THRU ABS210
2.0A Miniature Glass Passivated
Single-Phase Surface Mount
Bridge Rectifiers-50-1000V
Features
•
Surge overload ratings to 50 amperes peak.
•
Save space on printed circuit board.
•
Ideal for automated replacement.
•
Reliable low cost construction utilizing molded plastic
•
•
•
technology results in inexpensive product.
Glass passivated chip junctions.
.
Lead-free parts meet RoHS requirments.
Suffix "-H" indicates Halogen free part.
Package outline
ABS
0.268(6.8)
Mechanical data
•
Epoxy:UL94-V0 rated flame retardant
•
Case : Molded plastic, ABS
•
Terminals : Solder plated, solderable per
MIL-STD-750, Method 2026
•
Polarity : marked on body
•
Mounting Position : Any
Maximum ratings and Electrical Characteristics
(AT
CHARACTERISTICS
Maximum Recurrent Peak Reverse Voltage
Maximum RMS Voltage
Maximum DC Blocking Voltage
Maximum Average Forward
Rectified Current
Peak Forward Surge Current
8.3ms Single Half Sine-Wave
Super Imposed on Rated Load (JEDEC Method)
Maximum Forward Voltage at 2.0A DC
Maximum DC Reverse Current
at Rated DC Bolcking Voltage
I
2
t Rating for Fusing(t<8.3ms)
Typical Junction Capacitance Per Element(Note1)
Typical Thermal Resistance (Note2)
Operating Temperature Range
Storage Temperature Range
@T
J
=25℃
@T
J
=125℃
V
F
I
R
I
2
t
C
J
R
θJA
T
J
T
STG
I
FSM
@T
J
=25℃
SYMBOL ABS205
V
RRM
V
RMS
V
DC
I
(AV)
50
35
50
ABS21
100
70
100
ABS22
200
140
200
T
A
=25
o
C unless otherwise noted)
ABS24
400
280
400
2.0
ABS26
600
420
600
ABS28
800
560
800
ABS210
1000
700
1000
UNIT
V
V
V
A
50
0.236(6.0)
A
1.1
10
500
10.37
15
60
-55 to +150
-55 to +150
V
μA
A
2
s
pF
℃/W
℃
℃
Note:1.Measured at 1.0MHz and applied reverse voltage of 4.0V DC
2.Thermal resistance from junction to ambient mounted on P.C.B with 0.5*0.5"(13*13mm)copper pads.
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Page 1
Ver2.1
ABS205 THRU ABS210
2.0A Miniature Glass Passivated
Single-Phase Surface Mount
Bridge Rectifiers-50-1000V
Rating and characteristic curves
FIG.1-TYPICAL FORWARD CURRENT
DERATING CURVE
2.8
2.4
2.0
1.8
1.4
1.0
0.8
0.4
FIG.2-MAXIMUM NON-REPETITIVE FORWARD
SURGE CURRENT
60
PEAK FORWARD SURGE CURRENT,
AMPERES
50
40
30
20
10
0
1
2
5
10
20
50
100
NUMBER OF CYCLES AT 60Hz
SINGLE SINE-WAVE
JEDEC METHOD
AVERAGE FORWARD CURRENT,(A)
sine wave R-load free in air
FIG.3-TYPICAL FORWARD
CHARACTERISTICS
INSTANTANEOUS FORWARD CURRENT,(A)
REVERSE LEAKAGE CURRENT, (m
A)
FIG.4-TYPICAL REVERSE
CHARACTERISTICS
FIG.5- TYPICAL JUNCTION CAPACITANCE
1000
JUNCTION CAPACITANCE
(pF)
100
TA=25
℃
f=1MHz
10
0.1
1
10
100
1000
REVERSE VOLTAGE
(V)
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Page 2
Ver2.1
ABS205 THRU ABS210
2.0A Miniature Glass Passivated
Single-Phase Surface Mount
Bridge Rectifiers-50-1000V
Pinning information
Simplified outline
Symbol
+
~
-
~
Marking
Type numbe r
ABS205
ABS21
ABS22
ABS24
ABS26
ABS28
ABS210
M arking code
ABS205
ABS21
ABS22
ABS24
ABS26
ABS28
ABS210
1.For
Halogen Device
Example
2.For
Halogen-free Device
H
ABS210
ABS210
Suggested solder pad layout
A
D
B
C
Dimensions in inches and (millimeters)
PACKAGE
ABS
A
0.024 (0.60)
B
0.024 (0.60)
C
0.132 (3.35)
D
0.193 (4.90)
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Page 3
Ver2.1
ABS205 THRU ABS210
2.0A Miniature Glass Passivated
Single-Phase Surface Mount
Bridge Rectifiers-50-1000V
Suggested thermal profiles for soldering processes
1.Storage environment: Temperature=5
o
C ~40
o
C Humidity=55%±25%
2.Reflow soldering of surface-mount devices
Tp
TP
Ramp-up
Critical Zone
TL to TP
TL
Tsmax
TL
Tsmin
Temperature
tS
Preheat
Ramp-down
25
t25 C to Peak
o
Time
3.Reflow soldering
Profile Feature
Average ramp-up rate(T
L
to T
P
)
Preheat
-Temperature Min(Tsmin)
-Temperature Max(Tsmax)
-Time(min to max)(t
s
)
Tsmax to T
L
-Ramp-upRate
Time maintained above:
-Temperature(T
L
)
-Time(t
L
)
Peak Temperature(T
P
)
Time within 5 C of actual Peak
Temperature(t
P
)
Ramp-down Rate
Time 25 C to Peak Temperature
o
o
Soldering Condition
o
<3 C /sec
o
150 C
o
200 C
60~120sec
o
<3 C /sec
217 C
60~260sec
o
o
255 C- 0/ + 5 C
o
10~30sec
<6 C /sec
<6minutes
o
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Page 4
Ver2.1
