AME, Inc.
AME8807
n
General Description
The AME8807 family of positive, linear regulators fea-
ture low ground current (30µA Typ.) with low dropout volt-
age, making them ideal for battery applications. The
space-saving SOP-8 & DFN-8 (3mmx3mmx0.6mm) pack-
ages are attractive for "Pocket" and "Hand Held" applica-
tions.
These rugged devices have both Thermal Shutdown,
and Current Fold-back to prevent device failure under the
"Worst" of operating conditions.
The AME8807 is stable with an output capacitance of
2.2µF or greater.
600mA CMOS LDO
n
Functional Block Diagram
IN
OUT
Overcurrent
Shutdown
Thermal
Shutdown
EN
AMP
ADJ
n
Features
l
Very Low Dropout Voltage
l
Guaranteed 600mA Output
l
Typical 30µA Quiescent Current
l
Accurate to within 1.5%
l
Over-Temperature Shutdown
l
Current Limiting
l
Short Circuit Current Fold-back
l
Power-Saving Shutdown Mode
l
Space-Saving SOP-8 & DFN-8
(3mmx3mmx0.6mm) Packages
l
User Adjustable Output Voltages
l
Low Temperature Coefficient
l
All AME's Lead Free Products Meet RoHS
Standards
C1
1µF
R2
IN
EN
IN
OUT
Vref =1.215V
GND
n
Typical Application
OUT
C2
R1
100p
C3
2.2µF
AME8807
GND
ADJ
n
Applications
l
Instrumentation
l
Portable Electronics
l
Wireless Devices
l
Cordless Phones
l
PC Peripherals
l
Battery Powered Widgets
V
OUT
= 1.215 ( R1/R2 +1 )
C2 is unnecessary if R1 or R2 < 20 K Ohms
R
R and R use resistance value within 1% accuracy for
a d
correct V
2
n
1
OUT
Rev.M.01
1
AME, Inc.
AME8807
n
Pin Configuration
SOP-8
Top View
8
7
6
5
600mA CMOS LDO
SOP-8
Top View
AME8807AEHA
1. IN
2. GND
3. GND
8
7
6
5
AME8807BEHA
1. OUT
2. ADJ
3. GND
4. NC
5. EN
6. NC
4. EN
伍 豐 明 年 每 股
E P S挑
5. ADJ
戰
11
元
伍 豐
6. GND
1
2
3
4
AME8807
AME8807
7. GND
8. OUT
* Die Attach:
Conductive Epoxy
1
2
3
4
7. NC
8. IN
* Die Attach:
Conductive Epoxy
DFN-8
(3mmx3mmx0.6mm)
Top View
AME8807AEVA
8
7
6
5
1. EN
2. GND
3. GND
4. IN
5. OUT
6. GND
AME8807
1
2
3
4
7. GND
8. ADJ
* Die Attach:
Conductive Epoxy
Note:
The area enclosed by dashed line represents Exposed Pad and connect to GND.
2
Rev.M.01
AME, Inc.
AME8807
n
Ordering Information
AME8807 x x x x x - x
Special Feature2
Special Feature1
Number of Pins
Package Type
Operating Ambient Temperature Range
Pin Configuration
600mA CMOS LDO
Pin
Operating Ambient
Configuration Temperature Range
A: 1. IN
(SOP-8)
2. GND
3. GND
4. EN
5. ADJ
6. GND
7. GND
8. OUT
B: 1. OUT
(SOP-8)
2. ADJ
3. GND
4. NC
5. EN
6. NC
7. NC
8. IN
A: 1. EN
(DFN-8)
2. GND
3. GND
4. IN
5. OUT
6. GND
7. GND
8. ADJ
E: -40
O
C to 85
O
C
Package
Type
H: SOP-8
V: DFN
Number
of
Pins
A: 8
Special Feature1
Special Feature 2
(For DFN package only)
3: 3x3x0.6(mm) (LxWxH)
Z: Lead Free
Y: Lead Free &
Low Profile
Rev.M.01
3
AME, Inc.
AME8807
n
Ordering Information
Part Number
AME8807AEHA
600mA CMOS LDO
Marking*
8807
AEHA
yyww
Output
Voltage
Adjustable
Package
SOP-8
Operating Ambient
Temperature Range
- 40
o
C to 85
o
C
8807
AME8807AEHAZ
AEHA
伍 豐 明 年 每 股
E P S挑
戰
11
元
yyww
伍 豐
8807
AME8807BEHA
BEHA
yyww
AME8807BEHAZ
8807
BEHA
yyww
BEX
yyww
Adjustable
SOP-8
- 40
o
C to 85
o
C
Adjustable
SOP-8
- 40
o
C to 85
o
C
Adjustable
SOP-8
DFN-8
(3mmx3mmx0.6mm)
- 40
o
C to 85
o
C
AME8807AEVAY-3
Adjustable
- 40
o
C to 85
o
C
Note: yyww represents the date code
* A line on top of the first letter represents lead free plating such as 8807
Please consult AME sales office or authorized Rep./Distributor for package type availability.
4
Rev.M.01
AME, Inc.
AME8807
n
Absolute Maximum Ratings
Parameter
Input Voltage
EN Voltage
Output Voltage
Output Current
ESD Classification
600mA CMOS LDO
Maximum
-0.3 to 8
-0.3 to 8
-0.3 to V
IN
+ 0.3
P
D
/ (V
IN
- V
OUT
)
B*
Unit
V
V
V
mA
Caution: Stress above the listed absolute maximum rating may cause permanent damage to the device.
*HBM B:2000V~3999V
n
Recommended Operating Conditions
Parameter
Ambient Temperature Range
Junction Temperature Range
Storage Temperature Range
Symbol
T
A
T
J
T
STG
Rating
- 40 to 85
- 40 to 125
- 65 to 150
Unit
o
o
o
C
C
C
n
Thermal Information
Parameter
Thermal Resistance*
(Junction to Case)
Package
SOP-8
DFN-6
(3mmx3mmx0.6mm)
SOP-8
DFN-6
(3mmx3mmx0.6mm)
SOP-8
Die Attach
Symbol
θ
JC
Maximum
60
17
150
Unit
o
C/W
Thermal Resistance
(Junction to Ambient)
Conductive
Epoxy
θ
JA
125
810
mW
Internal Power Dissipation
DFN-6
(3mmx3mmx0.6mm)
P
D
800
150
350
o
o
Maximum Junction Temperature
Solder Iron (10 Sec)**
C
C
* Measure
θ
JC
on center of molding compound if IC has no tab.
O
** MIL-STD-202G 210F
F
Rev.M.01
5
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