Data Sheet
FEATURES
Digital gyroscope system, ±300°/sec measurement range
In-run bias stability, ~6°/hour
~11°/hour over temperature: −40°C to +85°C
Autonomous operation and data collection
No external configuration commands required
Start-up time: 181 ms; sleep mode recovery: 5 ms
Factory-calibrated sensitivity and bias
Calibration temperature range: −40°C to +85°C
Single serial peripheral interface, SPI compatible
Wide bandwidth: 335 Hz
Embedded temperature sensor
Programmable operation and control
Automatic and manual bias correction controls
Digital filters: Bartlett FIR, average/decimation
Internal sample rate: up to 2048 SPS
Digital I/O: data ready, alarm indicator, general-purpose
Alarms for condition monitoring
Sleep mode for power management
Enable external sample clock input: up to 2048 Hz
Single-supply operation: 4.85 V to 5.15 V
2000
g
shock survivability
Operating temperature range: −40°C to +105°C
±300°/Sec
Precision Angular Rate Sensor
ADIS16135
GENERAL DESCRIPTION
The
ADIS16135
iSensor®
is a high performance, digital gyro-
scope sensing system that operates autonomously and requires
no user configuration to produce accurate rate sensing data. It
provides performance advantages with low noise density, wide
bandwidth, and excellent in-run bias stability, which are enabling
for applications such as platform control, navigation, robotics,
and medical instrumentation.
This sensor system combines industry-leading
iMEMS®
tech-
nology with signal conditioning that optimizes dynamic
performance. The factory calibration characterizes the entire
sensor signal chain for sensitivity and bias over a temperature
range of −40°C to +85°C. As a result, each
ADIS16135
has its
own unique correction formulas to produce accurate measure-
ments upon installation. For some systems, the factory calibration
eliminates the need for system-level calibration and greatly
simplifies it for others.
The
ADIS16135
samples data at rates of up to 2048 SPS and
offers an averaging/decimation filter structure for optimizing
noise/bandwidth trade-offs. The serial peripheral interface (SPI)
and user register structure provide easy access to configuration
controls and calibrated sensor data for embedded processor
platforms.
The 36 mm × 44 mm × 14 mm package provides four holes for
simple mechanical attachment, using M2 (or 2-56 standard size)
machine screws along with a standard 24-pin, dual-row, 1 mm
pitch connector that supports electrical attachment to a printed
circuit board or cable system. The
ADIS16135
provides an
operating temperature range of −40°C to +105°C.
APPLICATIONS
Precision instrumentation
Platform stabilization and control
Industrial vehicle navigation
Downhole instrumentation
Robotics
FUNCTIONAL BLOCK DIAGRAM
DIO1 DIO2 CLKIN RST
VCC
POWER
MANAGEMENT
SELF-TEST
I/O
ALARMS
GND
MEMS
SENSOR
CONTROLLER
TEMP
SENSOR
CLOCK
CALIBRATION
USER
CONTROL
REGISTERS
SPI
PORT
OUTPUT
DATA
REGISTERS
CS
SCLK
DIN
DOUT
08888-001
FILTER
ADIS16135
Figure 1.
Rev. E
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
Document Feedback
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700 ©2010–2013 Analog Devices, Inc. All rights reserved.
Technical Support
www.analog.com
ADIS16135
TABLE OF CONTENTS
Features .............................................................................................. 1
Applications ....................................................................................... 1
General Description ......................................................................... 1
Functional Block Diagram .............................................................. 1
Revision History ............................................................................... 2
Specifications..................................................................................... 3
Timing Specifications .................................................................. 4
Timing Diagrams.......................................................................... 4
Absolute Maximum Ratings............................................................ 5
ESD Caution .................................................................................. 5
Pin Configuration and Function Descriptions ............................. 6
Typical Performance Characteristics ............................................. 7
Basic Operation................................................................................. 8
Reading Sensor Data .................................................................... 8
Output Data Registers .................................................................. 9
User Registers .................................................................................. 10
Digital Processing Configuration ................................................. 11
Data Sheet
Calibration ....................................................................................... 12
Alarms .............................................................................................. 13
System Controls .............................................................................. 14
Global Commands ..................................................................... 14
Memory Management ............................................................... 14
General-Purpose I/O ................................................................. 14
Self-Test ....................................................................................... 15
Power Management ................................................................... 15
Status ............................................................................................ 15
Product Identification................................................................ 16
Applications Information .............................................................. 17
Breakout Board ........................................................................... 17
Installation Tips .......................................................................... 18
Outline Dimensions ....................................................................... 19
Ordering Guide .......................................................................... 19
REVISION HISTORY
10/13—Rev. D to Rev. E
Replaced ADIS16135/PCBZ Breakout Board Section with
Breakout Board Section ................................................................. 17
Deleted Legacy Design Section, Figure 23, and Figure 24;
Renumbered Sequentially.............................................................. 17
Changes to Ordering Guide .......................................................... 19
1/13—Rev. C to Rev. D
Changes to Table 1 ............................................................................. 3
Change to Table 4 .............................................................................. 5
Changes to Table 31 .........................................................................15
4/12—Rev. B to Rev. C
Changes to Table 14 .........................................................................10
Deleted Prototype Interface Board Section..................................17
Added ADIS16135/PCBZ Breakout Board Section, Legacy
Design Section, Figure 21, and Figure 22 .....................................17
Changes to Figure 23 and Figure 24 ..............................................17
11/10—Rev. A to Rev. B
Changes to Table 1.............................................................................3
Changes to Basic Operation Section ...............................................8
Changes to Reading Sensor Data Section ......................................8
Changes to Table 9, Table 12, and Table 13 ....................................9
Changes to Table 18 and Figure 18 .............................................. 11
Change to Automatic Bias Correction Section........................... 12
Changes to Alarms Section ........................................................... 13
Changes to Static Alarm Use Section........................................... 13
Changes to Dynamic Alarm Use Section .................................... 13
Change to Alarm Example Section .............................................. 13
Changes to Table 31 ....................................................................... 15
Changes to Self-Test Section ......................................................... 15
Changes to Prototype Interface Board Section .......................... 17
Changes to Installation Tips Section ........................................... 17
6/10—Rev. 0 to Rev. A
Changes to Figure 5 and Table 5 ......................................................6
Changes to Installation Tips Section ........................................... 17
4/10—Revision 0: Initial Version
Rev. E | Page 2 of 20
Data Sheet
SPECIFICATIONS
T
A
= 25°C, VCC = 5.0 V, angular rate = 0°/sec, dynamic range = ±300°/sec ± 1
g,
unless otherwise noted.
Table 1.
Parameter
GYROSCOPES
Dynamic Range
Initial Sensitivity
Repeatability
1
Sensitivity Temperature Coefficient
Nonlinearity
Bias Repeatability
1, 2
In-Run Bias Stability
Angular Random Walk
Linear Acceleration Effect on Bias
Bias Voltage Sensitivity
Output Noise
Rate Noise Density
3 dB Bandwidth
Sensor Resonant Frequency
LOGIC INPUTS
3
Input High Voltage, V
IH
Input Low Voltage, V
IL
Logic 1 Input Current, I
IH
Logic 0 Input Current, I
IL
All Pins Except RST
RST Pin
Input Capacitance, C
IN
DIGITAL OUTPUTS
3
Output High Voltage, V
OH
Output Low Voltage, V
OL
FLASH MEMORY
Data Retention
4
FUNCTIONAL TIMES
5
Power-On Start-Up Time
Reset Recovery Time
Sleep Mode Recovery Time
Flash Memory Self-Test
Automatic Sensor Self-Test Time
CONVERSION RATE
Clock Accuracy
Sync Input Clock
POWER SUPPLY
Power Supply Current
1
ADIS16135
Test Conditions/Comments
Min
±300
Typ
±350
0.0125
Max
Unit
°/sec
°/sec/LSB
%
ppm/°C
% of F
S
°/sec
°/sec
°/√hr
°/sec/g
°/sec/V
°/sec rms
°/sec/√Hz rms
Hz
kHz
V
V
µA
μA
μA
pF
V
V
Cycles
Years
ms
ms
ms
ms
ms
SPS
%
Hz
V
mA
mA
GYRO_OUT register only
−40°C ≤ T
A
≤ +85°C
−40°C ≤ T
A
≤ +85°C
Best fit straight line
−40°C ≤ T
A
≤ +85°C, 1 σ
+25°C, SMPL_PRD = 0x001F
1 σ, +25°C
1σ
VCC = 4.85 V to 5.15 V
SMPL_PRD = 0x001F
f = 25 Hz, SMPL_PRD = 0x001F
±1
±16
±0.008
±1
0.0017
0.75
0.03
0.02
0.27
0.0122
335
14.5
2.0
V
IH
= 3.3 V
V
IL
= 0 V
±0.2
40
80
10
0.8
±1
60
I
SOURCE
= 1.6 mA
I
SINK
= 1.6 mA
Endurance
4
T
J
= 85°C
Time until data is available
2.4
0.4
10,000
20
181
74
4.7
16
46
680
2048
±3
2048
5.25
SMPL_PRD = 0x000F
SMPL_PRD = 0x000F
SMPL_PRD = 0x001F
SMPL_PRD = 0x0000
Operating voltage range, VCC
SMPL_PRD = 0x001F
Sleep mode
680
6
4.85
5.0
88
1.4
The Repeatability specifications represent analytical projections, which are based off of the following drift contributions and conditions: temperature hysteresis (−40°C
to +85°C), electronics drift (High-Temperature Operating Life test: +85°C, 500 hours), drift from temperature cycling (JESD22, Method A104-C, Method N, 500 cycles,
−40°C to +85°C), rate random walk (10 year projection), and broadband noise
2
Bias repeatability describes a long-term behavior, over a variety of conditions. Short-term repeatability is related to the in-run bias stability and noise density
specifications.
3
The digital I/O signals are driven by an internal 3.3 V supply, and the inputs are 5 V tolerant.
4
JEDEC Standard 22, Method A117. Endurance measured at −40°C, +25°C, +85°C, and +125°C.
5
These times do not include thermal settling and internal filter response times (340 Hz bandwidth), which may affect overall accuracy.
6
The sync input clock and internal sampling clock function below the specified minimum value, at reduced performance levels.
Rev. E | Page 3 of 20
ADIS16135
TIMING SPECIFICATIONS
T
A
= 25°C, VCC = 5 V, unless otherwise noted.
Table 2.
Parameter
f
SCLK
t
STALL
t
READRATE
t
t
DAV
t
DSU
t
DHD
t
SCLKR
, t
SCLKF
t
DR
, t
DF
t
SFS
t
1
t
x
t
2
t
3
CS
Data Sheet
Description
Serial clock
Stall period between data
Read rate
Chip select to clock edge
DOUT valid after SCLK edge
DIN setup time before SCLK rising edge
DIN hold time after SCLK rising edge
SCLK rise/fall times
DOUT rise/fall times
CS high after SCLK edge
Input sync positive pulse width
Input sync low time
Input sync to data ready output
Input sync period
Min
0.01
9
25
48.8
24.4
48.8
1
Normal Mode
Typ
Max
2.0
25
5
5
0
5
100
360
488
12.5
12.5
Unit
MHz
µs
µs
ns
ns
ns
ns
ns
ns
ns
µs
µs
µs
µs
1
Guaranteed by design and characterization but not tested in production.
TIMING DIAGRAMS
CS
t
CS
1
SCLK
2
3
4
5
6
15
16
t
SFS
t
DAV
DOUT
MSB
DB14
DB13
DB12
DB11
DB10
DB2
DB1
LSB
t
DSU
DIN
R/W
A6
A5
t
DHD
A4
A3
A2
D2
D1
LSB
08888-002
08888-003
Figure 2. SPI Timing and Sequence
t
READRATE
t
STALL
CS
SCLK
Figure 3. Stall Time and Data Rate
t
3
t
2
t
1
SYNC
CLOCK (CLKIN)
DATA
READY
08888-004
t
X
Figure 4. Input Clock Timing Diagram
Rev. E | Page 4 of 20
Data Sheet
ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter
Acceleration
Any Axis, Unpowered
Any Axis, Powered
VCC to GND
Digital Input Voltage to GND
Digital Output Voltage to GND
Operating Temperature Range
Storage Temperature Range
1
ADIS16135
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Table 4. Package Characteristics
Package Type
24-Lead Module (ML-24-3)
θ
JA
15.7
θ
JC
1.48
Device Weight
31 g
Rating
2000
g
2000
g
−0.3 V to +7.0 V
−0.3 V to +5.3 V
−0.3 V to VCC + 0.3 V
−40°C to +105°C
−65°C to +125°C
1, 2
Extended exposure to temperatures outside the specified temperature
range of −40°C to +105°C can adversely affect the accuracy of the factory
calibration. For best accuracy, store the parts within the specified operating
range of −40°C to +105°C.
2
Although the device is capable of withstanding short-term exposure to
150°C, long-term exposure threatens internal mechanical integrity.
ESD CAUTION
Rev. E | Page 5 of 20
