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CA41Y104Z016T

Ceramic Capacitor, Ceramic, 16V, Y5V, -82/+22ppm/Cel TC, 0.1uF, 1206

器件类别:无源元件    电容器   

厂商名称:台湾佳邦(INPAQ)

厂商官网:http://www.inpaq.com.tw/

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器件参数
参数名称
属性值
Objectid
1216144020
包装说明
, 1206
Reach Compliance Code
compliant
ECCN代码
EAR99
电容
0.1 µF
电容器类型
CERAMIC CAPACITOR
介电材料
CERAMIC
高度
0.82 mm
长度
3.2 mm
制造商序列号
CA41Y(16V)
负容差
20%
端子数量
2
封装形式
SMT
包装方法
TR
正容差
80%
额定(直流)电压(URdc)
16 V
系列
CA41Y(16V)
尺寸代码
1206
温度特性代码
Y5V
温度系数
22/-82% ppm/°C
宽度
1.6 mm
文档预览
Multilayer Capacitor Array
RoHS
CA41 Series
Features
1.Cost down solution in SMD and Material.
2.Compact size for 4 capacitors in one package (8P4C) .
3.Multilayer block structure provide high reliability.
4.Excellent solderability with plating electrode.
Applications
Applications for I/O port for MB/NB (RS232, 1284, PS2, USB,…), Panel link circuit (TFT-LCD monitor & Panel),
decoupling bypass circuit for IC, and Signal termination etc.
Part Number
CA41 N
(1) (2)
100 K 050 T
(3) (4) (5) (6)
(4)Capacitance tolerance
Code
J
K
M
Z
Capacitance
Tolerance
±5%
±10%
±20%
+80% / -20%
(5)Rated Voltage
Code
050
025
016
Rated
Voltage(V)
50
25
16
(1)Product
CA41: MLCC Array
(2)Temperature Coefficient
N=NPO : 0±30(ppm / °C)
X=X7R : 0±15%
Y=Y5V : 22%~85%
(3) Capacitance Value
ex:100=10x10
0
→10pF
104=10x10
4
→100000pF
(6)Package Type
T = Reel
B = Bulk
Construction & Dimensions
STRUCTURE
SIZE
L
W
T
BW
B
A
1206
3.20 ± 0.15
1.60 ± 0.15
0.82 ± 0.10
0.40 ± 0.10
0.35 ± 0.15
0.80 ± 0.10
Unit: mm
INPAQ Technology Co.,Ltd.
Page1
2005.August Rev.
:A0
Multilayer Capacitor Array
RoHS
CA41 Series
Specifications
1.Capacitance range
Temperature
characteristics
Capacitance(pF)
10
15
22
33
47
56
68
82
100
120
150
180
220
330
470
1,000
10,000
100,000
NPO
X7R
Y5V
2.Capacitance Temperature Characteristic
Characteristic
NPO
X7R
Y5V
Temperature
Coefficient
0 ± 30 (ppm/°C)
±15%
+22%~-85%
These symmetrical tolerance apply to 2 point
measurement of temperature coefficient :
One at 25°C and another at 85°C
(C1-C2)/C1
C1: Capacitance At 25°C
C2: Capacitance At 85°C
3. Solderability
More than 95% of the terminal surface is to be soldered
newly, so metal part does not come out or dissolve.
Solder Temperature
Dipping
Dip Time
Solder
Flux
Preheat
235±5°C
10 to 15 mm Depth
5 ± 0.5 sec.
H63A
Rosin
At 80~120 °C For 10~30sec.
Package
Standard packing quantity:4,000pcs/Reel
INPAQ Technology Co.,Ltd.
Page2
2005.August Rev.
:A0
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