Chip Schottky Barrier Rectifier
FM120-L THRU FM1200-L
1.0A Surface Mount Schottky Barrier
Rectifiers - 20V-200V
Features
•
Batch process design, excellent power dissipation offers
•
•
•
•
•
•
•
•
•
•
better reverse leakage current and thermal resistance.
Low profile surface mounted application in order to
optimize board space.
Low power loss, high efficiency.
High current capability, l ow forward voltage drop.
High surge capability.
Guardring for overvoltage protection.
Ultra high-speed switching.
Silicon epitaxial planar chip, metal silicon junction.
Lead-free parts meet environmental standards of
MIL-STD-19500 /228
Compliant to Halogen-free.
Suffix "-AU" for Automotive.
Formosa MS
SMA-L
0.209(5.3)
0.185(4.7)
Package outline
0.012(0.3) Typ.
0.114(2.9)
0.091(2.3)
Mechanical data
•
Epoxy:UL94-V0 rated flame retardant
•
Case : Molded plastic, DO-214AC / SMA-L
•
Terminals : Solder plated, solderable per
MIL-STD-750, Method 2026
0.032(0.8) Typ.
0.080(2.0)
0.063(1.6)
0.032 (0.8) Typ.
Dimensions in inches and (millimeters)
•
Polarity : Indicated by cathode band
•
Mounting Position : Any
•
Weight : Approximated 0.05 gram
Maximum ratings and Electrical Characteristics
(AT
PARAMETER
Forward rectified current
Forward surge current
See Fig.1
CONDITIONS
T
A
=25
o
C unless otherwise noted)
Symbol
I
O
I
FSM
I
R
R
θJA
R
θJC
C
J
T
STG
-65
68
34
120
+175
MIN.
TYP.
MAX.
1.0
30
0.5
10
O
O
UNIT
A
A
8.3ms single half sine-wave (JEDEC methode)
V
R
= V
RRM
T
J
= 25 C
V
R
= V
RRM
T
J
= 100 C
Junction to ambient
Junction to case
f=1MHz and applied 4V DC reverse voltage
O
O
Reverse current
Thermal resistance
Diode junction capacitance
Storage temperature
*1
V
RRM
(V)
20
30
40
50
60
80
100
150
200
V
RMS
*2
(V)
14
21
28
35
42
56
70
105
140
mA
C/W
C/W
pF
O
C
SYMBOLS
FM120-L
FM130-L
FM140-L
FM150-L
FM160-L
FM180-L
FM1100-L
FM1150-L
FM1200-L
*3
V
R
(V)
20
30
40
50
60
80
100
150
200
*4
V
F
(V)
Operating
temperature
T
J
, (
O
C)
-55 to +125
*1 Repetitive peak reverse voltage
*2 RMS voltage
0.50
0.70
0.85
0.90
0.92
-55 to +150
*3 Continuous reverse voltage
*4 Maximum forward voltage@I
F
=1.0A
http://www.formosagr.com
TEL:886-755-27188611
FAX:886-755-27188568
Document ID
Issued Date
2008/02/10
Revised Date
2015/06/02
Revision
F
Page.
5
Page 1
DS-121618
Rating and characteristic curves (FM120-L THRU FM1200-L)
FIG.1-TYPICAL FORWARD CURRENT DERATING CURVE
AVERAGE FORWARD CURRENT,(A)
FIG.2-TYPICAL FORWARD
CHARACTERISTICS
1.2
1.0
50
INSTANTANEOUS FORWARD CURRENT,(A)
0.8
FM
0.6
0.4
0.2
0
0
20
40
60
80
10
20
~4
~6
50
0V
~1
80
1
~
50
00
0V
20
1.0
100
120
140
160
180
200
LEAD TEMPERATURE,(°C)
V
3.0
0V
FIG.3-MAXIMUM NON-REPETITIVE FORWARD
SURGE CURRENT
PEAK FORWARD SURGE CURRENT,(A)
T
J
=25 C
8.3ms Single Half
Sine Wave
JEDEC method
NUMBER OF CYCLES AT 60Hz
FIG.4-TYPICAL JUNCTION CAPACITANCE
350
300
250
200
150
100
50
0
REVERSE LEAKAGE CURRENT, (mA)
FM
12
0-
L~
FM
14
15
0-
L~
FM
12
00
0-
L
-L
T
J
=25 C
Pulse Width 300us
1% Duty Cycle
0.1
.01
.1
.3
.5
.7
.9
1.1
1.3
1.5
FORWARD VOLTAGE,(V)
FIG.5 - TYPICAL REVERSE
100
CHARACTERISTICS
20V~40V
50V~200V
10
JUNCTION CAPACITANCE,(pF)
1.0
T
J
=
100°C
0.1
T
J
=
25°C
0.01
.01
.05
.1
.5
1
5
10
50
100
0.001
0
20
40
60
80
100
REVERSE VOLTAGE,(V)
PERCENT OF RATED PEAK REVERSE VOLTAGE,(%)
http://www.formosagr.com
TEL:886-755-27188611
FAX:886-755-27188568
Document ID
Issued Date
2008/02/10
Revised Date
2015/06/02
Revision
F
Page.
5
Page 2
DS-121618
Chip Schottky Barrier Rectifier
FM120-L THRU FM1200-L
Pinning information
Pin
Pin1
Pin2
cathode
anode
Simplified outline
Formosa MS
Symbol
1
2
1
2
Marking
Type number
FM120-L
FM130-L
FM140-L
FM150-L
FM160-L
FM180-L
FM1100-L
FM1150-L
FM1200-L
Suggested solder pad layout
Marking code
SS12
SS13
SS14
SS15
SS16
SS18
S110
S115
S120
C
A
B
Dimensions in inches and (millimeters)
PACKAGE
SMA-L
A
0.110 (2.80)
B
0.059 (1.50)
C
0.110 (2.80)
http://www.formosagr.com
TEL:886-755-27188611
FAX:886-755-27188568
Document ID
Issued Date
2008/02/10
Revised Date
2015/06/02
Revision
F
Page.
5
Page 3
DS-121618
Chip Schottky Barrier Rectifier
FM120-L THRU FM1200-L
Packing information
P
0
P
1
d
E
F
B
W
Formosa MS
A
P
D
2
T
C
D
W
1
D
1
unit:mm
Item
Symbol
Tolerance
SMA-L
Carrier width
Carrier length
Carrier depth
Sprocket hole
13" Reel outside diameter
13" Reel inner diameter
7" Reel outside diameter
7" Reel inner diameter
Feed hole diameter
Sprocket hole position
Punch hole position
Punch hole pitch
Sprocket hole pitch
Embossment center
Overall tape thickness
Tape width
Reel width
A
B
C
d
D
D
1
D
D
1
D
2
E
F
P
P
0
P
1
T
W
W
1
0.1
0.1
0.1
0.1
2.0
min
2.0
min
0.5
0.1
0.1
0.1
0.1
0.1
0.1
0.3
1.0
2.90
5.50
2.10
1.50
330.00
50.00
178.00
62.00
13.00
1.75
5.50
4.00
4.00
2.00
0.23
12.00
18.00
Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above.
http://www.formosagr.com
TEL:886-755-27188611
FAX:886-755-27188568
Document ID
Issued Date
2008/02/10
Revised Date
2015/06/02
Revision
F
Page.
5
Page 4
DS-121618
Chip Schottky Barrier Rectifier
FM120-L THRU FM1200-L
Reel packing
PACKAGE
REEL SIZE
REEL
(pcs)
2,000
2,000
COMPONENT
SPACING
(m/m)
4.0
4.0
BOX
(pcs)
20,000
10,000
INNER
BOX
(m/m)
183*155*183
180*180*80
REEL
DIA,
(m/m)
178
178
CARTON
SIZE
(m/m)
382*356*392
440*410*220
Formosa MS
CARTON
(pcs)
160,000
100,000
APPROX.
GROSS WEIGHT
(kg)
15.5
13.0
7"
SMA-L
7"
Suggested thermal profiles for soldering processes
1.Storage environment: Temperature=5
o
C ~40
o
C Humidity=55%±25%
2.Reflow soldering of surface-mount devices
Tp
TP
Ramp-up
Critical Zone
TL to TP
TL
Tsmax
TL
Tsmin
Temperature
tS
Preheat
Ramp-down
25
t25
o
C to Peak
Time
3.Reflow soldering
Profile Feature
Average ramp-up rate(T
L
to T
P
)
Preheat
-Temperature Min(Tsmin)
-Temperature Max(Tsmax)
-Time(min to max)(t
s
)
Tsmax to T
L
-Ramp-upRate
Time maintained above:
-Temperature(T
L
)
-Time(t
L
)
Peak Temperature(T
P
)
Time within 5 C of actual Peak
Temperature(t
P
)
Ramp-down Rate
Time 25 C to Peak Temperature
o
o
Soldering Condition
<3 C /sec
150 C
o
200 C
60~120sec
<3 C /sec
217 C
60~260sec
255 C- 0/ + 5 C
10~30sec
<6 C /sec
<6minutes
o
o
o
o
o
o
o
http://www.formosagr.com
TEL:886-755-27188611
FAX:886-755-27188568
Document ID
Issued Date
2008/02/10
Revised Date
2015/06/02
Revision
F
Page.
5
Page 5
DS-121618
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