2.0*1.25*1.1mm Infrared SMD CHIP LED
E6C0805PRAC1UDA
Features:
●Long operating life
●Low Power Consumption
●Wide Viewing Angle
●Low voltage DC operated
●RoHS Compliant
●Moisture sensitivity level: 3
Application:
●PCB mounted infared senstor
●Infrared wireless data transmission
●Optoelectronic switch
●Smoke detector
Part Number
E6C0805PRAC1UDA
Dice Material
GaAlAs
Emitted Color
Infrared
Lens Color
Water Clear
Electro-Optical Characteristics
(Ta=25℃, @20mA)
Parameter
Radiant Intensity
Radiation Bandwidth
Capacitance
Forward Voltage
Peak Wavelength
Viewing Angle
Reverse Current
Symbol
IE
△λ
C
VF
λP
2θ1/2
IR
Min.
1.0
-
-
1.30
-
-
-
Typ.
-
50
90
-
880
120
-
Max.
3.0
-
-
1.60
-
-
10
Unit
mW/sr
nm
pF
v
nm
deg
uA
Absolute Maximum Ratings
(Ta=25℃)
Parameter
Peak Forward Current(1/10 Duty Cycle, 0.1ms Pulse Width)
Forward Current
Reverse Voltage
Electrostatic Discharge
Operating Temperature Range
Storage Temperature Range
Reflow Soldering
Symbol
IPF
IF
VR
ESD
Topr
Tstg
Tsld
Max.
Unit
100
mA
30
mA
5
v
2000
v
o
-40to+90
C
o
-40to+90
C
260℃for 10secs
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2.0*1.25*1.1mm Infrared SMD CHIP LED
E6C0805PRAC1UDA
Optical & Electrical Characteristics
Relative Luminous lntensity(%)
100
75
50
25
0
Spectrum Distribution
750
800
850
900
Wavelength (nm)
950
1000
1050
Forward Current vs.Forward Voltage
Forward Current vs.Ambient Temperature
50
Forward Current (mA)
Forward Current (mA)
50
40
50
20
10
0 0
20
40
60
80
100
40
30
20
10
0
0.8 1.0
1.2
1.4
1.6
1.8
Forward Voltage (V )-volts
Radiant lntensity vs.Forward Currenr
Ambient Temperature
2.5
30°
Radiant lntensity at 20mA
20° 10° 0°
2.0
1.5
1.0
0.5
0
0
10
20
30
40
50
40°
50°
60°
70°
80°
90°
0.6 0.4 0.2
1.0
0.9
0.8
0.7
0
0.1 0.3 0.5
Forward Currenr(mA)
Radiation Diagram
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2.0*1.25*1.1mm Infrared SMD CHIP LED
E6C0805PRAC1UDA
Reliability Test Items And Conditions
Test Items
Thermal Shock
Temperature And Humidity
Cyclic
High Temperature Storage
Low Temperature Storage
High Temperature High
Humidity Storage
High Temperature Life Test
Life Test
Resistance to Sodering
Heat
Reference
MIL-STD-202G
JEITA ED-4701 200
203
JEITA ED -4071 200
201
JEITA ED -4071 200
202
JEITA ED -4071 100
103
JESD22-A108D
JESD22-A108D
GB/T 4937,Ⅱ，
2.2&2.3
Test Conditions
Time
-40℃（30min）
100
-100℃
（30min）
Cycles
-10℃~65℃；
10cycles
0%~90%RH
Ta=100℃
Ta=-40℃
Ta=60℃；
RH=90%
Ta=80℃
Ta=25℃
IF=20mA
Tsol*=(240±5)
℃10secs
1000H
1000H
1000H
1000H
1000H
2 times
Quantity
22
22
22
22
22
22
22
22
Criterion
0/22
0/22
0/22
0/22
0/22
0/22
0/22
0/22
Criteria For Judging Damage
Test Items
Forward Voltage
Recerse Current
Luminous Intensity
Resistance to
Soldering Heat
Symbol
V
F
I
R
IV
-
Test Conditions
I
F
=I
FT
V
R
=5V
I
F
=I
FT
-
Criteria For Judging Damage
Initial Data±10%
I
R
≤10uA
Average I
V
degradation≤30%；Single LED I
V
degradation≤50%
Meterial without internal cracks,no meterial
between stripped,no deaded light
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2.0*1.25*1.1mm Infrared SMD CHIP LED
E6C0805PRAC1UDA
Product size (Unit:mm)
MARK
NOTES：
1.
All dimensions are in millimeters (inches)
2.
Tolerances are
0.2mm
(0.008inch) unless otherwise noted
Recommended Soldering Pad Design (Unit:mm)
Taping and package Spec
●T Specification:3,000pcs Per Reel
ape
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2.0*1.25*1.1mm Infrared SMD CHIP LED
E6C0805PRAC1UDA
Packaging
LabelStyle
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