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CM8067703014425S R358

CPU - 中央处理器 64BIT MPU

器件类别:半导体    嵌入式处理器和控制器    CPU - 中央处理器   

厂商名称:Intel(英特尔)

厂商官网:http://www.intel.com/

器件标准:

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器件参数
参数名称
属性值
厂商名称
Intel(英特尔)
产品种类
CPU - 中央处理器
产品
Desktop Processors
封装 / 箱体
FCLGA-1151
系列
Intel Core i3
核心
Intel Core i3
代码名称
Kaby Lake
处理器系列
i3-7320
嵌入式选项
Non-Embedded
内核数量
2 Core
TDP - 最大
51 W
最大时钟频率
4.1 GHz
数据总线宽度
64 bit
存储容量
64 GB
存储类型
DDR3L-1333/1600, DDR4-2133/2400
系统总线类型
DMI3
系统总线速度
8 GT/s
高速缓冲存储器
4 MB
最大工作温度
+ 100 C
封装
Tray
系列
i3-7320
封装 / 箱体尺寸
37.5 mm x 37.5 mm
安装风格
SMD/SMT
CPU配置 - 最大
1 Configuration
支持ECC存储器
Non-Supported
Intel超线程技术
With HT Technology
Intel虚拟化技术 - VT
With VT
光刻工艺技术
14 nm
支持的显示器数量
3 Display
存储器通道数量
2 Channel
PCI Express通道数量
16 Lane
QPI链接数量
0
线程数量
4 Thread
工作电源电压
1.35 V
PCIe配置
1x16, 2x8, 1x8 + 2x4
PCIe修订版
Revision 3.0
工厂包装数量
1
文档预览
7th Generation Intel
®
Processor
Families for S Platforms
and Intel
®
Core™ X-Series Processor Family
Datasheet, Volume 1 of 2
Supporting 7th Generation Intel
®
Core™ Processor Families, Intel
®
Pentium
®
Processors and Intel
®
Celeron
®
Processors Family for
S Platforms Intel
®
Celeron
®
Processors and Intel
®
Core™ X-Series
Processor Platforms, formerly known as Kaby Lake
December 2018
Revision 003
Document Number: 335195-003
You may not use or facilitate the use of this document in connection with any infringement or other legal analysis concerning Intel
products described herein. You agree to grant Intel a non-exclusive, royalty-free license to any patent claim thereafter drafted
which includes subject matter disclosed herein.
No license (express or implied, by estoppel or otherwise) to any intellectual property rights is granted by this document.
Intel technologies' features and benefits depend on system configuration and may require enabled hardware, software or service
activation. Performance varies depending on system configuration.
No computer system can be absolutely secure.
Check with
your system manufacturer or retailer or learn more at intel.com.
Intel technologies may require enabled hardware, specific software, or services activation. Check with your system manufacturer
or retailer.
The products described may contain design defects or errors known as errata which may cause the product to deviate from
published specifications. Current characterized errata are available on request.
Intel disclaims all express and implied warranties, including without limitation, the implied warranties of merchantability, fitness for
a particular purpose, and non-infringement, as well as any warranty arising from course of performance, course of dealing, or
usage in trade.
All information provided here is subject to change without notice. Contact your Intel representative to obtain the latest Intel
product specifications and roadmaps
Copies of documents which have an order number and are referenced in this document may be obtained by calling 1-800-548-
4725 or visit www.intel.com/design/literature.htm. No computer system can be absolutely secure.
Intel, Core, Celeron, SpeedStep, Pentium, VTune, and the Intel logo are trademarks of Intel Corporation in the U.S. and/or other
countries.
*Other names and brands may be claimed as the property of others.
Copyright © 2018, Intel Corporation. All rights reserved.
2
Datasheet, Volume 1 of 2
Contents
1
Introduction
............................................................................................................ 11
1.1
Supported Technologies ..................................................................................... 13
1.2
Power Management Support ............................................................................... 13
1.2.1 Processor Core Power Management........................................................... 13
1.2.2 System Power Management ..................................................................... 13
1.2.3 Memory Controller Power Management...................................................... 14
1.2.4 Processor Graphics Power Management ..................................................... 14
1.2.4.1 Memory Power Savings Technologies ........................................... 14
1.2.4.2 Display Power Savings Technologies ............................................ 14
1.2.4.3 Graphics Core Power Savings Technologies................................... 14
1.3
Thermal Management Support ............................................................................ 14
1.4
Package Support ............................................................................................... 15
1.5
Processor Testability .......................................................................................... 15
1.6
Operating Systems Support................................................................................ 15
Terminology ..................................................................................................... 15
1.7
Related Documents ........................................................................................... 17
1.8
Interfaces................................................................................................................
19
2.1
System Memory Interface .................................................................................. 19
2.1.1 System Memory Technology Supported ..................................................... 19
2.1.1.1 DDR3L/-RS Supported Memory Modules and Devices ..................... 20
2.1.1.2 DDR4 Supported Memory Modules and Devices............................. 21
2.1.2 System Memory Timing Support............................................................... 22
2.1.3 System Memory Organization Modes......................................................... 22
2.1.4 System Memory Frequency...................................................................... 23
2.1.5 Technology Enhancements of Intel
®
Fast Memory Access (Intel
®
FMA).......... 24
2.1.6 Data Scrambling .................................................................................... 24
2.1.7 DDR I/O Interleaving .............................................................................. 24
2.1.8 Data Swapping ...................................................................................... 26
2.1.9 DRAM Clock Generation........................................................................... 26
2.1.10 DRAM Reference Voltage Generation ......................................................... 26
2.1.11 Data Swizzling ....................................................................................... 26
2.2
PCI Express* Graphics Interface (PEG)................................................................. 26
2.2.1 PCI Express* Support ............................................................................. 26
2.2.2 PCI Express* Architecture ....................................................................... 28
2.2.3 PCI Express* Configuration Mechanism ..................................................... 29
2.2.4 PCI Express* Equalization Methodology ..................................................... 29
2.3
Direct Media Interface (DMI)............................................................................... 30
2.3.1 DMI Error Flow....................................................................................... 30
2.3.2 DMI Link Down ...................................................................................... 30
2.4
Processor Graphics ............................................................................................ 30
2.4.1
2.4.2
API Support (Windows*) ......................................................................... 31
Media Support (Intel
®
QuickSync & Clear Video Technology HD) .................. 31
2.4.2.1 Hardware Accelerated Video Decode............................................ 31
2.4.2.2 Hardware Accelerated Video Encode ............................................ 32
2.4.2.3 Hardware Accelerated Video Processing ....................................... 33
2.4.2.4 Hardware Accelerated Transcoding .............................................. 33
Camera Pipe Support .............................................................................. 33
Switchable/Hybrid Graphics ..................................................................... 34
Gen 9 LP Video Analytics ......................................................................... 34
Gen 9 LP (9th Generation Low Power) Block Diagram .................................. 35
2
2.4.3
2.4.4
2.4.5
2.4.6
Datasheet, Volume 1 of 2
3
2.5
2.6
3
2.4.7 GT2 Graphic Frequency ...........................................................................35
Display Interfaces ..............................................................................................36
2.5.1 DisplayPort* ..........................................................................................39
2.5.2 High-Definition Multimedia Interface (HDMI*).............................................40
2.5.3 Digital Video Interface (DVI) ....................................................................41
2.5.4 embedded DisplayPort* (eDP*) ................................................................41
2.5.5 Integrated Audio ....................................................................................41
2.5.6 Multiple Display Configurations (Dual Channel DDR) ....................................42
2.5.7 Multiple Display Configurations (Single Channel DDR) ..................................43
2.5.8 High-bandwidth Digital Content Protection (HDCP) ......................................43
2.5.9 Display Link Data Rate Support ................................................................44
2.5.10 Display Bit Per Pixel (BPP) Support............................................................45
2.5.11 Display Resolution per Link Width .............................................................45
Platform Environmental Control Interface (PECI) ....................................................45
2.6.1 PECI Bus Architecture..............................................................................46
Technologies............................................................................................................48
3.1
Intel
®
Virtualization Technology (Intel
®
VT) ..........................................................48
3.1.1 Intel
®
Virtualization Technology (Intel
®
VT) for IA-32, Intel
®
64 and Intel
®
Architecture (Intel
®
VT-X) .......................................................................48
3.1.2 Intel
®
Virtualization Technology (Intel
®
VT) for Directed I/O (Intel
®
VT-d).....50
3.2
Security Technologies.........................................................................................53
3.2.1 Intel
®
Trusted Execution Technology (Intel
®
TXT) .......................................53
3.2.2 Intel
®
Advanced Encryption Standard New Instructions (Intel
®
AES-NI) .........54
3.2.3 PCLMULQDQ (Perform Carry-Less Multiplication Quad word) Instruction .........54
3.2.4 Intel
®
Secure Key ...................................................................................54
3.2.5 Execute Disable Bit .................................................................................55
3.2.6 Boot Guard Technology ...........................................................................55
3.2.7 Intel
®
Supervisor Mode Execution Protection (SMEP) ...................................55
3.2.8 Intel
®
Supervisor Mode Access Protection (SMAP) .......................................55
3.2.9 Intel
®
Memory Protection Extensions (Intel
®
MPX)......................................56
3.2.10 Intel
®
Software Guard Extensions (Intel
®
SGX) ..........................................56
3.2.11 Intel
®
Virtualization Technology (Intel
®
VT) for Directed I/O (Intel
®
VT-d).....57
3.3
Power and Performance Technologies ...................................................................57
3.3.1 Intel
®
Hyper-Threading Technology (Intel
®
HT Technology) .........................57
3.3.2 Intel
®
Turbo Boost Technology 2.0............................................................57
3.3.2.1 Intel
®
Turbo Boost Technology 2.0 Frequency ...............................57
3.3.3 Intel
®
Advanced Vector Extensions 2 (Intel
®
AVX2) ....................................58
3.3.4 Intel
®
64 Architecture x2APIC ..................................................................58
3.3.5 Power Aware Interrupt Routing (PAIR).......................................................59
3.3.6 Intel
®
Transactional Synchronization Extensions (Intel
®
TSX-NI) ..................60
3.4
Debug Technologies ...........................................................................................60
3.4.1 Intel
®
Processor Trace ............................................................................60
Power Management
.................................................................................................61
4.1
Advanced Configuration and Power Interface (ACPI) States Supported ......................63
4.2
Processor IA Core Power Management ..................................................................65
4.2.1 OS/HW controlled P-states .......................................................................65
4.2.1.1 Enhanced Intel
®
SpeedStep
®
Technology .....................................65
4.2.1.2 Intel
®
Speed Shift Technology ....................................................66
4.2.2 Low-Power Idle States.............................................................................66
4.2.3 Requesting Low-Power Idle States ............................................................67
4.2.4 Processor IA Core C-State Rules ...............................................................67
4.2.5 Package C-States ...................................................................................69
4.2.6 Package C-States and Display Resolutions..................................................71
4.3
Integrated Memory Controller (IMC) Power Management.........................................73
4
4
Datasheet, Volume 1 of 2
4.4
4.5
4.6
4.7
5
Disabling Unused System Memory Outputs ................................................ 73
DRAM Power Management and Initialization ............................................... 73
4.3.2.1 Initialization Role of CKE ............................................................ 74
4.3.2.2 Conditional Self-Refresh ............................................................ 74
4.3.2.3 Dynamic Power-Down................................................................ 75
4.3.2.4 DRAM I/O Power Management .................................................... 75
4.3.3 DDR Electrical Power Gating (EPG) ........................................................... 75
4.3.4 Power Training....................................................................................... 76
PCI Express* Power Management ........................................................................ 76
Direct Media Interface (DMI) Power Management .................................................. 76
Processor Graphics Power Management ................................................................ 77
4.6.1 Memory Power Savings Technologies ........................................................ 77
4.6.1.1 Intel
®
Rapid Memory Power Management (Intel
®
RMPM) ............... 77
4.6.1.2 Intel
®
Smart 2D Display Technology (Intel
®
S2DDT) ..................... 77
4.6.2 Display Power Savings Technologies ......................................................... 77
4.6.2.1 Intel
®
(Seamless & Static) Display Refresh Rate
Switching (DRRS) with eDP* Port ................................................ 77
4.6.2.2 Intel
®
Automatic Display Brightness ............................................ 77
4.6.2.3 Smooth Brightness.................................................................... 78
4.6.2.4 Intel
®
Display Power Saving Technology (Intel
®
DPST) 6.0 ............ 78
4.6.2.5 Panel Self-Refresh 2 (PSR 2) ...................................................... 78
4.6.2.6 Low-Power Single Pipe (LPSP) .................................................... 78
4.6.3 Processor Graphics Core Power Savings Technologies.................................. 79
4.6.3.1 Intel
®
Graphics Dynamic Frequency ............................................ 79
4.6.3.2 Intel
®
Graphics Render Standby Technology (Intel
®
GRST) ............ 79
4.6.3.3 Dynamic FPS (DFPS) ................................................................. 79
Voltage Optimization ......................................................................................... 79
4.3.1
4.3.2
Thermal Management
.............................................................................................. 80
5.1
Processor Thermal Management .......................................................................... 80
5.1.1 Thermal Considerations........................................................................... 80
5.1.2 Intel
®
Turbo Boost Technology 2.0 Power Monitoring .................................. 81
5.1.3 Intel
®
Turbo Boost Technology 2.0 Power Control ....................................... 81
5.1.3.1 Package Power Control .............................................................. 81
5.1.3.2 Platform Power Control .............................................................. 82
5.1.3.3 Turbo Time Parameter (Tau) ...................................................... 83
5.1.4 Configurable TDP (cTDP) and Low-Power Mode........................................... 83
5.1.4.1 Configurable TDP ...................................................................... 83
5.1.4.2 Low-Power Mode ...................................................................... 84
5.1.5 Thermal Management Features ................................................................ 84
5.1.5.1 Adaptive Thermal Monitor .......................................................... 84
5.1.5.2 Digital Thermal Sensor .............................................................. 87
5.1.5.3 PROCHOT# Signal..................................................................... 87
5.1.5.4 Bi-Directional PROCHOT# .......................................................... 88
5.1.5.5 Voltage Regulator Protection using PROCHOT# ............................. 88
5.1.5.6 Thermal Solution Design and PROCHOT# Behavior ........................ 88
5.1.5.7 Low-Power States and PROCHOT# Behavior ................................. 89
5.1.5.8 THERMTRIP# Signal .................................................................. 89
5.1.5.9 Critical Temperature Detection ................................................... 89
5.1.5.10 On-Demand Mode ..................................................................... 89
5.1.5.11 MSR Based On-Demand Mode..................................................... 89
5.1.5.12 I/O Emulation-Based On-Demand Mode ....................................... 90
5.1.6 Intel
®
Memory Thermal Management ........................................................ 90
5.1.7 Scenario Design Power (SDP)................................................................... 90
5.2
Thermal and Power Specifications........................................................................ 91
5.2.1 S-Processor Line Thermal and Power Specifications..................................... 92
5.2.1.1 Thermal Profile for PCG 2015D Processor ..................................... 95
5.2.1.2 Thermal Profile for PCG 2015C Processor ..................................... 96
Datasheet, Volume 1 of 2
5
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