泰州福声电子科技有限公司
-----
电声产品专业制造商
FUSHENG ELECTRONICS------Acoustic Components Professional Manufacturer
SPECIFICATION OF PRODUCT
承 认 书
CUSTOMER:
DESCRIPTION：
FUSHENG
P/N:
Piezo Buzzer
FSR-1407TP-5V
CUSTOMER P/N:
DATE：
CUSTOMER
APPROVER
Yunqing Wu
CHECKER
Bing Yan
泰州福声电子科技有限公司
地址:江苏省泰州市海陵区凤凰西路98 号
电话：0086-523-86219066 传真：0086-523-81601108
邮箱:
sales@electronic-tech.cn
½址：www.tzfsdz.com
FSR-1407TP
泰州福声电子科技有限公司
-----
电声产品专业制造商
FUSHENG ELECTRONICS------Acoustic Components Professional Manufacturer
1.
SPECIFICATION
规格
No.
1
2
3
4
5
Item
Oscillation Frequency
Operating Voltage
Rated Voltage
Current Consumption
Sound Pressure Level
Electrostatic Capacity
Operating Temperature
Storage Temperature
Dimension
Weight (MAX)
Housing Material
Unit
Hz
Vp-p
Vp-p
mA
dB
nF
℃
℃
mm
gram
Specification
4000±500
1 ~ 30
5
MAX. 5
MIN. 85
12±30%
-20 ~ +80
-30 ~ +80
14 x H 7.0
2.5
PBT
Condition
square wave
at Rated Voltage
at 10cm at Rated Voltage
at 1000Hz
6
7
8
9
10
11
See appearance drawing
2.
APPEARANCE DRAWING
尺寸图
Tol : ± 0.3
Unit: mm
FSR-1407TP
泰州福声电子科技有限公司
-----
电声产品专业制造商
FUSHENG ELECTRONICS------Acoustic Components Professional Manufacturer
3.
TESTING METHOD
测量方式
Standard Measurement conditions
Temperature:25±2℃ Humidity:45-65%
Acoustic Characteristics:
Theoscillationfrequency, currentconsumptionand sound pressureare measured by themeasuring instruments
shown below.
In the measuring test, buzzer is placed as follows:
FSR-1407TP
泰州福声电子科技有限公司
-----
电声产品专业制造商
FUSHENG ELECTRONICS------Acoustic Components Professional Manufacturer
4.
TypicalFrequency ResponseCurve
5.
Soldering Condition
(1)
Recommendablereflow soldering condition is as follows
(Reflow solderingis twice)
Note:It is requested that reflow soldering should be executed
after heat of product goes down to normal.
Heat resistant line
(Used when heat resistantreliability test is performed)
(2)Manualsoldering
Manual soldering temperature 350
ºC
within 5 sec.
FSR-1407TP
泰州福声电子科技有限公司
-----
电声产品专业制造商
FUSHENG ELECTRONICS------Acoustic Components Professional Manufacturer
6. RELIABILITY TEST
NO.
1
ITEM
High Temperature
Test (Storage)
Low Temperature
Test (Storage)
TEST CONDITION AND REQUIREMENT
Afterbeingplacedin a chamberwith 80 2ºC for96 hoursand then
beingplacedin normalconditionfor2 hours.
Allowablevariationof SPLaftertest: 10dB.
AfterbeingPlacedin a chamberwith-30 2ºC for96 hoursand then
beingplacedin normalconditionfor2 hours.
Allowablevariationof SPLaftertest: 10dB.
AfterbeingPlacedin a chamberwith90-95%R.H.at 40 2ºC for96
hoursandthen beingplacedin normalconditionfor2 hours.
Allowablevariationof SPLaftertest: 10dB.
The part shall be subjected to 5 cycles. One cycle shall be consist of：
+70ºC
+25ºC
+25ºC
2
3
Humidity Test
4
Temperature Cycle
Test
-
20ºC
5
Drop Test
6
Vibration Test
7
Solderability
Test
Terminal Strength
Pulling Test
:
:
:
:
8
Allowablevariationof SPLaftertest: 10dB.
Dropon a hardwood boardof 4cm thick,anydirections,6 times,
at theheightof75cm.
Allowablevariationof SPLaftertest: 10dB.
Afterbeingappliedvibrationof amplitudeof 1.5mmwith 10 to 55 Hz
band of vibration frequency to each of 3 perpendicular directions for
2hours .
Allowablevariationof SPLaftertest: 10dB.
Lead terminals are immersed in rosin for 5 seconds and then
immersedin solderbathof +300 5ºC for3 1seconds .
90%min.leadterminalsshallbewet with solder
(Excepttheedgeofterminals).
Theforceof 9.8N(1.0kg)is appliedto each terminalin axialdirectionfor
10seconds.
No visible damage and cutting off.
a) Temperature: +5~ +35℃
a)
温度
: +5 ~ +35℃
a) Temperature : +25 ± 2℃
a)
温度
: +25 ± 2℃
b) Humidity : 45-85%
b)
湿度
: 45-85%
b) Humidity : 60-70%
b)
湿度
: 60-70%
c) Pressure : 860-1060mbar
c)
气压
: 860-1060mbar
c) Pressure : 860-1060mbar
c)
气压
: 860-1060mbar
FSR-1407TP
TEST CONDITION.
Standard Test Condition
一般测试条件
Judgment TestCondition
争议时测试条件
电子工程世界
Microchip MCU
