ES1AG
THRU
ES1JG
Reverse Voltage - 50 to
600
Volts
Forward Current - 1.0 Ampere
SURFACE MOUNT
SUPER
FAST
RECOVERY
RECTIFIER
Features
The plastic package carries Underwriters Laboratory
Flammability Classification 94V-0
For surface mounted applications
Low reverse leakage
Built-in strain relief,ideal for automated
placement High forward surge current capability
High temperature soldering guaranteed:
250°C/10 seconds at terminals
Glass passivated chip junction
0.096(2.42)
0.078(1.98)
0.067 (1.70)
0.051 (1.30)
DO-214AC/SMA
0.110(2.80)
0.094(2.40)
0.177(4.50)
0.157(3.99)
0.012(0.305)
0.006(0.152)
Mechanical Data
Case
: JEDEC DO-214AC/SMA Molded plastic body
Terminals
: Solder plated, solderable per MIL-STD-750,Method 2026
Polarity
: Polarity symbol marking on body
Mounting Position
: Any
Weight
: 0.002 ounce, 0.055 grams
0.060(1.52)
0.030(0.76)
0.008(0.203)MAX.
0.208(5.30)
0.188(4.80)
Dimensions in inches and (millimeters)
Maximum Ratings And Electrical Characteristics
Ratings at 25°C ambient temperature unlss otherwise specified.
Single phase half-wave 60Hz,resistive or inductive load,for capacitive load current derate by 20%.
Parameter
Marking Code
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current
at TL=55℃
Peak forward surge current
8.3ms single half sine-wave
superimposed onrated load (JEDEC Method)
Maximum instantaneous forward voltage at 1.0A
Maximum DC reverse current
at rated DCblocking voltage
Maximum reverse recovery time
T
A
=25℃
T
A
=125℃
(NOTE 1)
SYMBOLS
ES1AG ES1BG ES1CG ES1DG
ES1EG ES1GG ES1JG
MDD
ES1A
MDD
ES1B
MDD
ES1C
MDD
ES1D
MDD
ES1E
MDD
ES1G
MDD
ES1J
UNITS
V
V
V
A
A
V
RMM
V
RMS
V
DC
I
(AV)
50
35
50
100
70
100
150
105
150
200
140
200
1.0
300
210
300
400
280
400
600
420
600
I
FSM
V
F
I
R
trr
30
0.95
5.0
100.0
35
15.0
75.0
-55 to +150
1.25
1.7
V
μA
ns
pF
℃/W
℃
Typical junction capacitance (NOTE 2)
Typical thermal resistance (NOTE 3)
Operating junction and storage temperature range
C
J
R
JA
T
J
,
T
STG
Note:1.Reverse
recovery condition IF=0.5A,IR=1.0A,Irr=0.25A
2.P.C.B. mounted with 1.0x1.0”(2.54x2.54cm) copper pad areas.
3.Measured at 1MHz and applied reverse voltage of 4.0V D.C.
4.The typical data above is for referenceonly.
DN:T19704A0
https://www.microdiode.com
Rev:2019A0
Page :1
ES1AG THRU ES1JG
Reverse Voltage - 50 to 600 Volts
Forward Current - 1.0 Ampere
Ratings And Characteristic Curves
50 ohm
Noninductive
10 ohm
Noninductive
+0.5
t
rr
+
-
25Vdc
approx
D.U.T
PULSE
GENERATOR
Note 2
0
-0.25
1 ohm
NonInductive
OSCILLOSCOPE
Note 1
Note：1.Rise Time = 7ns, max.
Input Impedance = 1megohm,22pF.
2. Ries Time =10ns, max.
Source Impedance = 50 ohms.
Fig.2 Maximum Average Forward Current Rating
Average Forward Current (A)
1.2
-1.0
10ns/div
Set time Base for 10ns/div
Fig.3 Typical Reverse Characteristics
300
I
R
- Reverse Current (μA)
1.0
0.8
0.6
0.4
0.2
Single phase half wave resistive or inductive
100
T
J
=125°C
10
T
J
=75°C
1.0
T
J
=25°C
0.0
25
50
75
100
125
150
175
0.1
0
20
40
60
80
100
Case Temperature (°C)
Fig.4 Typical Forward Characteristics
Instaneous Forward Current (A)
10
T
J
=25°C
% of PIV.VOLTS
Fig.5 Typical Junction Capacitance
30
Junction Capacitance (pF)
1.0
ES1A~ES1D
25
20
15
10
05
T
J
=25°C
f = 1.0MHz
V
sig
= 50mV
p-p
0.1
1
10
100
0.1
ES1E/ES1G
ES1J
0.01
0.001
0
0.5
1.0
1.5
2.0
2.5
Instaneous Forward Voltage (V)
Fig.6 Maximum Non-Repetitive Peak
Forward Surge Current
Peak Forward Surge Current (A)
35
30
25
20
15
10
05
00
1
8.3 ms Single Half Sine Wave
(JEDEC Method)
Reverse Voltage (V)
10
100
Number of Cycles
The curve above is for reference only.
https://www.microdiode.com
Rev:2019A0
Page :2
ES1AG THRU ES1JG
Reverse Voltage - 50 to 600 Volts
Forward Current - 1.0 Ampere
Packing information
P
0
P
1
d
E
F
B
W
unit:mm
Item
Carrier width
Carrier length
Carrier depth
Sprocket hole
13" Reel outside diameter
13" Reel inner diameter
7" Reel outside diameter
7" Reel inner diameter
Feed hole diameter
Sprocket hole position
Punch hole position
Punch hole pitch
Sprocket hole pitch
Embossment center
Overall tape thickness
Tape width
Reel width
Symbol
A
B
C
d
D
D
1
D
D
1
D
2
E
F
P
P
0
P
1
T
W
W
1
Tolerance
0.1
0.1
0.1
0.05
2.0
min
2.0
min
0.5
0.1
0.1
0.1
0.1
0.1
0.1
0.3
1.0
SMA
2.80
5.33
2.36
1.50
330.00
50.00
178.00
62.00
13.00
1.75
5.50
4.00
4.00
2.00
0.28
12.00
18.00
A
P
T
C
D
D
2
D
1
W
1
Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above.
Reel packing
PACKAGE
SMA
SMA
SMA
REEL SIZE
7"
REEL
(pcs)
2,000
COMPONENT
SPACING
(m/m)
4.0
4.0
4.0
BOX
(pcs)
INNER
BOX
(m/m)
183*155*183
REEL
DIA,
(m/m)
178
330
330
CARTON
SIZE
(m/m)
382*356*392
CARTON
(pcs)
160,000
APPROX.
GROSS WEIGHT
(kg)
16.0
4,000
10,000
15,000
11"
13"
5,000
7,500
290*290*38
335*335*38
310*310*360
350*330*360
80,000
120,000
11.0
14.5
Suggested Pad Layout
Symbol
A
B
C
D
E
Unit (mm)
1.68
1.52
3.90
2.41
5.45
Unit (inch)
0.066
0.060
0.154
0.095
0.215
Important Notice and Disclaimer
Microdiode Electronics (Jiangsu) reserves the right to make changes to this document and its products and
specifications at any time without notice. Customers should obtain and confirm the latest product information and
specifications before final design,purchase or use.
Microdiode Electronics (Jiangsu) makes no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, not does Microdiode Electronics (Jiangsu) assume any liability for application
assistance or customer product design. Microdiode Electronics (Jiangsu) does not warrant or accept any liability with
products which are purchased or used for any unintended or unauthorized application.
No license is granted by implication or otherwise under any intellectual property rights of Microdiode
Electronics (Jiangsu).
Microdiode Electronics (Jiangsu) products are not authorized for use as critical components in life support
devices or systems without express written approval of Microdiode Electronics (Jiangsu).
https://www.microdiode.com
Rev:2019A0
Page :3
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