首页 > 器件类别 > 嵌入式处理器和控制器 > 微控制器和处理器

D32F403RET6

ARM® Cortex®-M4 32-bit MCU, Max Speed (MHz): 168; Memory (Bytes) Flash: 512K; Memory (Bytes) SRAM: 96K; I/O: up to 51; Timer GPTM (16bit): 8; Timer Advanced TM (16bit): 2; Timer Basic TM (16bit): 2; Timer WDG: 2; Timer RTC: 1; Connectivity I2C: 2; Connectivity SPI: 3; Connectivity USB 2 FS: OTG; Connectivity I2S: 2; Analog Interface 12bit ADC Units (CHs): 3(16); Analog Interface 12bit DAC Units: 2; Package: LQFP64

器件类别:嵌入式处理器和控制器    微控制器和处理器   

厂商名称:兆易创新(GigaDevice)

厂商官网:http://www.gigadevice.com

下载文档
器件参数
参数名称
属性值
零件包装代码
LQFP64
Reach Compliance Code
unknown
Base Number Matches
1
Max Speed (MHz)
168
Memory (Bytes) Flash
512K
Memory (Bytes) SRAM
96K
I/O
up to 51
Timer GPTM (32bit)
Timer GPTM (16bit)
8
Timer Advanced TM (16bit)
2
Timer Basic TM (16bit)
2
Timer SysTick (24bit)
Timer WDG
2
Timer RTC
1
Connectivity USART
Connectivity I2C
2
Connectivity SPI
3
Connectivity USB 2 FS
OTG
Connectivity I2S
2
Connectivity Comp
Connectivity OP-AMP
Analog Interface 12bit ADC Units (CHs)
3(16)
Analog Interface 12bit DAC Units
2
Package
LQFP64
文档预览
GigaDevice Semiconductor Inc.
GD32F403xx
ARM
®
Cortex
®
-M4 32-bit MCU
Datasheet
GD32F403xx
Table of Contents
List of Figures
............................................................................................................................. 3
List of Tables
............................................................................................................................... 4
1
2
2.1
2.2
2.3
2.4
2.5
2.6
General description
......................................................................................................... 5
Device overview
............................................................................................................... 6
Device information
.............................................................................................................................. 6
Block diagram
...................................................................................................................................... 8
Pinouts and pin assignment
.............................................................................................................. 9
Memory map
...................................................................................................................................... 13
Clock tree
........................................................................................................................................... 17
Pin definitions
.................................................................................................................................... 18
3
3.1
3.2
3.3
3.4
3.5
3.6
3.7
3.8
3.9
3.10
3.11
3.12
3.13
3.14
3.15
3.16
3.17
3.18
3.19
3.20
3.21
Functional description
.................................................................................................. 26
ARM
®
Cortex
®
-M4 core
.................................................................................................................... 26
On-chip memory
................................................................................................................................ 27
Clock, reset and supply management
........................................................................................... 27
Boot modes
........................................................................................................................................ 28
Power saving modes
........................................................................................................................ 28
Analog to digital converter (ADC)
................................................................................................... 29
Digital to analog converter (DAC)
................................................................................................... 29
DMA
.................................................................................................................................................... 30
General-purpose inputs/outputs (GPIOs)
...................................................................................... 30
Timers and PWM generation
........................................................................................................... 31
Real time clock (RTC)
...................................................................................................................... 32
Inter-integrated circuit (I2C)
............................................................................................................. 32
Serial peripheral interface (SPI)
...................................................................................................... 33
Universal synchronous asynchronous receiver transmitter (USART)
....................................... 33
Inter-IC sound (I2S)
.......................................................................................................................... 33
Secure digital input and output card interface (SDIO)
................................................................. 34
Universal serial bus on-the-go full-speed (USB OTG FS)
.......................................................... 34
Controller area network (CAN)
........................................................................................................ 34
External memory controller (EXMC)
.............................................................................................. 35
Debug mode
...................................................................................................................................... 35
Package and operation temperature
.............................................................................................. 35
4
4.1
4.2
4.3
4.4
4.5
Electrical characteristics
.............................................................................................. 36
Absolute maximum ratings
.............................................................................................................. 36
Recommended DC characteristics
................................................................................................. 36
Power consumption
.......................................................................................................................... 37
EMC characteristics
.......................................................................................................................... 38
Power supply supervisor characteristics
....................................................................................... 39
1
/
54
GD32F403xx
4.6
4.7
4.8
4.9
4.10
4.11
4.12
4.13
4.14
4.15
4.16
Electrical sensitivity...........................................................................................................................
39
External clock characteristics
.......................................................................................................... 40
Internal clock characteristics
........................................................................................................... 41
PLL characteristics
........................................................................................................................... 42
Memory characteristics
.................................................................................................................... 43
GPIO characteristics
......................................................................................................................... 44
ADC characteristics
.......................................................................................................................... 45
DAC characteristics
.......................................................................................................................... 47
SPI characteristics
............................................................................................................................ 48
I2C characteristics
............................................................................................................................ 48
USART characteristics
..................................................................................................................... 48
5
5.1
5.2
Package information
..................................................................................................... 49
LQFP package outline dimensions
................................................................................................ 49
BGA package outline dimensions
.................................................................................................. 51
6
7
Ordering Information
..................................................................................................... 52
Revision History
............................................................................................................. 53
2
/
54
GD32F403xx
List of Figures
Figure 1. GD32F403xx block diagram
...................................................................................................................... 8
Figure 2. GD32F403Zx LQFP144 pinouts
............................................................................................................... 9
Figure 3. GD32F403Vx LQFP100 pinouts
............................................................................................................. 10
Figure 4. GD32F403Rx LQFP64 pinouts
............................................................................................................... 11
Figure 5. GD32F403Vx BGA100 pinouts
............................................................................................................... 12
Figure 6. GD32F403xx memory map
..................................................................................................................... 13
Figure 7. GD32F403xx clock tree
............................................................................................................................ 17
Figure 8. LQFP package outline
.............................................................................................................................. 49
Figure 9. BGA package outline
................................................................................................................................ 51
3
/
54
GD32F403xx
List of Tables
Table 1. GD32F403xx devices features and peripheral list
................................................................................... 6
Table 2. GD32F403xx pin definitions
...................................................................................................................... 18
Table 3. Absolute maximum ratings
........................................................................................................................ 36
Table 4. DC operating conditions
............................................................................................................................ 36
Table 5. Power consumption characteristics
......................................................................................................... 37
Table 6. EMS characteristics
................................................................................................................................... 38
Table 7. EMI characteristics
..................................................................................................................................... 38
Table 8. Power supply supervisor characteristics
................................................................................................. 39
Table 9. ESD characteristics
.................................................................................................................................... 39
Table 10. Static latch-up characteristics
................................................................................................................ 39
Table 11. High speed external clock (HXTAL) generated from a crystal/ceramic characteristics..................
40
Table 12. Low speed external clock (LXTAL) generated from a crystal/ceramic characteristics
................... 40
Table 13. High speed internal clock (IRC8M) characteristics
.............................................................................. 41
Table 14. High speed internal clock (IRC48M) characteristics
........................................................................... 41
Table 15. Low speed internal clock (IRC32K) characteristics
............................................................................. 42
Table 16. PLL characteristics
................................................................................................................................... 42
Table 17. PLL2/3 characteristics
............................................................................................................................. 42
Table 18. Flash memory characteristics
................................................................................................................. 43
Table 19. I/O port characteristics
............................................................................................................................. 44
Table 20. ADC characteristics
.................................................................................................................................. 45
Table 21. ADC R
AIN max
for f
ADC
=40MHz
................................................................................................................. 45
Table 22. ADC dynamic accuracy at f
ADC
= 30 MHz
............................................................................................. 46
Table 23. ADC dynamic accuracy at f
ADC
= 30 MHz
............................................................................................. 46
Table 24. ADC dynamic accuracy at f
ADC
= 36 MHz
............................................................................................. 46
Table 25. ADC dynamic accuracy at f
ADC
= 40 MHz
............................................................................................. 46
Table 26. ADC static accuracy at f
ADC
= 15 MHz
.................................................................................................. 46
Table 27. DAC characteristics
................................................................................................................................. 47
Table 28. SPI characteristics
.................................................................................................................................... 48
Table 29. I2C characteristics
.................................................................................................................................... 48
Table 30. USART characteristics
............................................................................................................................ 48
Table 31. LQFP package dimensions
..................................................................................................................... 50
Table 32. BGA package dimensions
....................................................................................................................... 51
Table 33. Part ordering code for GD32F403xx devices
....................................................................................... 52
Table 34. Revision history.........................................................................................................................................
53
4
/
54
查看更多>