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DSR1MW

直流反向耐压(Vr):1kV 平均整流电流(Io):1A 正向压降(Vf):1.1V @ 1A

器件类别:分立半导体    通用二极管   

厂商名称:时科(SHIKUES)

厂商官网:http://www.shike.tw

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器件参数
参数名称
属性值
直流反向耐压(Vr)
1kV
平均整流电流(Io)
1A
正向压降(Vf)
1.1V @ 1A
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DSR1AW THRU DSR1MW
Surface Mount General Purpose Silicon Rectifiers
Reverse Voltage - 50 to 1000 V
Forward Current - 1 A
PINNING
PIN
1
2
DESCRIPTION
Cathode
Anode
1
2
Top View
Weight:17mg,0.0006 oz
Simplified outline SOD-123FL and symbol
Maximum Ratings and Electrical characteristics
Ratings at 25
°C
ambient temperature unless otherwise specified. Single phase half-wave 60 Hz, resistive or inductive load
for capacitive load current derate by 20 %.
Parameter
Maximum Repetitive Peak Reverse Voltage
Symbols
DSR1AW DSR1BW DSR1DW DSR1GW DSR1JW DSR1KW DSR1MW
Units
V
RRM
V
RMS
V
DC
I
F(AV)
50
35
50
100
70
100
200
140
200
400
280
400
600
420
600
800
560
800
1000
700
1000
V
V
V
Maximum RMS voltage
Maximum DC Blocking Voltage
Maximum Average Forward Rectified Current
at Ta = 65
°C
Peak Forward Surge Current 8.3 ms Single Half
Sine Wave Superimposed on Rated Load
(JEDEC Method)
Maximum Instantaneous Forward Voltage at 1 A
Maximum DC Reverse Current
at Rated DC Blocking Voltage
Typical Junction Capacitance
1)
1
A
I
FSM
30
A
V
F
1.1
5
50
V
Ta = 25
°C
Ta =125
°C
I
R
μA
C
j
R
θJA
T
j
, T
stg
4
180
-55 ~ +150
pF
°C/W
°C
Typical Thermal Resistance
2)
Operating and Storage Temperature Range
1)
Measured at 1 MHz and applied reverse voltage of 4 V D.C
2)
Thermal resistance from junction to ambient at 0.375" (9.5 mm) lead length, P.C.B. mounted
REV.08
1 of 4
DSR1AW THRU DSR1MW
Fig.1 Forward Current Derating Curve
Instaneous Reverse Current (
μ
A)
1.2
1.0
0.8
0.6
0.4
0.2
0.0
25
50
75
100
125
150
175
100
T
J
=150
°C
Fig.2 Typical Instaneous Reverse
Characteristics
Average Forward Current (A)
10
T
J
=125
°C
T
J
=100
°C
1.0
T
J
=75
°C
T
J
=50
°C
0.1
T
J
=25
°C
0.01
0
200
400
600
800
Ambient Temperature (°C)
Instaneous Reverse Voltage (V)
Fig.3 Typical Forward Characteristic
1.0
12
Fig.4 Typical Junction Capacitance
Instaneous Forward Current (A)
Junction Capacitance ( pF)
10
8
6
4
2
0
0
5
10
15
20
25
30
35
40
0.5
°
C
°
C
=1
=1
T
J
0.2
0.1
0.6
0.7
T
J
0.8
T
J
=
0.9
2 5
°
C
50
00
1.0
1.1
Instaneous Forward Voltage (V)
Reverse Voltage (V)
Fig.5 Maximum Non-Repetitive Peak
Forward Surage Current
Peak Forward Surage Current (A)
35
30
25
20
15
10
05
00
1
10
100
8.3 ms Single Half Sine Wave
(JEDEC Method)
Number of Cycles
REV.08
2 of 4
DSR1AW THRU DSR1MW
PACKAGE OUTLINE
Plastic surface mounted package; 2 leads
SOD123FL
∠ALL
ROUND
∠ALL
ROUND
C
H
E
A
VM
A
E
D
A
g
g
pad
Top View
Bottom View
UNIT
mm
max
min
mil
max
min
A
1.1
0.9
43
35
C
0.20
0.12
7.9
4.7
D
2.9
2.6
114
102
E
1.9
1.7
75
67
e
1.1
0.8
43
31
g
0.9
0.7
35
28
pad
E
e
H
E
3.8
3.5
150
138
The recommended mounting pad size
1.2
(47)
2.0
(79)
1.2
(47)
REV.08
3 of 4
1.2
(47)
Unit: mm
(mil)
DSR1AW THRU DSR1MW
Recommended condition of flow soldering
300
Preliminary Heating
265°C
Soldering
Cooling (in air)
Temperature of Soldering (°C)
250
245°C
200
150
120°C
100
100°C
50
0
2 to 5 min
more than 1 min
less than 10s
Recommended condition of reflow soldering
300
Peak Temperature
245 to 260°C, 10s max.
Reflow Heating Rate
1 to 5°C / s
Temperature of Soldering (°C)
250
200
150
100
50
Pre Heating Rate
1 to 5°C / s
Preliminary Heating
130 to 170°C,
50 to 120s
Soldering
230°C
20 to 30s
Cooling
more than 60s
0
2 times max.
Recommended peak temperature is over 245
°C.
If peak temperature is below 24 5 ° C , y ou may adjust the
f ollowing parameters; time length of peak temperature (longer), time length of soldering (longer), thickness
of solder paste (thicker)
Condition of hand soldering
Temperature: 370°C
Time: 3s max.
Times: one time
Remark:
Lead free solder paste (96.5Sn/3.0Ag/0.5Cu)
REV.08
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