Data Sheet
FEATURES
Low Profile, Low Noise
Six Degrees of Freedom Inertial Sensor
ADIS16375
FUNCTIONAL BLOCK DIAGRAM
TEMPERATURE
SENSOR
TRIAXIS MEMS
ANGULAR RATE
SENSOR
CS
SIGNAL
CONDITIONING
AND
CONVERSION
CALIBRATION
AND
DIGITAL
PROCESSING
OUTPUT
REGISTERS
AND SPI
INTERFACE
SCLK
DIN
DOUT
Triaxis digital gyroscope, ±300°/sec
Tight orthogonal alignment: 0.05°
Triaxis digital accelerometer: ±18
g
Delta-angle/velocity calculations
Wide sensor bandwidth: 330 Hz
High sample rate: 2.460 kSPS
Autonomous operation and data collection
No external configuration commands required
Startup time: 500 ms
Factory-calibrated sensitivity, bias, and axial alignment
Calibration temperature range: −40°C to +85°C
SPI-compatible serial interface
Embedded temperature sensor
Programmable operation and control
Automatic and manual bias correction controls
4 FIR filter banks, 120 configurable taps
Digital I/O: data-ready, alarm indicator, external clock
Alarms for condition monitoring
Power-down/sleep mode for power management
Enable external sample clock input: up to 2.25 kHz
Single-command self test
Single-supply operation: 3.3 V
2000
g
shock survivability
Operating temperature range: −40°C to +105°C
TRIAXIS MEMS
ACCELERATION
SENSOR
ALARMS
DIGITAL
CONTROL
POWER
MANAGEMENT
VDDRTC
VCC
SELF-TEST
GND
ADIS16375
RST DIO1 DIO2 DIO3 DIO4
09389-001
Figure 1.
GENERAL DESCRIPTION
The
ADIS16375
iSensor®
is a complete inertial system that includes
a triaxis gyroscope and triaxis accelerometer. Each sensor in the
ADIS16375
combines industry-leading
iMEMS®
technology
with signal conditioning that optimizes dynamic performance.
The factory calibration characterizes each sensor for sensitivity,
bias, alignment, and linear acceleration (gyro bias). As a result,
each sensor has its own dynamic compensation formulas that
provide accurate sensor measurements over a temperature
range of −40°C to +105°C.
The
ADIS16375
provides a simple, cost-effective method for
integrating accurate, multiaxis, inertial sensing into industrial
systems, especially when compared with the complexity and
investment associated with discrete designs. All necessary motion
testing and calibration are part of the production process at the
factory, greatly reducing system integration time. Tight orthogonal
alignment simplifies inertial frame alignment in navigation systems.
An improved SPI interface and register structure provide faster
data collection and configuration control.
This compact module is approximately 44 mm × 47 mm × 14 mm
and provides a flexible connector interface that enables multiple
mounting orientation options.
APPLICATIONS
Precision instrumentation
Platform stabilization and control
Industrial vehicle navigation
Downhole instrumentation
Robotics
Rev. C
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responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
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Fax: 781.461.3113 ©2010–2012 Analog Devices, Inc. All rights reserved.
ADIS16375
TABLE OF CONTENTS
Features .............................................................................................. 1
Applications ....................................................................................... 1
Functional Block Diagram .............................................................. 1
General Description ......................................................................... 1
Revision History ............................................................................... 2
Specifications..................................................................................... 3
Timing Specifications .................................................................. 5
Absolute Maximum Ratings ............................................................ 6
ESD Caution .................................................................................. 6
Pin Configuration and Function Descriptions ............................. 7
Typical Performance Characteristics ............................................. 8
Basic Operation................................................................................. 9
Register Structure ......................................................................... 9
SPI Communication ................................................................... 10
Device Configuration ................................................................ 10
Reading Sensor Data .................................................................. 10
User Registers .................................................................................. 11
Output Data Registers .................................................................... 13
Data Sheet
Digital Signal Processing ............................................................... 17
Sampling Plan ............................................................................. 17
Averaging/Decimation Filter .................................................... 17
FIR Filter Banks .......................................................................... 17
Calibration ....................................................................................... 19
Alarms .............................................................................................. 22
System Controls .............................................................................. 23
Global Commands ..................................................................... 23
Memory Management ............................................................... 23
General-Purpose I/O ................................................................. 24
Power Management.................................................................... 24
Applications Information .............................................................. 26
Prototype Interface Board ......................................................... 26
Installation Tips .......................................................................... 26
Outline Dimensions ....................................................................... 27
Ordering Guide .......................................................................... 27
REVISION HISTORY
8/12—Rev. B to Rev. C
Changes to Features Section and General Description Section . 1
Changes to Table 2 ............................................................................ 5
Changes to Table 3 ............................................................................ 6
Changes to Basic Operation Section .............................................. 9
Changes to Dual Memory Structure Section .............................. 10
Changes to Acceleration Section and Delta Angles Section ..... 14
Changes to Figure 18 ...................................................................... 17
Changes to Table 71 to Table 76 ................................................... 20
Changes to Restoring Factory Calibration Section, Linear
Acceleration on Effect on Gyroscope Bias Section, and Point of
Percussion Alignment Section ...................................................... 21
Changes to Table 88 ........................................................................ 22
Changes to Automatic Self Test Section, Memory Management
Section, and Flash Memory Test Section..................................... 23
Changes to General Purpose I/O Control Section ..................... 24
Changes to Real-Time Clock Configuration/Data Section ...... 25
Changes to Prototype Interface Board and Figure 23................ 26
Updated Outline Dimensions ....................................................... 28
Changes to Ordering Guide .......................................................... 28
7/11—Rev. A to Rev. B
Changes to Accelerometers, Nonlinearity Parameter and Power
Supply, VDD Parameter in Table 1 .................................................3
Changes to t
CLS
, t
CHS
, t
2
, and t
3
Parameters in Table 2 ....................5
Changed Angular Displacement Heading to Delta Angles ...... 14
Changes to Delta Angles Section.................................................. 14
Changes to Table 28 and Velocity Changes Section................... 15
Change to Figure 18 ....................................................................... 17
Changes to Data-Ready Indicator Section and Input Sync/Clock
Control Section ............................................................................... 24
Moved Real-Time Clock Configuration/Data Section, Table 96,
Table 97, and Table 98 .................................................................... 25
Changes to Real-Time Clock Configuration/Data Section ...... 25
Changes to Prototype Interface Board Section .......................... 26
2/11—Rev. 0 to Rev. A
Changes to Gyroscopes Misalignment and Accelerometers
Misalignment Test Conditions/Comments, Table 1 .....................3
Added Endnote 7 ...............................................................................4
Changes to Table 54 and Table 55 ................................................ 17
Changes to Table 57, Table 58, and Table 59............................... 18
10/10—Revision 0: Initial Version
Rev. C | Page 2 of 28
Data Sheet
SPECIFICATIONS
T
A
= 25°C, VDD = 3.3 V, angular rate = 0°/sec, dynamic range = ±300°/sec ± 1
g,
unless otherwise noted.
Table 1.
Parameter
GYROSCOPES
Dynamic Range
Sensitivity
1
Initial Sensitivity Tolerance
Sensitivity Temperature Coefficient
Misalignment
Nonlinearity
Initial Bias Error
In-Run Bias Stability
Angular Random Walk
Bias Temperature Coefficient
Linear Acceleration Effect on Bias
Output Noise
Rate Noise Density
3 dB Bandwidth
Sensor Resonant Frequency
ACCELEROMETERS
Dynamic Range
Sensitivity
1
Initial Sensitivity Tolerance
Sensitivity Temperature Coefficient
Misalignment
Nonlinearity
Initial Bias Error
In-Run Bias Stability
Velocity Random Walk
Bias Temperature Coefficient
Output Noise
Noise Density
3 dB Bandwidth
Sensor Resonant Frequency
TEMPERATURE SENSOR
Scale Factor
LOGIC INPUTS
2
Input High Voltage, V
IH
Input Low Voltage, V
IL
CS Wake-Up Pulse Width
Logic 1 Input Current, I
IH
Logic 0 Input Current, I
IL
All Pins Except RST
RST Pin
Input Capacitance, C
IN
DIGITAL OUTPUTS
Output High Voltage, V
OH
Output Low Voltage, V
OL
Test Conditions/Comments
Min
±300
16-bit resolution, x_GYRO_OUT registers only
−40°C ≤ T
A
≤ +85°C
Axis-to-axis
Axis-to-frame (package)
Best-fit straight line
±1 σ
1σ
1σ
−40°C ≤ T
A
≤ +85°C
Any axis, 1 σ (GEN_CONFIG[7] = 1)
No filtering
f = 25 Hz, no filtering
Typ
±350
0.01311
±1
±40
±0.05
±1.0
±0.025
±1.0
12
1.0
±0.005
±0.013
0.45
0.02
330
14.5
±18
16-bit resolution, x_ACCL_OUT registers only
−40°C ≤ T
A
≤ +85°C
Axis-to-axis
Axis-to-frame (package)
Best-fit straight line, ±10
g
Best-fit straight line, ±18
g
±1 σ
1σ
1σ
−40°C ≤ T
A
≤ +85°C
No filtering
No filtering
0.8192
±1
±25
±0.035
±1.0
±0.1
±0.5
±16
0.13
0.076
±0.1
1.5
0.06
330
5.5
0.00565
2.0
0.8
20
V
IH
= 3.3 V
V
IL
= 0 V
0.33
10
I
SOURCE
= 0.5 mA
I
SINK
= 2.0 mA
Rev. C | Page 3 of 28
ADIS16375
Max
Unit
°/sec
°/sec/LSB
%
ppm/°C
Degrees
Degrees
% of FS
°/sec
°/hr
°/√hr
°/sec/°C
°/sec/g
°/sec rms
°/sec/√Hz rms
Hz
kHz
g
mg/LSB
%
ppm/°C
Degrees
Degrees
% of FS
% of FS
mg
mg
m/sec/√hr
mg/°C
mg rms
mg/√Hz rms
Hz
kHz
°C/LSB
V
V
µs
µA
µA
mA
pF
V
V
Each axis
Output = 0x0000 at 25°C (±5°C)
10
10
2.4
0.4
ADIS16375
Parameter
FLASH MEMORY
Data Retention
4
FUNCTIONAL TIMES
5
Power-On Startup Time
Reset Recovery Time
Sleep Mode Recovery Time
Flash Memory Update Time
Flash Memory Test Time
Automatic Self Test Time
CONVERSION RATE
Initial Clock Accuracy
Temperature Coefficient
Sync Input Clock
POWER SUPPLY, VDD
Power Supply Current
7
Test Conditions/Comments
Endurance
3
T
J
= 85°C
Time until data is available
Min
100,000
20
Typ
Data Sheet
Max
Unit
Cycles
Years
ms
ms
µs
ms
ms
ms
kSPS
%
ppm/°C
kHz
V
mA
mA
µA
V
µA
Using internal clock, 100 SPS
500
500
500
375
50
10
2.46
0.02
40
0.7
6
3.0
173
12.3
120
3.3
13
2.25
3.6
POWER SUPPLY, VDDRTC
Real-Time Clock Supply Current
1
Operating voltage range
Normal mode, VDD = 3.3 V
Sleep mode, VDD = 3.3 V
Power-down mode, VDD = 3.3 V
Operating voltage range
Normal mode, VDDRTC = 3.3 V
Each gyroscope and accelerometer has 32 bits of available resolution. The 16-bit sensitivity shown reflects the register that contains the upper 16 bits of the sensor
output. Divide this number by 2 for every bit added to this resolution in downstream processing routines.
2
The digital I/O signals are driven by an internal 3.3 V supply, and the inputs are 5 V tolerant.
3
Endurance is qualified as per JEDEC Standard 22, Method A117, and measured at −40°C, +25°C, +85°C, and +125°C.
4
The data retention lifetime equivalent is at a junction temperature (T
J
) of 85°C as per JEDEC Standard 22, Method A117. Data retention lifetime decreases with junction
temperature.
5
These times do not include thermal settling and internal filter response times (330 Hz bandwidth), which may affect overall accuracy.
6
The 0.7 kHz lower limit is established to support Nyquist sampling criteria for the 330 Hz sensor bandwidth.
7
During startup, the power supply current increases and experiences transient behaviors for a period of 400 µs. The peak current during the 400 µs transient period can
reach 1500 mA.
Rev. C | Page 4 of 28
Data Sheet
TIMING SPECIFICATIONS
T
A
= 25°C, VDD = 3.3 V, unless otherwise noted.
Table 2.
Parameter
f
SCLK
t
STALL
t
CLS
t
CHS
t
CS
t
DAV
t
DSU
t
DHD
t
DR
, t
DF
t
DSOE
t
HD
t
SFS
t
DSHI
t
1
t
2
t
3
1
ADIS16375
Description
Serial clock
Stall period between data
Serial clock low period
Serial clock high period
Chip select to clock edge
DOUT valid after SCLK edge
DIN setup time before SCLK rising edge
DIN hold time after SCLK rising edge
DOUT rise/fall times, ≤100 pF loading
CS assertion to data out active
SCLK edge to data out invalid
Last SCLK edge to CS deassertion
CS deassertion to data out high impedance
Input sync pulse width
Input sync to data-ready output
Input sync period
Min
0.01
2
31
31
32
2
2
1
Normal Mode
Typ
Max
15
Unit
MHz
µs
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
µs
µs
µs
10
3
0
0
32
0
5
440
8
11
9
430
Guaranteed by design and characterization but not tested in production.
Timing Diagrams
CS
t
CS
1
SCLK
2
3
t
CHS
4
5
6
t
CLS
15
16
t
SFS
t
DSOE
DOUT
MSB
t
DAV
DB14
DB13
DB12
t
HD
DB11
DB10
DB2
DB1
LSB
t
DSHI
t
DSU
DIN
R/W
A6
A5
t
DHD
A4
A3
A2
D2
D1
LSB
09389-002
09389-003
Figure 2. SPI Timing and Sequence
t
STALL
CS
SCLK
Figure 3. Stall Time and Data Rate
t
3
t
1
SYNC
CLOCK (CLKIN)
DATA
READY
OUTPUT
REGISTERS
DATA VALID
DATA VALID
09389-004
t
2
Figure 4. Input Clock Timing Diagram
Rev. C | Page 5 of 28
