PRODUCT DATASHEET
Surface Mount PTC Devices
ASMD2018 Series Surface Mount PTC Devices
ASMD2018 Series Surface Mount PTC Devices
Description
The ASMD2018 series provides surface mount
resettable overcurrent protection with holding current
from 0.3A to 2.0A.
This series is suitable for applications with higher
holding currant and higher working voltage up to 60V.
Features
●
RoHS compliant and lead-free
●
Low profile
●
Halogen-free
●
Fast response to fault current
●
High voltage
●
Compatible with high temperature solders
Agency Approvals
Agency
File Number
pending
pending
Applications
●
Power over Ethernet (POE)
●
IEEE 1394 port protection
●
Powered USB for POS and IPC
●
Low voltage telecom equipment
●
Automotive electronics control module protection
●
Industrial control
●
Security systems
Regulation
Standard
2002/95/EC
EN14582
JDT FUSE Industrial Corp.
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ASMD2018 Series Surface Mount PTC Devices
Performance Specification
Model
ASMD2018-030
ASMD2018-050
ASMD2018-100
ASMD2018-100-33
ASMD2018-150
ASMD2018-200
V
max
(V dc)
I
max
(A)
I
hold
@25°C
(A)
@25°C
(A)
I
trip
0.60
1.20
2.20
2.20
3.00
4.00
Typ.
(W)
P
d
0.9
1.0
1.1
1.1
1.1
1.1
Maximum
Time To Trip
Current
(A)
Time
(Sec)
Resistance
R
i min
(Ω)
R
1max
(Ω)
60
60
15
33
15
10
100
100
100
100
100
100
0.30
0.55
1.10
1.10
1.50
2.00
1.5
2.5
8.0
8.0
8.0
8.0
3.00
3.00
0.40
0.40
0.80
2.40
0.500
0.200
0.060
0.060
0.050
0.030
2.300
1.000
0.360
0.360
0.170
0.100
I
hold
= Hold Current. Maximum current device will not trip in 25°C still air.
I
trip
= Trip Current. Minimum current at which the device will always trip in 25°C still air.
V
max
= Maximum operating voltage device can withstand without damage at rated current (Imax).
I
max
= Maximum fault current device can withstand without damage at rated voltage (V max).
P
d
= Power dissipation when device is in the tripped state in 25°C still air environment at rated voltage.
R
i min/max
= Minimum/Maximum device resistance prior to tripping at 25°C.
Test
R
1max
= Maximum device resistance is measured one hour post reflow.
CAUTION : Operation beyond the specified ratings may result in damage and possible arcing and flame.
Environmental Specifications
Conditions
Passive aging
Humidity aging
Thermal shock
Resistance to solvent
Vibration
Ambient operating conditions : - 40 °C to +85 °C
Maximum surface temperature of the device in the tripped state is 125 °C
+85°C, 1000 hrs.
+85°C, 85% R.H. , 168 hours
+85°C to -40°C, 20 times
MIL-STD-202,Method 215
MIL-STD-202,Method 201
Resistance change
±5% typical
±5% typical
±33% typical
No change
No change
JDT FUSE Industrial Corp.
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ASMD2018 Series Surface Mount PTC Devices
Thermal Derating Curve
Derating Curves for SMD2018 Series
Percentage of Derated Current
160
140
120
100
80
60
40
20
0
-40
-20
0
20
Temperature (°C )
40
60
80
Average Time-Current Curve
100
TIME IN SECOND
10
0.30A
0.50A
1
1.00A
1.50A
2.00A
0.1
0.01
0.1
1
10
100
CURRENT IN AMPERES
JDT FUSE Industrial Corp.
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ASMD2018 Series Surface Mount PTC Devices
Thermal Derading Chart
Model
ASMD2018-030
ASMD2018-050
ASMD2018-100
ASMD2018-100-33V
ASMD2018-150
ASMD2018-200
Maximum ambient operating temperature (T
mao
) vs. hold current (I
hold
)
- 40°C
- 20°C
0°C
25°C
40°C
50°C
60°C
70°C
85°C
0.48
0.87
1.71
1.71
2.38
2.95
0.42
0.77
1.52
1.52
2.10
2.65
0.35
0.67
1.32
1.32
1.82
2.35
0.30
0.55
1.10
1.10
1.50
2.00
0.24
0.46
0.94
0.94
1.27
1.74
0.21
0.41
0.84
0.84
1.13
1.59
0.17
0.36
0.74
0.74
0.99
1.44
0.15
0.31
0.64
0.64
0.85
1.29
0.10
0.23
0.50
0.50
0.64
1.06
Soldering Parameters
TP
260
Ramp-up
TP 20~40 S
Critical Zone
TL to TP
TL
217
Tsmax
tL
60~150 s
200
Temperature (°C )
Tsmin
Ramp-down
150
ts
Preheat 60~180 s
25
t 25°C to peak
Time
Profile Feature
Average Ramp-Up Rate
(Ts max to T p)
Preheat
-Temperature Min(Ts min)
-Temperature Max(Ts max)
-Time(Ts min to Ts max)
Time maintained above:
-Temperature(TL)
-Time(tL)
Peak Temperature(Tp)
Ramp-Down Rate
Pb-Free Assembly
3℃/second mac.
150℃
200℃
60~180 seconds
217℃
60~150 seconds
260℃
6℃/second max.
Recommended reflow methods: IR, vapor phase oven,
hot air oven, N2 environment for lead-free
Recommended maximum paste thickness is 0.25mm
Devices can be cleaned using standard industry methods
and solvents.
Note 1:All temperature refer to topside of the package,
measured on the package body surface.
Note 2: If reflow temperatures exceed the recommended
profile, devices may not meet the performance
requirements.
Time 25℃ to Peak Temperature 8 minutes max
Storage Condition
0℃~35℃,≤70%RH
JDT FUSE Industrial Corp.
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www.jdtfuse.com
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