ArrayJ Series
Silicon Photomultiplier
(SiPM) High Fill-Factor
Arrays
ON Semiconductor’s range of J−Series SiPM sensors have been
used to create high fill−factor, scaleable arrays. The sensors are
mounted onto PCB boards with minimal dead space, forming arrays
with industry−leading fill factor of up to 90%.
The back of each ArrayJ has either one or more multi−way
connectors, or a BGA (ball grid array). These allow access to the fast
output* and standard I/O from each pixel in the array, and a common
I/O from the summed substrates of the pixels.
The ArrayJ products with connectors can be used to interface with
the user ’s own readout via a mating connector, or to a
ON Semiconductor Breakout Board (BOB). The BOBs allow for easy
access to the pixel signals and performance evaluation of the arrays.
ArrayJ products with the BGA can be reflow soldered to the user’s
readout boards, or purchased ready−mounted on a pinned PCB
evaluation board for easy testing. A BGA ArrayJ cannot be removed
from it’s PCB evaluation board. This contrasts with an ArrayJ with
connectors, as multiple arrays can be evaluated with a single BOB.
ArrayJ Inputs and Outputs (I/O)
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S1
F1
S2
F2
Common
Figure 1 summarizes the array schematic for a portion of an ArrayJ.
Each SiPM sensor in the array has three electrical connections: fast
output, standard output and common.
The substrates (cathodes) of all sensors are summed together to
form the common I/O.
Each individual fast output and standard I/O (anode) are routed to its
own output pin.
The pixel−level performance of the sensors in the array can be found
in the
J−Series datasheet.
Table of Contents
ARRAYJ-60035-64P-PCB
(8 X 8 Array of 6 mm Pixels) . . . . . . . . . . . . . . . . . . . . 2
ARRAYX-BOB6-64P
(Breakout Board for the ARRAYJ-60035-64P) . . . . . . . . . 5
ARRAYX-BOB6-64S
(Summed Breakout Board for the ARRAYJ-60035-64P) . . . 7
ARRAYJ-60035-4P-BGA
(2 X 2 Array of 6 mm Pixels) . . . . . . . . . . . . . . . . . . . . 9
ARRAYJ-60035-4P-PCB
(2 X 2 Array of 6 mm Pixels) . . . . . . . . . . . . . . . . . . . . 12
ARRAYJ-300XX-16P-PCB
(4 X 4 Array of 3 mm Pixels) . . . . . . . . . . . . . . . . . . 17
ARRAYJ-BOB3-16P
(ARRAYJ-300XX-16P Breakout Board) . . . . . . . . . . . . . . 19
ARRAYJ-300XX-64P-PCB
(8 X 8 Array of 3 mm Pixels) . . . . . . . . . . . . . . . . . . 21
ARRAYJ-BOB3-64P
(ARRAYJ-300XX-64P & ARRAYJ-40035-64P
Breakout Board) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Biasing and Readout from the Standard Breakout Boards . . . . . . . . . . . . . . . . . 27
Appendix A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Appendix B . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Appendix C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Sn+1
Fn+1
Sn+2
Fn+2
Figure 1. Signal connections at the pixel
level on the ArrayJ products.
ATTENTION!
Great care should be taken when disconnecting the
ArrayJ PCBs from the mating connectors, either on one
of the BOBs, or the user’s own boards.
The board should be gently levered up, working
progressively around the board to lever the PCB from the
connector a little on all sides, and then repeating the
process until the connectors are free from each other.
Use of Scintillators with the ArrayJ
Products
Please consult the
Application Note
on the use of
scintillators with the TSV arrays.
* The fast output is not available on the 2x2 array (ARRAYJ−60035−4P).
©
Semiconductor Components Industries, LLC, 2018
November, 2018
−
Rev. 4
1
Publication Order Number:
ARRAYJ−SERIES/D
ArrayJ Series
ARRAYJ−60035−64P−PCB (8 X 8 Array of 6 mm Pixels)
Array Size
8x8
Sensor Type
60035
Readout
Pixel
Board Size
50.44 x 50.44 mm
2
Pixel Pitch
6.33 mm
No. Connections
160
No. Connectors
2 x 80−way
The ARRAYJ−60035−64P is comprised of 64 individual
6 mm J−Series sensors arranged in a 8 x 8 array.
The performance of the individual pixels and details of the
bias to apply can be found in the
J−Series datasheet.
The connections to each array are provided by two Samtec
80−way connectors, type QTE−040−03−F−D−A. These
connectors mate with the Samtec QSE−040−01−F−D−A
board−to−board connector and the Samtec EQCD High
Speed Cable Assemblies. The 64 SiPM pixels all have
substrate connections (cathode) summed to form a common
I/O. The 80−way connectors provide connections as
follows:
•
64 x fast output
•
64 x standard I/O
•
32 x common I/O
•
16 x shield contacts to the Common
ARRAYJ−60035−64P Board Drawing
8
1
J1
J2
64
57
The complete ARRAYJ−60035−64P−PCB CAD is available to
download.
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2
ArrayJ Series
Connector Schematic for the ARRAYJ−60035−64P−PCB
Figure 2. Connector schematic for the ARRAYJ−60035−64P
The connector location and array pixel numbering is indicated on the array schematics on the previous page.
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ArrayJ Series
Table 1. CONNECTOR PIN−OUTS FOR THE ARRAYJ−60035−64P−PCB
J1
PIN
1
3
5
7
9
11
13
15
17
19
21
23
25
27
29
31
33
35
37
39
41
43
45
47
49
51
53
55
57
59
61
63
65
67
69
71
73
75
77
79
CM
Sn
Fn
Common I/O
Standard I/O of pixel n
Fast output of pixel n
SIGNAL
S17
F17
S25
F25
S18
F18
S26
F26
S19
F19
S27
F27
S20
F20
S28
F28
CM
CM
CM
CM
S21
F21
S29
F29
S22
F22
S30
F30
S23
F23
S31
F31
S24
F24
S32
F32
CM
CM
CM
CM
PIN
2
4
6
8
10
12
14
16
18
20
22
24
26
28
30
32
34
36
38
40
42
44
46
48
50
52
54
56
58
60
62
64
66
68
70
72
74
76
78
80
SIGNAL
S1
F1
S9
F9
S2
F2
S10
F10
S3
F3
S11
F11
S4
F4
S12
F12
CM
CM
CM
CM
S5
F5
S13
F13
S6
F6
S14
F14
S7
F7
S15
F15
S8
F8
S16
F16
CM
CM
CM
CM
PIN
1
3
5
7
9
11
13
15
17
19
21
23
25
27
29
31
33
35
37
39
41
43
45
47
49
51
53
55
57
59
61
63
65
67
69
71
73
75
77
79
SIGNAL
S49
F49
S57
F57
S50
F50
S58
F58
S51
F51
S59
F59
S52
F52
S60
F60
CM
CM
CM
CM
S53
F53
S61
F61
S54
F54
S62
F62
S55
F55
S63
F63
S56
F56
S64
F64
CM
CM
CM
CM
J2
PIN
2
4
6
8
10
12
14
16
18
20
22
24
26
28
30
32
34
36
38
40
42
44
46
48
50
52
54
56
58
60
62
64
66
68
70
72
74
76
78
80
SIGNAL
S33
F33
S41
F41
S34
F34
S42
F42
S35
F35
S43
F43
S36
F36
S44
F44
CM
CM
CM
CM
S37
F37
S45
F45
S38
F38
S46
F46
S39
F39
S47
F47
S40
F40
S48
F48
CM
CM
CM
CM
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ArrayJ Series
ARRAYX−BOB6−64P (Breakout Board for the
ARRAYJ−60035−64P)
The ARRAYX−BOB6−64P is an evaluation board
allowing easy access to all the signals of a
ON Semiconductor ARRAYJ−60035−64P, 6 mm 8 x 8 TSV
SiPM array.
The Breakout Board features two Samtec 80−way
connectors, type QSE−040−01−F−D−A. These connectors
mate with the Samtec QTE−040−03−F−D−A board−to−
board connector on the array. Since the connectors are
keyed, orientating the array on the BOB is straight−forward.
All signals on the array are routed via the mating
connectors to header pins. These pins are formed of four
50−way (25 x 2 row) 2.54 mm pitch headers; J3, J4, J5 and
J6. Each of the four headers also has 8 pins left unconnected
to allow prototyping for evaluation purposes.
The three SMA connectors on the board can be connected
via the supplied jumper cable to any of the array header pins
and used for accessing signals or suppling bias voltage. Four
7 mm holes are aligned on a 25 mm grid to allow mounting
of the board on an optical breadboard.
See Appendices A and B for examples of Breakout Board
usage.
Figure 3. Layout of the ARRAYX−BOB6−64P. The dimensions of the board are 112 mm x 112 mm.
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