SPECIFICATIONS
FBD DDR II Connector
AT 540 Series
Vertical Type, T/H Type
1.00mm [.039”] Pitch
240 Pos.
Mechanical
Contact Retention Force:
0.75Lbs (0.34kgf) min. per Contact
Durability:
25 Cycles
Dram Board Insertion Force:
3 oz max. per Contact
Electrical
Voltage Rating:
250V AC
Current Rating: 0.5A
max., 30℃ max., in Temperature Rise
Insulation Resistance:
1000MΩ min. initial
Dielectric Withstanding Voltage:
500V DC at Sea Level
Low Level Contact Resistance:
30mΩ max. initial
Physical
Housing:
Thermoplastic, UL 94V-0 rated in Black Color
Contact:
Copper alloy
Ejector:
Thermoplastic, UL 94V-0 rated in Ivory or Natural Color
Metal Hold Down:
Copper alloy
Operating Temperature:
-55℃ to +105℃
DRAWING
ORDERING
INFORMATION
PRODUCT NO.: A T 5 4 0 * * - H 3 V F- * *
Memory Socket
Vertrical
FBD DDR II DIMM
1.00mm Pitch
PLATING TYPE
4N=TIN/LEAD
4F=LEAD FREE
Extension Code
Contact Area Plating
1=Gold Flash
2=20u" Gold
3=30u" Gold
6=10u" Gold
7=15u" Gold
No. of Pos.
40=240 Pos.
Tail Length
0=3.15 [.124]
1=2.67 [.105]
All specification & dimensions are subject to change, please call your nearest Foxconn sales representative for update information.
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