Data Sheet
FEATURES
Six Degrees of Freedom Inertial Sensor
ADIS16364
GENERAL DESCRIPTION
The ADIS16364
iSensor®
is a complete inertial system that includes
a triaxis gyroscope and triaxis accelerometer. Each sensor in the
ADIS16364 combines industry-leading
iMEMS®
technology with
signal conditioning that optimizes dynamic performance. The
factory calibration characterizes each sensor for sensitivity, bias,
alignment, and linear acceleration (gyro bias). As a result, each
sensor has its own dynamic compensation formulas that provide
accurate sensor measurements over a temperature range of
−20°C to +70°C.
The ADIS16364 provides a simple, cost-effective method for
integrating accurate, multiaxis inertial sensing into industrial
systems, especially when compared with the complexity and
investment associated with discrete designs. All necessary motion
testing and calibration are part of the production process at the
factory, greatly reducing system integration time. Tight orthog-
onal alignment simplifies inertial frame alignment in navigation
systems. An improved SPI interface and register structure provide
faster data collection and configuration control.
The ADIS16364 uses a compatible pinout and the same package
as the ADIS1635x family. Therefore, systems that currently use the
ADIS1635x family can upgrade their performance with minor
firmware adjustments in their processor designs.
This compact module is approximately 23 mm × 23 mm × 23 mm
and provides a flexible connector interface that enables multiple
mounting orientation options.
Triaxis digital gyroscope with digital range scaling
±75°/sec, ±150°/sec, ±300°/sec settings
Tight orthogonal alignment: <0.05°
Triaxis digital accelerometer: ±5
g
Autonomous operation and data collection
No external configuration commands required
Start-up time: 180 ms
Sleep mode recovery time: 4 ms
Factory-calibrated sensitivity, bias, and axial alignment
Calibration temperature range: −20°C to +70°C
SPI-compatible serial interface
Wide bandwidth: 330 Hz
Embedded temperature sensor
Programmable operation and control
Automatic and manual bias correction controls
Bartlett window, FIR filter length, number of taps
Digital I/O: data ready, alarm indicator, general-purpose
Alarms for condition monitoring
Sleep mode for power management
DAC output voltage
Enable external sample clock input: up to 1.2 kHz
Single-command self-test
Single-supply operation: 4.75 V to 5.25 V
2000
g
shock survivability
Operating temperature range: −40°C to +105°C
APPLICATIONS
Medical instrumentation
Robotics
Platform controls
Navigation
FUNCTIONAL BLOCK DIAGRAM
AUX_ADC
TEMPERATURE
SENSOR
TRIAXIS MEMS
ANGULAR RATE
SENSOR
CS
SIGNAL
CONDITIONING
AND
CONVERSION
CALIBRATION
AND
DIGITAL
PROCESSING
OUTPUT
REGISTERS
AND SPI
INTERFACE
SCLK
DIN
DOUT
AUX_DAC
TRIAXIS MEMS
ACCELERATION
SENSOR
ALARMS
DIGITAL
CONTROL
POWER
MANAGEMENT
VCC
SELF-TEST
GND
ADIS16364
RST DIO1 DIO2 DIO3 DIO4/
CLKIN
07906-001
Figure 1.
Rev. E
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
www.analog.com
Fax: 781.461.3113 ©2009–2012 Analog Devices, Inc. All rights reserved.
ADIS16364
TABLE OF CONTENTS
Features .............................................................................................. 1
Applications ....................................................................................... 1
General Description ......................................................................... 1
Functional Block Diagram .............................................................. 1
Revision History ............................................................................... 2
Specifications..................................................................................... 3
Timing Specifications .................................................................. 5
Timing Diagrams.......................................................................... 5
Absolute Maximum Ratings ............................................................ 6
ESD Caution .................................................................................. 6
Pin Configuration and Function Descriptions ............................. 7
Typical Performance Characteristics ............................................. 8
Theory of Operation ........................................................................ 9
Basic Operation ............................................................................ 9
Reading Sensor Data .................................................................... 9
Device Configuration .................................................................. 9
Data Sheet
Memory Map .............................................................................. 10
Burst Read Data Collection ...................................................... 11
Output Data Registers................................................................ 11
Calibration................................................................................... 12
Operational Control................................................................... 12
Input/Output Functions ............................................................ 14
Diagnostics .................................................................................. 15
Product Identification................................................................ 16
Applications Information .............................................................. 17
Installation/Handling................................................................. 17
Gyroscope Bias Optimization ................................................... 17
Input ADC Channel ................................................................... 17
Interface Printed Circuit Board (PCB) .................................... 17
Outline Dimensions ....................................................................... 18
Ordering Guide .......................................................................... 18
REVISION HISTORY
9/12—Rev. D to Rev. E
Change to Device Configuration Section...................................... 9
2/11—Rev. C to Rev. D
Changes to Gyroscopes Misalignment and Accelerometers
Misalignment Test Conditions/Comments, Table 1 .................... 3
Changes to Table 30 and Table 31 ................................................ 16
8/10—Rev. B to Rev. C
Reorganized Layout ............................................................ Universal
Changes to Features Section............................................................ 1
Changes to Table 1 ............................................................................ 3
Changes to Table 2 ............................................................................ 5
Changes to Table 5 ............................................................................ 7
Changes to Table 7, Reading Sensor Data Section,
and Device Configuration Section ................................................. 9
Changes to Table 8 .......................................................................... 10
Changes to Burst Read Data Collection Section, Output Data
Registers Section, and Table 9 ....................................................... 11
Added Table 10, Table 11, Table 12, Table 13, and Table 14;
Renumbered Tables Sequentially.................................................. 11
Changes to Internal Sample Rate Section.................................... 12
Added Sensor Bandwidth Section and Figure 14;
Renumbered Figures Sequentially ................................................ 13
Changes to Digital Filtering Section and Table 20 ..................... 13
Changes to General-Purpose I/O Section ................................... 14
Changes to Table 26 ....................................................................... 15
Changes to Table 29 and Table 31 ................................................ 16
Added Product Identification Section ......................................... 16
Added Applications Information Section, Figure 17,
and Figure 18................................................................................... 17
Moved Input ADC Channel Section and Figure 16................... 17
3/09—Rev. A to Rev. B
Changes to Features Section ............................................................1
Changes to Figure 5 and Figure 6 ....................................................7
Changes to Figure 7 ...........................................................................8
Changes to Devices Configuration Section ...................................9
Changes to Figure 12...................................................................... 10
Changes to Output Data Registers Section ................................. 11
Changes to Internal Sample Rate Section, Power Management
Section, Digital Filtering Section, and the Dynamic Range
Section .............................................................................................. 12
3/09—Rev. 0 to Rev. A
Changes to Features Section and General Description Section ..1
Changes to Table 1.............................................................................3
Changes to Table 9.......................................................................... 11
Changes to Table 20 ....................................................................... 14
1/09—Revision 0: Initial Version
Rev. E | Page 2 of 20
Data Sheet
SPECIFICATIONS
T
A
= 25°C, VCC = 5.0 V, angular rate = 0°/sec, dynamic range = ±300°/sec ± 1
g,
unless otherwise noted.
Table 1.
Parameter
GYROSCOPES
Dynamic Range
Initial Sensitivity
Test Conditions/Comments
Min
±300
0.0495
Typ
±350
0.05
0.025
0.0125
±50
±0.05
±0.5
±0.1
±3
0.007
2.0
±0.01
0.05
±0.3
0.8
0.044
330
14.5
±1400
±5.25
1.00
50
0.2
±0.5
0.1
8
0.1
0.12
0.05
2.5
5
0.27
330
5.5
Max
ADIS16364
Unit
°/sec
°/sec/LSB
°/sec/LSB
°/sec/LSB
ppm/°C
Degrees
Degrees
% of FS
°/sec
°/sec
°/√hr
°/sec/°C
°/sec/g
°/sec/V
°/sec rms
°/sec/√Hz rms
Hz
kHz
LSB
g
mg/LSB
ppm/°C
Degrees
Degrees
% of FS
mg
mg
m/sec/√hr
mg/°C
mg/V
mg rms
mg/√Hz rms
Hz
kHz
LSB
°C/LSB
Bits
LSB
LSB
LSB
LSB
V
pF
Sensitivity Temperature Coefficient
Misalignment
Nonlinearity
Initial Bias Error
In-Run Bias Stability
Angular Random Walk
Bias Temperature Coefficient
Linear Acceleration Effect on Bias
Bias Voltage Sensitivity
Output Noise
Rate Noise Density
3 dB Bandwidth
Sensor Resonant Frequency
Self-Test Change in Output Response
ACCELEROMETERS
Dynamic Range
Initial Sensitivity
Sensitivity Temperature Coefficient
Misalignment
Nonlinearity
Initial Bias Error
In-Run Bias Stability
Velocity Random Walk
Bias Temperature Coefficient
Bias Voltage Sensitivity
Output Noise
Noise Density
3 dB Bandwidth
Sensor Resonant Frequency
Self-Test Change in Output Response
TEMPERATURE SENSOR
Scale Factor
ADC INPUT
Resolution
Integral Nonlinearity
Differential Nonlinearity
Offset Error
Gain Error
Input Range
Input Capacitance
Dynamic range = ±300°/sec
Dynamic range = ±150°/sec
Dynamic range = ±75°/sec
−20°C ≤ T
A
≤ +70°C
Axis-to-axis
Axis-to-frame (package)
Best fit straight line
±1 σ
1 σ, SMPL_PRD = 0x0001
1 σ, SMPL_PRD = 0x0001
−20°C ≤ T
A
≤ +70°C
Any axis, 1 σ (MSC_CTRL[7] = 1)
VCC = 4.75 V to 5.25 V
±300°/sec range, no filtering
f = 25 Hz, ±300°/sec range, no filtering
0.0505
±300°/sec range setting
Each axis
±696
±5
0.99
±2449
1.01
−20°C ≤ T
A
≤ +70°C
Axis-to-axis
Axis-to-frame (package)
Best fit straight line
±1 σ
1σ
1σ
−20°C ≤ T
A
≤ +70°C
VCC = 4.75 V to 5.25 V
No filtering
No filtering
X-axis and y-axis
Output = 0x0000 at 25°C (±5°C)
140
0.136
12
±2
±1
±4
±2
0
570
3.3
20
During acquisition
Rev. E | Page 3 of 20
ADIS16364
Parameter
DAC OUTPUT
Resolution
Relative Accuracy
Differential Nonlinearity
Offset Error
Gain Error
Output Range
Output Impedance
Output Settling Time
LOGIC INPUTS
1
Input High Voltage, V
IH
Input Low Voltage, V
IL
CS Wake-Up Pulse Width
Logic 1 Input Current, I
IH
Logic 0 Input Current, I
IL
All Pins Except RST
RST Pin
Input Capacitance, C
IN
DIGITAL OUTPUTS
1
Output High Voltage, V
OH
Output Low Voltage, V
OL
FLASH MEMORY
Data Retention
3
FUNCTIONAL TIMES
4
Power-On Start-Up Time
Reset Recovery Time
Sleep Mode Recovery Time
Flash Memory Test Time
Automatic Self-Test Time
CONVERSION RATE
Clock Accuracy
Sync Input Clock
5
POWER SUPPLY
Power Supply Current
Test Conditions/Comments
5 kΩ/100 pF to GND
101 LSB ≤ input code ≤ 4095 LSB
Min
Typ
12
±4
±1
±5
±0.5
0
2
10
2.0
CS signal to wake up from sleep mode
20
V
IH
= 3.3 V
V
IL
= 0 V
±0.2
40
1
10
I
SOURCE
= 1.6 mA
I
SINK
= 1.6 mA
Endurance
2
T
J
= 85°C
Time until data is available
Normal mode, SMPL_PRD ≤ 0x09
Low power mode, SMPL_PRD ≥ 0x0A
Normal mode, SMPL_PRD ≤ 0x09
Low power mode, SMPL_PRD ≥ 0x0A
Normal mode, SMPL_PRD ≤ 0x09
Low power mode, SMPL_PRD ≥ 0x0A
Normal mode, SMPL_PRD ≤ 0x09
Low power mode, SMPL_PRD ≥ 0x0A
SMPL_PRD = 0x0001
SMPL_PRD = 0x0001 to 0x00FF
2.4
0.4
10,000
20
180
250
60
130
4
9
17
90
12
0.413
0.8
4.75
819.2
±3
1.2
5.25
±10
60
0.8
0.55
3.3
Max
Data Sheet
Unit
Bits
LSB
LSB
mV
%
V
Ω
µs
V
V
V
µs
µA
μA
mA
pF
V
V
Cycles
Years
ms
ms
ms
ms
ms
ms
ms
ms
ms
SPS
%
kHz
V
mA
mA
µA
Operating voltage range, VCC
Low power mode
Normal mode
Sleep mode
5.0
24
49
500
1
2
The digital I/O signals are driven by an internal 3.3 V supply, and the inputs are 5 V tolerant.
Endurance is qualified as per JEDEC Standard 22, Method A117, and measured at −40°C, +25°C, +85°C, and +125°C.
3
The data retention lifetime equivalent is at a junction temperature (T
J
) of 85°C as per JEDEC Standard 22, Method A117. Data retention lifetime decreases with junction
temperature.
4
These times do not include thermal settling and internal filter response times (330 Hz bandwidth), which may affect overall accuracy.
5
The sync input clock functions below the specified minimum value, at reduced performance levels.
Rev. E | Page 4 of 20
Data Sheet
TIMING SPECIFICATIONS
T
A
= 25°C, VCC = 5 V, unless otherwise noted.
Table 2.
Normal Mode
(SMPL_PRD ≤ 0x09)
Min
1
Typ
Max
0.01
2.0
9
40
48.8
100
24.4
48.8
5
12.5
5
12.5
5
5
100
600
833
Low Power Mode
(SMPL_PRD ≥ 0x0A)
Min
1
Typ
Max
0.01
0.3
75
100
48.8
100
24.4
48.8
5
12.5
5
12.5
5
ADIS16364
Parameter
f
SCLK
t
STALL
t
READRATE
t
t
DAV
t
DSU
t
DHD
t
SCLKR
, t
SCLKF
t
DR
, t
DF
t
SFS
t
1
t
x
t
2
t
3
CS
Description
Serial clock
Stall period between data
Read rate
Chip select to SCLK edge
DOUT valid after SCLK edge
DIN setup time before SCLK rising edge
DIN hold time after SCLK rising edge
SCLK rise/fall times
DOUT rise/fall times
CS high after SCLK edge
Input sync positive pulse width
Input sync low time
Input sync to data ready output
Input sync period
Burst Read
Min
Typ
Max
0.01
1.0
1/f
SCLK
1
48.8
100
24.4
48.8
5
5
5
5
100
600
833
12.5
12.5
Unit
MHz
µs
µs
ns
ns
ns
ns
ns
ns
ns
µs
µs
µs
µs
1
Guaranteed by design and characterization, but not tested in production.
TIMING DIAGRAMS
CS
t
CS
1
SCLK
2
3
4
5
6
15
16
t
SFS
t
DAV
DOUT
MSB
DB14
DB13
DB12
DB11
DB10
DB2
DB1
LSB
t
DSU
DIN
R/W
A6
A5
t
DHD
A4
A3
A2
D2
D1
LSB
07906-002
07906-003
Figure 2. SPI Timing and Sequence
t
READRATE
t
STALL
CS
SCLK
Figure 3. Stall Time and Data Rate
t
3
t
2
t
1
SYNC
CLOCK (DIO4)
DATA
READY
07906-004
t
X
Figure 4. Input Clock Timing Diagram
Rev. E | Page 5 of 20
stm32/stm8
