PRODUCT DATASHEET
Surface Mount PTC Devices
ASMD2920 Series Surface Mount PTC Devices
ASMD2920 Series Surface Mount PTC Devices
Description
The ASMD2920 series provides surface mount
resettable overcurrent protection with holding current
from 0.3A to 3.0A.
This series is suitable for applications with higher holding
current and higher working voltage up to 60V.
Features
●
RoHS compliant and lead-free
●
Low profile
●
Halogen-free
●
Fast response to fault current
●
High voltage
●
Compatible with high temperature solders
Agency Approvals
Agency
File Number
pending
pending
Applications
●
Power over Ethernet(POE)
●
IEEE 1394 port protection
●
Powered USB for POS and IPC
●
Low voltage telecom equipment
●
Automotive electronics control module protection
Industrial control
Security systems
Regulation
Standard
2002/95/EC
EN14582
JDT FUSE Industrial Corp.
Page 1/7
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ASMD2920 Series Surface Mount PTC Devices
Performance Specification
Model
ASMD2920-030
ASMD2920-050
ASMD2920-075
ASMD2920-100
ASMD2920-125
ASMD2920-150
ASMD2920-185
ASMD2920-200
ASMD2920-250
ASMD2920-260
ASMD2920-300
Test
ASMD2920-300-16V
ASMD2920-400
ASMD2920-500
ASMD2920-500-12V
ASMD2920-500-16V
ASMD2920-600
ASMD2920-700
V
max
(V dc)
I
max
(A)
I
hold
@25°C
(A)
@25°C
(A)
I
trip
0.60
1.00
1.50
2.20
2.50
3.00
3.70
4.00
5.00
5.20
6.00
6.00
8.00
Typ.
(W)
P
d
1.5
1.5
1.5
1.5
1.5
1.5
1.5
1.5
1.5
1.5
1.5
1.5
1.5
1.5
1.5
1.5
1.5
1.5
Maximum
Time To Trip
Current
(A)
Time
(Sec)
Resistance
R
i min
(Ω)
R
1max
(Ω)
60
60
33
33
33
33
33
24
16
6
6
16
16
6
12
16
12
12
100
100
100
100
100
100
100
100
100
100
40
100
40
40
40
40
40
40
0.30
0.50
0.75
1.10
1.25
1.50
1.85
2.00
2.50
2.60
3.00
3.00
4.00
5.00
5.00
5.00
6.00
7.00
1.5
2.5
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
20.0
25.0
25.0
25.0
25.0
25.0
3.0
4.0
0.3
0.5
2.0
2.0
2.5
4.5
16.0
10.0
20.0
20.0
4.0
5.0
5.0
5.0
6.0
6.0
0.600
0.180
0.100
0.065
0.050
0.035
0.030
0.020
0.020
0.014
0.012
0.012
0.008
0.005
0.005
0.005
0.004
0.0025
4.800
1.400
1.000
0.410
0.250
0.230
0.150
0.120
0.085
0.075
0.048
0.048
0.040
0.031
0.031
0.031
0.020
0.010
10.00
10.00
10.00
12.00
14.00
I
hold
= Hold Current. Maximum current device will not trip in 25°C still air.
I
trip
= Trip Current. Minimum current at which the device will always trip in 25°C still air.
V
max
= Maximum operating voltage device can withstand without damage at rated current (Imax).
I
max
= Maximum fault current device can withstand without damage at rated voltage (V max).
P
d
= Power dissipation when device is in the tripped state in 25°C still air environment at rated voltage.
R
i min/max
= Minimum/Maximum device resistance prior to tripping at 25°C.
R
1max
= Maximum device resistance is measured one hour post reflow.
CAUTION : Operation beyond the specified ratings may result in damage and possible arcing and flame.
Environmental Specifications
Conditions
Passive aging
Humidity aging
Thermal shock
Resistance to solvent
Vibration
Ambient operating conditions : - 40 °C to +85 °C
Maximum surface temperature of the device in the tripped state is 125 °C
JDT FUSE Industrial Corp.
Page 2/7
Resistance change
±5% typical
±5% typical
±33% typical
No change
No change
+85°C, 1000 hrs.
+85°C, 85% R.H. , 168 hours
+85°C to -40°C, 20 times
MIL-STD-202,Method 215
MIL-STD-202,Method 201
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ASMD2920 Series Surface Mount PTC Devices
Thermal Derating Curve
Derating Curves for ASMD2920 Series
Percentage of Derated Current
160
140
120
100
80
60
40
20
0
-40
-20
0
20
Temperature (°C )
40
60
80
Average Time-Current Curve
100
0.30A
0.50A
0.75A
1.00A
1.25A
TIME IN SECOND
10
1
1.50A
1.85A
2.0A
2.50A
2.60A
3.00A
0.1
1
10
CURRENT IN AMPERES
100
0.1
0.01
JDT FUSE Industrial Corp.
Page 3/7
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ASMD2920 Series Surface Mount PTC Devices
Thermal Derading Chart
Model
ASMD2920-030
ASMD2920-050
ASMD2920-075
ASMD2920-100
ASMD2920-125
ASMD2920-150
ASMD2920-185
ASMD2920-200
ASMD2920-250
ASMD2920-260
ASMD2920-300
ASMD2920-400
ASMD2920-500
ASMD2920-600
Maximum ambient operating temperature (T
mao
) vs. hold current (I
hold
)
- 40°C
- 20°C
0°C
25°C
40°C
50°C
60°C
70°C
85°C
0.45
0.76
1.13
1.66
1.89
2.27
2.80
3.02
3.78
3.64
4.53
6.04
7.55
8.60
0.40
0.67
1.01
1.47
1.68
2.01
2.47
2.68
3.35
3.25
4.02
5.36
6.70
7.70
0.35
0.59
0.88
1.29
1.46
1.76
2.17
2.34
2.93
2.91
3.51
4.68
5.85
6.80
0.30
0.50
0.75
1.10
1.25
1.50
1.85
2.00
2.50
2.60
3.00
4.00
5.00
6.00
0.25
0.42
0.62
0.91
1.04
1.25
1.54
1.66
2.08
2.26
2.52
3.36
4.20
4.95
0.23
0.38
0.56
0.83
0.94
1.13
1.39
1.50
1.88
2.08
2.26
3.01
3.77
4.60
0.20
0.33
0.50
0.73
0.83
1.00
1.22
1.32
1.65
1.95
1.99
2.65
3.32
4.06
0.17
0.29
0.44
0.64
0.73
0.87
1.07
1.16
1.45
1.74
1.75
2.33
2.92
3.65
0.14
0.23
0.34
0.50
0.56
0.74
0.85
0.90
1.13
1.13
1.34
1.79
2.23
3.15
Soldering Parameters
TP
260
Ramp-up
TP 20~40 S
Critical Zone
TL to TP
Profile Feature
Average Ramp-Up Rate
(Ts max to T p)
Preheat
-Temperature Min(Ts min)
-Temperature Max(Ts max)
-Time(Ts min to Ts max)
Time maintained above:
-Temperature(TL)
-Time(tL)
Peak Temperature(Tp)
Ramp-Down Rate
Pb-Free Assembly
3℃/second mac.
TL
217
Tsmax
tL
60~150 s
200
Temperature (°C )
Tsmin
Ramp-down
150℃
200℃
60~180 seconds
217℃
60~150 seconds
260℃
6℃/second max.
150
ts
Preheat 60~180 s
25
t 25°C to peak
Time
Recommended reflow methods: IR, vapor phase oven,
hot air oven, N2 environment for lead-free
Recommended maximum paste thickness is 0.25mm
Devices can be cleaned using standard industry methods
and solvents.
Note 1:All temperature refer to topside of the package,
measured on the package body surface.
Note 2: If reflow temperatures exceed the recommended
profile, devices may not meet the performance
requirements.
Time 25℃ to Peak Temperature 8 minutes max
Storage Condition
0℃~35℃,≤70%RH
JDT FUSE Industrial Corp.
Page 4/7
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