PRODUCT DATASHEET
Surface Mount PTC Devices
ASMD0603 Series Surface Mount PTC Devices
ASMD0603 Series Surface Mount PTC Devices
Description
The ASMD0603 series provides miniature surface
mount resettable overcurrent protection with holding
current from 100mA to 500mA.
This world’s smallest PTC is suitable for ultra
portable applications where space is at a premium and
the device current is low.
Features
●
RoHS compliant and lead-free
●
Low profile
●
Halogen-free
●
Fast response to fault current
●
Compact design saves board space
●
Compatible with high temperature solders
Agency Approvals
Agency
File Number
pending
Applications
●
Mobile phones and PDAs
●
USB peripherals
●
Portable MP3 and media player
●
IC VCC protection
●
Mobile Internet Device (MID)
pending
Regulation
Standard
2002/95/EC
EN14582
JDT FUSE Industrial Corp.
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ASMD0603 Series Surface Mount PTC Devices
Performance Specification
Model
ASMD0603-010
ASMD0603-020
ASMD0603-025
ASMD0603-035
ASMD0603-050
ASMD0603-075
ASMD0603-100
V
max
(V dc)
I
max
(A)
I
hold
@25°C
(A)
@25°C
(A)
I
trip
0.30
0.50
0.55
0.75
1.00
1.40
2.00
Typ.
(W)
P
d
0.5
0.5
0.5
0.5
0.5
0.5
0.5
Maximum
Time To Trip
Current
(A)
Time
(Sec)
Resistance
R
i min
(Ω)
R
1max
(Ω)
15.0
9.0
9.0
6.0
6.0
6.0
6.0
40
40
40
40
40
40
40
0.10
0.20
0.25
0.35
0.50
0.75
1.00
0.5
1.0
8.0
8.0
8.0
8.0
8.0
1.00
0.60
0.08
0.10
0.10
0.10
0.10
0.900
0.550
0.500
0.200
0.100
0.060
0.040
6.000
3.500
3.000
1.400
0.800
0.450
0.300
I
hold
= Hold Current. Maximum current device will not trip in 25°C still air.
I
trip
= Trip Current. Minimum current at which the device will always trip in 25°C still air.
V
max
= Maximum operating voltage device can withstand without damage at rated current (Imax).
I
max
= Maximum fault current device can withstand without damage at rated voltage (V max).
P
d
= Power dissipation when device is in the tripped state in 25°C still air environment at rated voltage.
R
i min/max
= Minimum/Maximum device resistance prior to tripping at 25°C.
R
1max
= Maximum device resistance is measured one hour post reflow.
CAUTION : Operation beyond the specified ratings may result in damage and possible arcing and flame.
Environmental Specifications
Test
Passive aging
Humidity aging
Thermal shock
Vibration
Conditions
+85°C, 1000 hrs.
+85°C, 85% R.H. , 168 hours
+85°C to -40°C, 20 times
MIL-STD-202,Method 215
MIL-STD-202,Method 201
Resistance change
±5% typical
±5% typical
±33% typical
No change
No change
Resistance to solvent
Ambient operating conditions : - 40 °C to +85 °C
Maximum surface temperature of the device in the tripped state is 125 °C
JDT FUSE Industrial Corp.
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ASMD0603 Series Surface Mount PTC Devices
Thermal Derating Curve
Percentage of Derated Current
200
150
100
50
0
-40
-20
0
20
40
Temperature (°C )
60
80
Derating Curves for ASMD0603 Series
Average Time-Current Curve
100
10
TIME IN SECOND
0.10A
0.20A
0.25A
0.35A
1
0.1
0.01
0.001
0.50A
0.75A
1.00A
0.1
1
CURRENT IN AMPERES
Thermal Derading Chart
10
Model
ASMD0603-010
ASMD0603-020
ASMD0603-025
ASMD0603-035
ASMD0603-050
ASMD0603-075
ASMD0603-100
Maximum ambient operating temperature (T
mao
) vs. hold current (I
hold
)
- 40°C
- 20°C
0°C
25°C
40°C
50°C
60°C
70°C
85°C
0.13
0.27
0.32
0.47
0.67
0.98
1.30
0.12
0.25
0.29
0.41
0.59
0.85
1.12
0.11
0.23
0.27
0.38
0.54
0.81
1.08
0.10
0.20
0.25
0.35
0.50
0.75
1.00
0.08
0.17
0.21
0.29
0.41
0.60
0.80
0.07
0.14
0.18
0.26
0.37
0.54
0.72
0.06
0.12
0.16
0.24
0.34
0.44
0.58
0.05
0.10
0.05
0.20
0.29
0.40
0.53
0.03
0.07
0.03
0.14
0.20
0.31
0.42
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JDT FUSE Industrial Corp.
ASMD0603 Series Surface Mount PTC Devices
Soldering Parameters
TP
260
Ramp-up
TP 20~40 S
Critical Zone
TL to TP
TL
217
Tsmax
tL
60~150 s
200
Temperature (°C )
Tsmin
Ramp-down
150
ts
Preheat 60~180 s
25
t 25°C to peak
Time
Profile Feature
Average Ramp-Up Rate
(Ts max to T p)
Preheat
-Temperature Min(Ts min)
-Temperature Max(Ts max)
-Time(Ts min to Ts max)
Time maintained above:
-Temperature(TL)
-Time(tL)
Peak Temperature(Tp)
Ramp-Down Rate
Pb-Free Assembly
3℃/second mac.
150℃
200℃
60~180 seconds
217℃
60~150 seconds
260℃
6℃/second max.
Time 25℃ to Peak Temperature 8 minutes max
Storage Condition
0℃~35℃,≤70%RH
Recommended reflow methods: IR, vapor phase oven, hot air oven, N2 environment for lead-free
Recommended maximum paste thickness is 0.25mm
Devices can be cleaned using standard industry methods and solvents.
Note 1:All temperature refer to topside of the package, measured on the package body surface.
Note 2: If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements.
JDT FUSE Industrial Corp.
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www.jdtfuse.com
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