BC7601/BC7602
BLE Transparent Transmission Controller
Features
• 3.3V operating voltage
•
Integrated high performance RF and MODEM for
enhanced BLE.
• Few external components required as well as on-chip
32 MHz crystal capacitors to reduce the BOM cost.
•
Integrated DC/DC converter and LDOs allowing a
wider supply range with a single power supply
• Over 75dB RX of gain in programmable gain steps
• Integrated SPI and UART for ACI interfaces
• Includes Sleep and Power Down modes for low
power consumption
• Embedded patch memory to reduce system
development effort and cost – BC7602 only
• Package types:
♦
BC7601: 32-pin QFN – 4mmx4mm
♦
BC7602: 46-pin QFN – 6.5mmx4.5mm
General Description
The BC7601/BC7602 devices are fully-integrated,
single-chip Bluetooth Low Energy, BLE, controllers.
The devices are specially designed to act as BLE
slave controllers in accordance with the Bluetooth
specification v4.1.
The devices can be controlled by any external
microcontroller through the Application Controller
Interface, ACI, which is designed to allow the devices
to easily communicate with external circuitry. The
UART and SPI interfaces are available as the ACI
transport layers.
Additionally, during intervals where there is no active
BLE RF connection, the devices will enter a
Sleep
Mode thus further reducing power consumption.
In general practice, the BC7601/BC7602 devices
will be required to download a patch code for full
BLE optimisation. For convenience and system cost
reduction, the BC7602 device already supports an
internal patch code and so does not need to patch
from the external microcontroller.
Applications
• Health care products
• Smart home appliances
• Beacons
Block Diagram
VDDIF_15
VDDRF_15
VDDLO_15
RST_N
PDN
INT_EXT
Balun
PA
VCO
WAKEUP
STATE
SPI_INT
SPI_CS/UR_CTS
ACI
LNA
Mixer
+Gain
IF Filter
& Demod
SPI_CLK/UR_RTS
SPI_MOSI/UR_RXD
SPI_MISO/UR_TXD
SPI-UR_N
EE_WP
IIC_CLK
IIC_SDA
RFIO
Switch
Frequency
Synthesizer
BLE
Controller
XI
XO
Xtal
OSC
DC/DC
Converter
LDO
EEPROM
(BC7602 Only)
PVIN
DCDC_SW
VOUT_15
DVDD_12
SCL
SDA
WP
A[2:0]
Expose Pad : RFGND
Rev. 1.10
1
May 19, 2017
BC7601/BC7602
Pin Assignment
DC_TEST
VDDLO_15
XI
XO
DVDD_12
NC
IIC_SDA
EE_WP
DFT
SPI_CS/UR_CTS
SPI_CLK/UR_RTS
SPI_MOSI/UR_RXD
SPI_MISO/UR_TXD
NC
PDN
PVIN
1
2
32 31 30 29 28 27 26 25
24
23
3
22
4
21
BC7601
5
20
32 QFN-A
6
19
7
18
8
17
9 10 11 12 13 14 15 16
RFGND
RFIO
VDDRF_15
VDDIF_15
RFGND
IIC_CLK
NC
RST_N
RFGND
VDD
NC
NC
NC
NC
A0
A1
A2
VSS
46 45 44 4342 414039 38 37 3635 34 33
1
32
2
31
3
30
4
29
BC7602
5
28
46 QFN-A
27
6
7
26
25
8
24
9
10111213 1415 16171819 202122 23
RFGND
RFIO
VDDRF_15
VDDIF_15
RFGND
NC
NC
SPI_CS/UR_CTS
SPI_CLK/UR_RTS
SPI_MOSI/UR_RXD
SPI_MISO/UR_TXD
SPI_INT
PDN
NC
STATE
INT_EXT
WAKEUP
SPI-UR_N
SPI_INT
VOUT_15
DCDC_SW
NC
RST_N
STATE
INT_EXT
WAKEUP
SPI-UR_N
NC
PVIN
DCDC_SW
VOUT_15
NC
SDA
SCL
NC
WP
IIC_CLK
EE_WP
IIC_SDA
DVDD_12
XO
XI
VDDLO_15
DC_TEST
VDDRF_15
RFGND
Rev. 1.10
2
May 19, 2017
BC7601/BC7602
Pin Description
BC7601
Name
DFT
SPI_CS/UR_CTS
SPI_CLK/UR_RTS
SPI_MOSI/UR_RXD
SPI_MISO/UR_TXD
NC
PDN
PVIN
NC
DCDC_SW
VOUT_15
SPI_INT
SPI-UR_N
WAKEUP
INT_EXT
STATE
RST_N
NC
IIC_CLK
RFGND
VDDIF_15
VDDRF_15
RFIO
RFGND
DC_TEST
VDDLO_15
XI
XO
DVDD_12
NC
IIC_SDA
EE_WP
RFGND
No
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
EP
Type
DI
DI
DI
DI
DO
—
DI
P
—
P
P
DO
DI
DI
DO
DO
DI
—
Description
For normal operation connect to RFGND.
SPI CS or UART CTS; selected by SPI-UR_N during the power-on period
SPI CLK or UART RTS; selected by SPI-UR_N during the power-on period
SPI MOSI or UART RXD; selected by SPI-UR_N during the power-on period
SPI MISO or UART TXD; selected by SPI-UR_N during the power-on period
No Connection – connect to RFGND
Power down control pin
When low the device enters the Power down mode
Power-supply; 2.2V~3.6V
No Connection – connect to RFGND
Switching Output – connect to the switching end of the inductor
1.5V power output
SPI interrupt request when SPI mode is selected
SPI/UART mode select pin during the power-on period
1: SPI pins selected
0: UART pins selected
Wake-up pin
Enters the Sleep Mode when low
External Interrupt
IC state pin indicator
1: Operating mode
0: Sleep mode
Hardware reset, active low
No Connection – connect to RFGND
Connect to external host or EEPROM SCL pin.
DIO IIC_CLK pin is baud rate selection when UART mode is selected. Where
0: 9600bps, 1: 115200bps.
P
P
P
AIO
P
AO
P
AI
AO
P
—
DO
P
RF Power Ground
Analog power for IF section – connect to VOUT_15
Analog power for RF section – connect to VOUT_15
RF input or output
RF Power Ground
RF function test pin
Analog power for RF section, connect to VOUT_15
Crystal oscillator input
Crystal oscillator output
1.2V internal digital power – connect
0.1μF capacitor to RFGND
No Connection – connect to RFGND
Connect to external host or EEPROM WP pin
Exposed Pad on package lower side. Internally connected to RFGND. Solder
this exposed pad to a PCB pad that uses multiple ground vias to provide heat
transfer out of the device into the PCB ground planes. These multiple ground
vias are also required to achieve the noted RF performance.
DIO Connect to external host or EEPROM SDA pin
Legend: AI=Analog Input; AO=Analog Output; AIO=Analog In/out;
DI=Digital Input; DO=Digital Output; DIO=Digital In/Out; P=Power
Rev. 1.10
3
May 19, 2017
BC7601/BC7602
BC7602
Name
VDD
NC
NC
NC
NC
A0
A1
A2
VSS
NC
PDN
SPI_INT
SPI_MISO/UR_TXD
SPI_MOSI/UR_RXD
SPI_CLK/UR_RTS
SPI_CS/UR_CTS
NC
NC
RFGND
VDDIF_15
VDDRF_15
RFIO
RFGND
VDDRF_15
DC_TEST
VDDLO_15
XI
XO
DVDD_12
IIC_SDA
EE_WP
IIC_CLK
RST_N
STATE
INT_EXT
WAKEUP
SPI-UR_N
NC
PVIN
DCDC_SW
VOUT_15
NC
SDA
Rev. 1.10
Pin
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
Type
P
—
—
—
—
DI
DI
DI
P
—
DI
DO
DO
DI
DI
DI
—
—
P
P
P
AIO
P
P
AO
P
AI
AO
P
Description
EEPROM power supply; 1.8V~3.6V
No Connection – connect to RFGND
No Connection – connect to RFGND
No Connection – connect to RFGND
No Connection – connect to RFGND
EEPROM address A0 input
EEPROM address A1 input
EEPROM address A2 input
EEPROM Digital ground - connect to RFGND
No Connection - connect to RFGND
Power down control pin
When low the device enters the Power down mode
SPI interrupt request when SPI mode is selected
SPI MISO or UART TXD; selected by SPI-UR_N during the power-on period
SPI MOSI or UART RXD; selected by SPI-UR_N during the power-on period
SPI CLK or UART RTS; selected by SPI-UR_N during the power-on period
SPI CS or UART CTS; selected by SPI-UR_N during the power-on period
No Connection – connect to RFGND
No Connection – connect to RFGND
RF Power Ground
Analog power for IF section – connect to VOUT_15
Analog power for RF section – connect to VOUT_15
RF input or output
RF Power Ground
Analog power for RF section – connect to VOUT_15
RF function test pin
Analog power for RF section – connect to VOUT_15
Crystal oscillator input
Crystal oscillator output
1.2V internal digital power – connect
0.1μF capacitor to RFGND
DIO Externally connected to SDA pin
DIO Externally connected to WP pin
DO
DI
DO
DO
DI
DI
—
P
P
P
—
Externally connected to SCL pin
Hardware reset input, active low
IC state pin indicator
1: Operating mode
0: Sleep mode
External Interrupt
Wake-up pin
Enters the Sleep Mode when low
SPI/UART mode select pin during the power-on period
1: SPI pins selected
0: UART pins selected
No Connection – connect to RFGND
Power-supply; 2.2V~3.6V
Switching Output - connect to the switching end of the inductor
1.5V power output
No Connection – connect to RFGND
DIO EEPROM SDA
4
May 19, 2017
BC7601/BC7602
Name
SCL
NC
WP
Pin
44
45
46
Type
DI
—
DI
EEPROM SCL
No Connection – connect to RFGND
EEPROM WP
Exposed Pad on the lower side of the package. Internally connected to
RFGND. Solder this exposed pad to a PCB pad that uses multiple ground
vias to provide heat transfer out of the device into the PCB ground planes.
These multiple ground vias are also required to achieve the noted RF
performance.
Description
RFGND
EP
P
Legend: AI=Analog Input; AO=Analog Output; AIO=Analog In/out;
DI=Digital Input; DO=Digital Output; DIO=Digital In/Out; P=Power
Absolute Maximum Ratings
Supply Voltage ..........................
V
IN
-0.3V to V
IN
+4.3V
.
Input Voltage .............................
V
IN
-0.3V to V
IN
+0.3V
.
Storage Temperature ..........................
-50°C to 125°C
Operating Temperature ............................0°C to 70°C
Note: These are stress ratings only. Stresses exceeding the range specified under “Absolute Maximum Ratings”
may cause substantial damage to the device. Functional operation of this device at other conditions beyond
those listed in the specification is not implied and prolonged exposure to extreme conditions may affect
device reliability.
D.C. Characteristics
Symbol
V
IN
V
IH
V
IL
I
IH
I
IL
C
I
V
OH
V
OL
I
OZ
I
RX
I
TX
I
SLEEP
I
ACT
I
PDN
Digital Inputs
High level input voltage
Low level input voltage
High level input current
Low level input current
Input capacitance
High level output voltage
Low level output voltage
High impedance output current
Rx mode
TX mode, 0 dBm output power
Idle mode when MCU sleep
Idle mode when MCU active
Power down
I
OH
= 1mA
I
OL
= 1mA
—
—
—
—
—
—
—
—
—
—
—
0.7 × V
IN
—
—
—
—
V
IN
-0.5
—
—
—
—
—
—
—
—
—
10
10
5
—
—
—
14.5
9
13
2
280
—
0.2 × V
IN
—
—
—
—
0.5
1
—
—
20
—
360
V
V
μA
μA
pF
V
V
μA
mA
mA
uA
mA
nA
Parameter
Power supply voltage
(
*
)
Test Conditions
—
Min.
2.2
(
*
)
Typ.
3.3
Max.
3.6
Unit
V
Digital Outputs
Supply current (Ta=25°C, V
IN
=3.3V, unless otherwise specified)
Note: If the BC760x device is operating under the condition where V
IN
<2.2V, the LDO mode must be selected.
However this will consume more power.
Rev. 1.10
5
May 19, 2017
