Amphenol Aerospace adds CTF-10G-1 to the CTF (Copper to Fiber) Media
Converter Product Family. This product line is rugged, flexible, and affordable
with many options available.
CTF-10G-1 is an integrated hybrid connector and media converter that couples
high speed copper technology with M29504 fiber technology. Now you can
transfer high speed data seamlessly from copper to fiber and fiber to copper.
CONTACT US:
Jared Sibrava
E-mail: jsibrava@amphenol-aao.com
Phone: 607-643-1845
1
Call 800-678-0141 or visit us at www.amphenol-aerospace.com
AMPHENOL INTEGRATED ELECTRONIC
PRODUCTS RUGGEDIZATION DESIGN
PDS-242-1
Overview
Amphenol integrated electronic products are designed and manufactured to our Ruggedization guidelines listed below. These guidelines
ensure years of reliable operation in harsh environment applications where extreme operating temperatures, shock, vibration and
corrosive atmospheres are regularly experienced
Temperature
• Operating Temperature - Thermal Cycles between -40°C and 85°C while device is operating
• Temperature is measured at chassis housing or card edge
• Storage Temperature - Thermal Cycles between -55°C and 125°C
Humidity
• Operating Humidity – Humidity cycle between 0-100% non-condensing humidity while device is operating
• Storage Humidity – Humidity cycle between 0-100% condensing humidity
Sealing
• Sealing can be optionally provided at the MIL-DTL-38999 interface with up to 10-5 cc/sec performance
Fluids Susceptibility
• MIL-DTL-38999 receptacle interface per EIA-364-10E
Vibration & Shock
• Sine Vibration – 10 g Peak, 5-2,000Hz
-Based on a sine sweep duration of 10 minutes per axis in each of three mutually perpendicular axes. May be
displacement limited from 5 to 44 Hz, depending on specific test.
• Random Vibration - 0.005@5Hz, 0.1@15Hz, 0.1@2,000Hz
-60 minutes per axis, in each of three mutually perpendicular axes.
• 40 G Peak Shock Cycle
-Three hits in each axis, both directions, ½ sine and terminal-peak saw tooth, Total 36 hits.
Altitude
• -1,500 to 60,000 ft Altitude Testing w/ Rapid Depressurization
Electromagnetic Compatibility
• Designed to comply with MIL-STD-461E
Printed Circuit Board Assemblies
• Conformal Coat
-Amphenol performs Conformal Coating to both sides of printed circuit board assemblies using HUMISEAL IB31
in accordance with IPC-610, Class 3.
• Printed Circuit Board Rigidity
-Amphenol printed circuit boards are fabricated in accordance with IPC-6012, Class 3.
• Printed Circuit Board Fabrication
-Amphenol printed circuit boards acceptance criteria is in accordance with IPC-610, Class 3.
Reliability Predictions (MTBF)
Amphenol can perform Mean Time Between Failure (MTBF) reliability analysis in full compliance with MIL-HDBK-217F-1 Parts Count Pre-
diction and MIL-HDBK-217F-1 Parts Stress Analysis Prediction. We can also perform reliability analyses in full compliance of ANSI/VITA
51.1 if it is required or preferred over the later method.
CONTACT US:
Jared Sibrava
E-mail: jsibrava@amphenol-aao.com
Phone: 607-643-1845
Notice: Specifications are subject to change without notice. Contact your nearest Amphenol Corporation Sales Office for the latest specifications. All statements, information and data given
herein are believed to be accurate and reliable but are presented without guarantee, warranty, or responsibility of any kind, expressed or implied. Statements or suggestions concerning pos-
sible use of our products are made without representation or warranty that any such use is free of patent infringement and are not recommendations to infringe any patent. The user should
assume that all safety measures are indicated or that other measures may not be required. Specifications are typical and may not apply to all connectors.
AMPHENOL is a registered trademark of Amphenol Corporation.
